Pine Brook, NJ, United States
Pine Brook, NJ, United States

Chiral Photonics, Inc. is a photonics company based in Pine Brook, New Jersey, founded in 1999. The company is developing a new class of optical devices based on twisting glass optical fibers. These in-fiber devices aim to displace discrete optical elements such as lasers, filters and sensors. They benefit from optical fiber’s transmission efficiency, robustness and ease of integration.The company hopes that its manufacturing process, which is completely automated and scalable, will result, for example, in communications lasers that are fraction of the cost and three times more efficient than today’s semiconductor lasers. Chiral Photonics is also developing chirality in polymeric thin films which, for instance, would enable high quality projection displays. Wikipedia.

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Patent
Chiral Photonics, Inc | Date: 2016-12-09

Advantageously, at least one embodiment of the present disclosure comprises a polarization maintaining PROFA (PM-PROFA) coupler in which the polarization axes of the individual vanishing core waveguides thereof are oriented or aligned without the need to adjust the orientation of each individual VC waveguide.


Patent
Chiral Photonics, Inc | Date: 2016-09-21

Advantageously, at least one embodiment comprises a flexible pitch reducing optical fiber array (PROFA) coupler capable of maintaining all channels discretely with sufficiently low crosstalk, while providing enough flexibility to accommodate low profile packaging, and having increased stability with respect to environmental fluctuations, including temperature variations and mechanical shock and vibration, and that is combinable in multiple quantities thereof to form an optical multi-port input/output (IO) interface.


Patent
Chiral Photonics, Inc | Date: 2017-03-15

A multichannel optical coupler array comprises a coupler housing structure and longitudinal waveguides. At least one of the longitudinal waveguides is a vanishing core waveguide. The coupler housing structure at a proximity to a first end has one of the following cross sectional configurations: a ring surrounding the longitudinal waveguides, or a structure with holes, at least one hole containing at least one of the longitudinal waveguides.


Patent
Chiral Photonics, Inc | Date: 2016-07-07

The inventive configurable optical fiber polarization mode coupler is capable of providing a low-loss, high-coupling coefficient interface with high accuracy and easy alignment between a plurality of optical fibers (or other optical devices) with a first channel-to-channel spacing, and an optical device having a plurality of closely-spaced waveguide interfaces with a second channel-to-channel spacing, where each end of the optical fiber coupler array is configurable to have different channel-to-channel spacing, each matched to a corresponding one of the first and second channel-to-channel spacing, and that are preferably optimized for use with photonic integrated circuits, such as coupling to dense optical input/output interfaces, wafer-level testing, etc. The novel optical coupler array includes a plurality of waveguides (at least one of which may optionally be polarization maintaining), that comprises at least one gradually reduced vanishing core fiber, at least in part embedded within a common housing structure. Advantageously, at least one embodiment of the present invention comprises a physically untappable secure optical fiber link component comprising at least one optical fiber polarization mode coupler configured as a pitch reducing optical fiber array (PROFA) interconnect.


Patent
Chiral Photonics, Inc | Date: 2012-04-09

The inventive high density optical packaging header apparatus, in various embodiments thereof, provides configurable, modular, and highly versatile solutions for simultaneously connecting multiple optical fibers/waveguides to optical-fiber-based electronic systems, components, and devices, and is readily usable in a variety of applications involving highly flexible and modular connection of multiple optical fibers/waveguides assembled in a header block configuration to optical-fiber-based system/component backplanes, while providing advantageous active and passive alignment features.


Patent
Chiral Photonics, Inc | Date: 2012-01-20

The inventive configurable chiral fiber sensor is readily configurable for use in a variety of applications (such as applications involving pressure and/or temperature sensing), and which is particularly suitable for applications in which the sensing of a presence or absence of the target sensed event (e.g., specific minimum pressure or minimum temperature) is required. Advantageously, the inventive configurable chiral fiber sensor utilizes light sources, photodetectors, and related devices for sensor interrogation.


