Coriant

Munich, Germany
Munich, Germany
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A network element of a software-defined network comprises a data transfer interface (211) for receiving and transmitting data and a processing system (212) for constructing, in accordance with configuration data received from a controller system of the software-defined network, a configuration system for managing data to be forwarded. The processing system is adapted to configure a first portion of the configuration system to associate, with data received at the network element, a configuring entity-specific identifier (CEID) that identifies a configuring entity, for example an application, related to the received data. The configuring entity- specific identifier constitutes at least a part of metadata associated with the received data. Appropriate other portions of the configuration system are configured to use this metadata when determining actions to be carried out in conjunction with the received data. The configuring entity-specific identifier prevents conflicts between different configuring entities, for example applications, in the configuration system.


Patent
Coriant | Date: 2017-01-18

A Ge-on-Si photodetector constructed without doping or contacting Germanium by metal is described. Despite the simplified fabrication process, the device has responsivity of 1.24 A/W, corresponding to 99.2% quantum efficiency. Dark current is 40 nA at -4 V reverse bias. 3-dB bandwidth is 30 GHz.


A network element includes first and second multiplexers, first and second interfaces, and first and second selecting units. The multiplexers are communicatively coupled. The first interface is communicatively coupled to the first multiplexer and configured to receive multiplexed signals. The second interface is communicatively coupled to the second multiplexer and configured to receive multiplexed signals. The first selecting unit is communicatively coupled to the first and second multiplexers and configured to select between a signal received from the first multiplexer and a signal received from the second multiplexer. The second selecting unit is also communicatively coupled to the first and second multiplexers and configured to select between a signal received from the first multiplexer and a signal received from the second multiplexer.


Source-synchronous communications between networked devices can be hindered by differing clock rates and data interface formats among the devices. By implementing a plurality of clock converters, a data interface format of a transmitting device is converted to a data interface format compatible with a receiving device. The clock converters provide a clock signal based on the source-synchronous data clock, and having a phase controlled with respect to an associated data signal. As a result, data exchange between devices operating at different clock rates is made possible.


A wavelength division multiplexed optical communication system includes a plurality of optical line terminals which may be part of separate in service networks, each having a line interface and an all-optical pass-through interface including a plurality of pass-through optical ports, and each also including a plurality of local optical ports which are connectable to client equipment and an optical multiplexer/demultiplexer for multiplexing/demultiplexing optical wavelengths. The optical multiplexer/demultiplexer may include one or more stages for inputting/outputting individual wavelengths or bands of a predetermined number of wavelengths, or a combination of bands and individual wavelengths. At least one of the pass-through optical ports of an optical line terminal of one network may be connected to at least one of the pass-through optical ports of an optical line terminal of another network to form an optical path from the line interface of the optical line terminal of the one network to the line interface of the optical line terminal of the another network to form a merged network. The use of such optical line terminals allows the upgrading and merging of the separate networks while in service.


An optical modulator apparatus may include a plurality of segment drivers, each segment driver having a unique offset voltage and driving but a portion or a segment of an electro-optical modulator. A modulating electrical signal may be applied to the segment drivers via a plurality of electrical delays. Parameters of the segment drivers may be selected so as to approximate a pre-defined transfer function, which may include a linear or a non-linear transfer function.


An optical device that includes means for thermal stabilization and control is described. The optical device can be a ring resonator, or another device that requires accurate control of the phase of the optical signal. In an example involving an optical resonator, a thermal stabilization system includes a temperature sensor, a control circuit, and a heater local to the resonator. The temperature sensor can be a bandgap temperature sensor formed of a pair of matched p/n junctions biased in operation at different junction currents.


Patent
Coriant | Date: 2016-10-18

A photonic interface for an electronic circuit is disclosed. The photonic interface includes a photonic integrated circuit having a modulator and a photodetector, and an optical fiber or fibers for optical communication with another optical circuit. A modulator driver chip may be mounted directly on the photonic integrated circuit. The optical fibers may be placed in v-grooves of a fiber support, which may include at least one lithographically defined alignment feature for optical alignment to the silicon photonic circuit.


A distributed traveling-wave Mach-Zehnder modulator driver having a plurality of modulation stages that operate cooperatively (in-phase) to provide a signal suitable for use in a 100 Gb/s optical fiber transmitter at power levels that are compatible with conventional semiconductor devices and conventional semiconductor processing is described.


Patent
Coriant | Date: 2016-12-06

A heat sink for a semiconductor chip device includes cavities in a lower surface thereof for receiving electrical components on a top surface of the semiconductor chip, and a pedestal extending through an opening in the semiconductor chip for contacting electrical components on a bottom surface of the semiconductor chip. A lid may also be provided on the bottom surface of the semiconductor chip for protecting the electrical components and for heat sinking the electrical components to an adjacent device or printed circuit board.

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