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Jung S.,Convergence and Components and Materials Research Laboratory | Lee M.,Convergence and Components and Materials Research Laboratory | Moon J.-T.,Convergence and Components and Materials Research Laboratory
Proceedings - Electronic Components and Technology Conference | Year: 2010

In this paper, the design, fabrication technology, and experimental evaluation of the RF frequency performance of a new type of solder paste via filled through-wafer interconnects in silicon substrates are presented. © 2010 IEEE.

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