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Seo M.,Sungkyunkwan University | Nam E.,Components and Materials Research Laboratory | Rodwell M.,University of California at Santa Barbara
ETRI Journal | Year: 2014

Blind mismatch correction of time-interleaved analog-to-digital converters (TI-ADC) is a challenging task. We present a practical blind calibration technique for low-computation, low-complexity, and high-resolution applications. Its key features are: dramatically reduced computation; simple hardware; guaranteed parameter convergence with an arbitrary number of TI-ADC channels and most real-life input signals, with no bandwidth limitation; multiple Nyquist zone operation; and mixed-domain error correction. The proposed technique is experimentally verified by an M = 4 400 MSPS TI-ADC system. In a single-tone test, the proposed practical blind calibration technique suppressed mismatch spurs by 70 dB to 90 dB below the signal tone across the first two Nyquist zones (10 MHz to 390 MHz). A wideband signal test also confirms the proposed technique. © 2014 ETRI. Source

Lho Y.H.,Woosong University | Yang Y.-S.,Components and Materials Research Laboratory
ETRI Journal | Year: 2015

For a conventional power metal-oxide-semiconductor field-effect transistor (MOSFET), there is a trade-off between specific on-state resistance and breakdown voltage. To overcome this trade-off, a super-junction trench MOSFET (TMOSFET) structure is suggested; within this structure, the ability to sense the temperature distribution of the TMOSFET is very important since heat is generated in the junction area, thus affecting its reliability. Generally, there are two types of temperaturesensing structures - diode and resistive. In this paper, a diode-type temperature-sensing structure for a TMOSFET is designed for a brushless direct current motor with on-resistance of 96 mΩ·mm2. The temperature distribution for an ultra-low on-resistance power MOSFET has been analyzed for various bonding schemes. The multi-bonding and stripe bonding cases show a maximum temperature that is lower than that for the single-bonding case. It is shown that the metal resistance at the source area is non-negligible and should therefore be considered depending on the application for current driving capability. © 2015 ETRI. Source

An B.W.,Wearable Electronics Research Group | Hyun B.G.,Wearable Electronics Research Group | Kim S.-Y.,Wearable Electronics Research Group | Kim M.,Wearable Electronics Research Group | And 7 more authors.
Nano Letters | Year: 2014

Transparent electrodes that can maintain their electrical and optical properties stably against large mechanical deformations are essential in numerous applications of flexible and wearable electronics. In this paper, we report a comprehensive analysis of the electrical, optical, and mechanical properties of hybrid nanostructures based on graphene and metal nanotrough networks as stretchable and transparent electrodes. Compared to the single material of graphene or the nanotrough, the formation of this hybrid can improve the uniformity of sheet resistance significantly, that is, a very low sheet resistance (1 Ω/sq) with a standard deviation of less than ±0.1 Ω/sq, high transparency (91% in the visible light regime), and superb stretchability (80% in tensile strain). The successful demonstration of skin-attachable, flexible, and transparent arrays of oxide semiconductor transistors fabricated using hybrid electrodes suggests substantial promise for the next generation of electronic devices. © 2014 American Chemical Society. Source

Kwon O.K.,Components and Materials Research Laboratory | Beak Y.S.,Components and Materials Research Laboratory | Chung Y.C.,Korea Advanced Institute of Science and Technology | Park H.-M.,Dongguk University
ETRI Journal | Year: 2013

A novel integrated laser, that is, a distributed reflector laser diode integrated with an electroabsorption modulator, is proposed to improve the output efficiency, single-mode stability, and chirp. The proposed laser can be realized using the selective metalorganic vapor phase epitaxy technique (that is, control of the width of the insulating mask), and its fabrication process is almost the same as the conventional electroabsorption modulated laser (EML) process except for the asymmetric coupling coefficient structure along the cavity. For our analysis, an accurate time-domain transfer-matrix-based laser model is developed. Based on this model, we perform steady-state and large-signal analyses. The performances of the proposed laser, such as the output power, extinction ratio, and chirp, are compared with those of the EML. Under 10-Gbps NRZ modulation, we can obtain a 30% higher output power and about 50% lower chirp than the conventional EML. In particular, the simulation results show that the chirp provided by the proposed laser can appear to have a longer wavelength side at the leading edge of the pulse and a shorter wavelength side at the falling edge. © 2013 ETRI. Source

Eom Y.-S.,Components and Materials Research Laboratory | Son J.-H.,Components and Materials Research Laboratory | Jang K.-S.,Case Western Reserve University | Lee H.-S.,Components and Materials Research Laboratory | And 3 more authors.
ETRI Journal | Year: 2014

For the fine-pitch application of flip-chip bonding with semiconductor packaging, fluxing and hybrid underfills were developed. A micro-encapsulated catalyst was adopted to control the chemical reaction at room and processing temperatures. From the experiments with a differential scanning calorimetry and viscometer, the chemical reaction and viscosity changes were quantitatively characterized, and the optimum type and amount of micro-encapsulated catalyst were determined to obtain the best pot life from a commercial viewpoint. It is expected that fluxing and hybrid underfills will be applied to fine-pitch flip-chip bonding processes and be highly reliable. © 2014 ETRI. Source

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