Corning Precision Materials Co.

Asan, South Korea

Corning Precision Materials Co.

Asan, South Korea
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Patent
Corning Precision Materials Co. | Date: 2017-07-12

The present invention relates to a substrate for a display device and, more particularly, to a substrate for a display device, which not only has excellent durability, but can also minimize the occurrence of color shift when applied to a display device. To this end, the present invention provides a substrate for a display device, which is characterized by including: a substrate; a hard coat film formed on the substrate and formed of AlON; and a multilayer film formed between the substrate and the hard coat film, and formed of a coating film having a first refractive index and a coating film having a second refractive index, which are repetitively stacked in sequence.


Patent
Corning Precision Materials Co. | Date: 2017-08-02

The present invention relates to a flexible substrate and a method of manufacturing same and, more particularly, to a flexible substrate and a method of manufacturing same, the flexible substrate having high flexibility, high transparency, and high conductivity, so as to be able to improve the quality of a flexible display device to which it is applied. To this end, the present invention provides a flexible substrate and a method of manufacturing same, the flexible substrate characterized by comprising: a flexible base material; an ITO thin film formed on the flexible base material; and a plurality of nano particles discontinuously distributed within the ITO thin film.


The present invention relates to a light extraction substrate for an organic light emitting element and, more specifically, to a light extraction substrate for an organic light emitting element that can enhance the light extraction efficiency of the organic light emitting element by optimizing a stack structure that can maximize scattering efficiency, and an organic light emitting element comprising the same. To this end, the present invention provides a light extraction substrate for an organic light emitting element and an organic light emitting element comprising the same, the light extraction substrate comprising: a base substrate; a plurality of light scattering objects arranged on the base substrate; a matrix layer formed on the base substrate to cover the plurality of light scattering objects; and a planarization layer that is formed on the matrix layer and of which the surface makes contact with an organic light emitting element, wherein at least one of the cover matrix layer, the planarization layer, and the light scattering objects has a different index of refraction.


The present invention relates to a substrate for color conversion, a manufacturing method therefor, and a display device comprising the same and, more specifically, to a substrate for color conversion for not only securing the long-term stability of quantum dots but also exhibiting excellent color conversion efficiency, a manufacturing method therefor, and a display device comprising the same. To this end, the present invention provides a substrate for color conversion, a manufacturing method therefor, and a display device, the substrate for color conversion comprising: a thin plate glass; a coating layer for quantum dots formed on one surface of the thin plate glass; a light guide plate disposed to face the coating layer for quantum dots, a light emitting diode being disposed on the sides thereof; and a sealing material which is formed between the thin plate glass and the light guide plate and which blocks the coating layer for quantum dots from the outside.


Patent
Corning Precision Materials Co. | Date: 2017-03-22

The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional colour conversion frit heat-treatment process and cutting process after bonding between the colour conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package chatacterized in that the present invention comprises: a colour conversion frit formation step for forming a colour conversion frit in which phosphor is included on a substrate; a colour conversion frit transcription step for transcribing the colour conversion frit formed on the substrate from the substrate to a transcription film; and a colour conversion frit bonding step for bonding the colour conversion frit transcribed on the transcription film onto a light-emitting diode package.


Patent
Corning Precision Materials Co. | Date: 2017-07-26

The present invention relates to a substrate for a display device and, more particularly, to a substrate for a display device which has excellent durability and also can minimize generation of color shift when being applied to a display device. To this end, the present invention provides a substrate for a display device comprising: a base material; a first coating film formed on the base material; a second coating film which is formed on the first coating film and is formed of a material having a relatively lower refractive index than the first coating film; a third coating film which is formed on the second coating film and is formed of a material having a relatively higher refractive index than the second coating film; a forth coating film which is formed on the third coating film and is formed of a material having a relatively lower refractive index than the third coating film; and a hard coating film which is formed on the fourth coating film and is formed of AlON having a relatively higher refractive index than the forth coating film.


Patent
Corning Precision Materials Co. | Date: 2017-01-25

A protective film includes an adhesive layer containing a first synthetic resin, and a non-adhesive layer containing a second synthetic resin and micro-beads made of a polymer, the micro-beads being distributed in the second synthetic resin. The adhesive layer and the non-adhesive layer are laminated on each other.


Patent
Corning Precision Materials Co. | Date: 2016-05-11

An optoelectronic device substrate can ensure that constituent thin films of an optoelectronic device be flat and that a functional thin film formed to improve the characteristics of the optoelectronic device be structurally stable so that the functional thin film maintains its function. An optoelectronic device including the same is provided. The optoelectronic device substrate includes a base substrate and a patterned structure formed on the base substrate. A planarization layer is disposed on the patterned structure, the planarization layer being formed from a two-dimensional material.


The present invention relates to a substrate for an organic light-emitting diode, a method for manufacturing the same, and an organic light-emitting diode comprising the same, and more particularly, to a substrate for an organic light-emitting diode, the substrate having excellent productivity and manufacturing efficiency as well as an improved light extraction efficiency, a method for manufacturing the same, and an organic light-emitting diode comprising the same. To this end, the present invention provides a substrate for an organic-light emitting diode, the substrate being disposed on one side of the organic light-emitting diode from which light irradiated thereby is emitted outside, the substrate comprising: a base plate; a light-scattering layer comprising a plurality of light-scattering particles, the light-scattering layer being formed on the base plate; and a transparent conductive film formed on the light-scattering layer, wherein a part of, or all of the pores formed between the plurality of light-scattering particles are filled with metal oxides forming the transparent conductive film; a method for manufacturing the same; and an organic light-emitting diode comprising the same.


Patent
Corning Precision Materials Co. | Date: 2016-05-25

A method for manufacturing an ultrathin organic light-emitting device is provided, of which the light extraction efficiency can be improved and the thickness can be significantly reduced. The method includes the steps of coating a support with a polymeric material, coating the polymeric material with frit paste, heat-treating a resultant structure at a temperature where the polymeric material decomposes such that a frit substrate formed from the frit paste through the heat treatment is separated from the support, and forming a device layer on one surface of the frit substrate which has coated the polymeric material. The device layer includes a first electrode, an organic light-emitting layer and a second electrode which are sequentially disposed on the one surface of the frit substrate.

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