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Zou X.,University of Electronic Science and Technology of China | Huang J.,University of Electronic Science and Technology of China | Zhao D.,University of Electronic Science and Technology of China | Chen N.,University of Electronic Science and Technology of China | And 3 more authors.
Bandaoti Guangdian/Semiconductor Optoelectronics | Year: 2014

Because of the linear superposition of temperature field, the temperature distribution of normal evenly placed chips in high-power LED module is usually unevenly presented with high core temperature. In this paper, based on theoretically analyzing the function of temperature distribution of plane heat source and the interaction of multi-heat sources, a principle of being dense inside and sparse outside to arrange the chip arrays was proposed. Optimized logarithmic and power arrangements are respectively concluded by Matlab and compared by ANSYS simulation. It is indicated that the highest temperature of the chip arranged in accordance with the optimized arrangement principles is about 5℃ lower than that of the evenly arranged chips; the variance is 56% lower than that of the evenly arranged chips. The heat dissipation improvement of unevenly arranged chip arrays is greater for the modules with narrower and thinner substrate.


Huang J.,University of Electronic Science and Technology of China | Zou X.,University of Electronic Science and Technology of China | Zhao D.,University of Electronic Science and Technology of China | Ou W.,CLED Optoelectronic Technology Co. | And 2 more authors.
Bandaoti Guangdian/Semiconductor Optoelectronics | Year: 2014

For conventional first-class reflective cups, the substrate structure is subject to the package wire bonding process, so the size of the reflective cups is small. In this paper, the optical methods for analyzing the problem of light reflected incompletely were analyzed with optical theories. The solution of locating second-class reflective cups between the chips of the LED module was proposed. Simulation study based on the optical analysis software Tracepro verified its validity. Then, a new substrate structure containing two types of reflective cups was designed. Tests show that the light extraction efficiency and the central light intensity can be improved by 23% and 38% compared with the substrate structure without reflective cups. ©, 2014, Editorial Office of Semiconductor Optoelectronics. All right reserved.


Huang J.,University of Electronic Science and Technology of China | Zou X.,University of Electronic Science and Technology of China | Liu B.,University of Electronic Science and Technology of China | Ou W.,CLED Optoelectronic Technology Co. | And 2 more authors.
Bandaoti Guangdian/Semiconductor Optoelectronics | Year: 2013

To study the dissipation performance of high-power LED module, the finite element modules were established for studying horizontal and vertical heat dissipation. The modules contain two different substrates: one with high thermal conductivity layer and another with internal high thermal conductivity heat sinks. Heat dissipation effect and the uniformity of the temperature distribution of substrate and LED chips were contrastively analyzed by finite element analysis method. At last, considering practical situations, the thickness of the high thermal conductivity layer was further optimized.

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