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Patent
Corning Precision Materials Co. and Samsung | Date: 2015-01-02

Provided is a method of preparing a light scattering layer including voids as a light scattering enhancer instead of metal oxide particles. Provided is also a light scattering layer including voids as a light scattering enhancer instead of metal oxide particles. Provided is also an organic electroluminescent device including the light scattering layer that includes voids as the light scattering enhancer instead of metal oxide particles.


Patent
Corning Precision Materials Co. | Date: 2015-01-05

Provided is an anti-reflection glass substrate comprising an anti-reflection layer having a predetermined thickness from the surface, the anti-reflection glass substrate being characterized in that the anti-reflection layer has at least two layers of a first layer and a second layer successively provided in the depth direction from the surface, each of the first layer and the second layer has a plurality of pores, and the porosity of the first layer is smaller than the porosity of the second layer. In addition, provided is a method for manufacturing an anti-reflection glass substrate, the method successively comprising a step of etching a glass substrate using a first etching liquid and a step of etching the glass substrate using a second etching liquid, the method being characterized in that the molarity of multivalent metal ions of the first etching liquid is larger than the molarity of multivalent metal ions of the second etching liquid. Provided is a method for manufacturing an anti-reflection glass substrate, the method successively comprising a step of etching a glass substrate using a first etching liquid and a step of etching the glass substrate using a second etching liquid, the method being characterized in that the molarity of hydroxides and fluorides of the first etching liquid is smaller than the molarity of hydroxides and fluorides of the second etching liquid.


Patent
Corning Precision Materials Co. and ZS Handling GmbH | Date: 2015-05-11

A device for gripping a substrate without contact with which the substrate can be more securely transported. In the device, a housing cap has an air inlet in the upper surface and a lower opening, the lower opening communicating with the air inlet such that air introduced through the air inlet exits through the lower opening. A contour of the lower opening in its vertical cross section is convexly rounded such that the introduced air is guided along a horizontal undersurface of the housing cap. A nozzle is disposed in an inner hollow space of the housing cap, and has an inclined surface such that the width of the nozzle gradually decreases in the direction from the undersurface of the nozzle to the upper surface of the nozzle adjacent to the air inlet. The undersurface of the nozzle is at a predetermined distance from the inner surface of the housing cap. An ultrasonic shaker applies ultrasonic vibration to the housing cap.


Patent
Corning Precision Materials Co. | Date: 2015-01-14

An apparatus for inspecting an edge portion of a substrate can inspect a defect or a chamfered width on an edge portion of a substrate. First and second right-angled prisms are disposed above and below the edge portion such that inclined surfaces thereof are directed toward the upper surface and lower surface of the edge portion. A lighting part irradiates the edge portion of the substrate with light. A photographing part is disposed adjacent to the edge portion. The photographing part takes an image of the upper surface of the edge portion from light that has passed through the first right-angled prism, an image of the lower surface of the edge portion from light that has passed through the second right-angled prism, and an image of an end surface of the edge portion.


Patent
Corning Precision Materials Co. | Date: 2015-01-08

A glass substrate protection pad and a method of manufacturing a large glass substrate protection pad able to prevent a glass substrate from being damaged. The glass substrate protection pad is to be in close contact with a glass substrate to protect the glass substrate. The glass substrate protection pad is formed of expanded polypropylene (EPP).


Patent
Corning Precision Materials Co. | Date: 2015-03-18

A protective film includes an adhesive layer containing a first synthetic resin, and a non-adhesive layer containing a second synthetic resin and micro-beads made of a polymer, the micro-beads being distributed in the second synthetic resin. The adhesive layer and the non-adhesive layer are laminated on each other.


Patent
Corning Precision Materials Co. | Date: 2016-05-11

An optoelectronic device substrate can ensure that constituent thin films of an optoelectronic device be flat and that a functional thin film formed to improve the characteristics of the optoelectronic device be structurally stable so that the functional thin film maintains its function. An optoelectronic device including the same is provided. The optoelectronic device substrate includes a base substrate and a patterned structure formed on the base substrate. A planarization layer is disposed on the patterned structure, the planarization layer being formed from a two-dimensional material.


The present invention relates to a substrate for an organic light-emitting diode, a method for manufacturing the same, and an organic light-emitting diode comprising the same, and more particularly, to a substrate for an organic light-emitting diode, the substrate having excellent productivity and manufacturing efficiency as well as an improved light extraction efficiency, a method for manufacturing the same, and an organic light-emitting diode comprising the same. To this end, the present invention provides a substrate for an organic-light emitting diode, the substrate being disposed on one side of the organic light-emitting diode from which light irradiated thereby is emitted outside, the substrate comprising: a base plate; a light-scattering layer comprising a plurality of light-scattering particles, the light-scattering layer being formed on the base plate; and a transparent conductive film formed on the light-scattering layer, wherein a part of, or all of the pores formed between the plurality of light-scattering particles are filled with metal oxides forming the transparent conductive film; a method for manufacturing the same; and an organic light-emitting diode comprising the same.


Patent
Corning Precision Materials Co. | Date: 2015-03-17

The present invention relates to a color-converting substrate of a light-emitting diode and a method for producing same, and more specifically to a color-converting substrate of a light-emitting diode capable of completely protecting the quantum dots (QD) supported in the interior from the exterior as hermetic sealing is possible, and a method for producing the color-converting substrate. To that end, provided are a color-conversion substrate of a light-emitting diode and a method for producing the color-conversion substrate, the color-conversion substrate of a light-emitting diode comprising: a first substrate and a second substrate arranged facing each other on a light-emitting diode; a sheet, having a hole, arranged in between the first and second substrates; QDs filling the hole; and sealing material disposed in between the first substrate and the lower surface of the sheet and in between the second substrate the upper surface of the sheet, wherein the sealing material is disposed along the edge of the hole, and the sheet is made of a substance allowing laser sealing of the sealing material, first substrate and second substrate.


Patent
Corning Precision Materials Co. | Date: 2016-05-25

A method for manufacturing an ultrathin organic light-emitting device is provided, of which the light extraction efficiency can be improved and the thickness can be significantly reduced. The method includes the steps of coating a support with a polymeric material, coating the polymeric material with frit paste, heat-treating a resultant structure at a temperature where the polymeric material decomposes such that a frit substrate formed from the frit paste through the heat treatment is separated from the support, and forming a device layer on one surface of the frit substrate which has coated the polymeric material. The device layer includes a first electrode, an organic light-emitting layer and a second electrode which are sequentially disposed on the one surface of the frit substrate.

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