Patent
Chiral Photonics, Inc | Date: 2012-01-20

The inventive configurable chiral fiber sensor with a tip-positioned sensing element, is readily configurable for use in a variety of applications (such as applications involving pressure, temperature, and even axial twist sensing), and is particularly suitable for applications requiring highly precise and accurate sensor readings within corresponding predefined limited sensing ranges. Advantageously, the inventive configurable chiral fiber sensor with a tip-positioned sensing element, is operable to utilize a wide variety of light sources, photodetectors, and related devices for sensor interrogation.


Patent
Chiral Photonics, Inc | Date: 2012-01-20

The inventive circular chiral fiber polarizer is operable to convert linearly polarized light to circularly polarized light, may be advantageously fabricated in an in-fiber manner and to comprise desirable extinction ratio characteristics, and may also serve as an interface between a sequentially positioned polarization maintaining (PM) fiber, and a single mode (SM) fiber.


Grant
Agency: National Science Foundation | Branch: | Program: SBIR | Phase: Phase I | Award Amount: 150.00K | Year: 2012

This Small Business Innovation Research (SBIR) Phase I project will demonstrate the feasibility of a novel Pitch Reducing Optical Fiber Array (PROFA) technology to meet the demands of next-generation telecommunications, data centers and cloud computing. As signal rates increase above 10 Gb/s, designers are moving from electrical to optical lines for intra- and inter-chip communication to provide higher bandwidth density, lower power consumption and reduced transmission loss. The challenge of interfacing photonic integrated circuits (PICs) to data transport media has grown with the increased sophistication of integrated PICs. Standard optical fibers, which have an outer diameter, of 125 um need to be matched to planar waveguides with high numerical aperture spaced by approximately 30 um. Pushing this limit is critical to increasing the density of active elements on a chip, reducing overall system size, and lowering power requirements. State-of-the-art fiber connections, which utilize labor intensive v-grooves, can achieve 127 um one-dimensional spacing. There is currently no path to achieving the chip-limited density called for by the industry. In this Phase I SBIR, PROFAs will be developed that will propel optical connectivity to 30 um spacing and two-dimensional arrays with orders of magnitude higher density than is currently available. The broader impact/commercial potential of this project will be to solve a key bottleneck of connectivity between optical fibers and PICs to achieving exascale computing and high speed communications. It will accelerate the development of next-generation high performance computers by allowing the integration of more complex PICs into telecommunications equipment. This technology will thereby spur the creation of novel PICs which can truly exploit higher on-chip densities in applications that will demand hundreds of thousands of PROFAs. As photonics becomes more pervasive, moving beyond telecommunications into datacom, biomedical and a myriad of industrial and military applications, the need addressed by PROFAs for seamless integration of planar and fiber-based platforms, as well as disparate fiber interfaces, including multi-core fibers, will increase. This technology will enhance the integration of different families of materials and combine their unique strengths. The know-how developed in the course of this project will inform the development of other microformed fiber-based devices, including filters, lasers, sensors and isolators for applications ranging from monitoring nuclear radiation to early endoscopic detection of cancer. This technology is expected to enhance the competitiveness of the United States in the next generation of telecommunications and data processing equipment.


Grant
Agency: NSF | Branch: Standard Grant | Program: | Phase: | Award Amount: 150.00K | Year: 2012

This Small Business Innovation Research (SBIR) Phase I project will demonstrate the feasibility of a novel Pitch Reducing Optical Fiber Array (PROFA) technology to meet the demands of next-generation telecommunications, data centers and cloud computing. As signal rates increase above 10 Gb/s, designers are moving from electrical to optical lines for intra- and inter-chip communication to provide higher bandwidth density, lower power consumption and reduced transmission loss. The challenge of interfacing photonic integrated circuits (PICs) to data transport media has grown with the increased sophistication of integrated PICs. Standard optical fibers, which have an outer diameter, of 125 um need to be matched to planar waveguides with high numerical aperture spaced by approximately 30 um. Pushing this limit is critical to increasing the density of active elements on a chip, reducing overall system size, and lowering power requirements. State-of-the-art fiber connections, which utilize labor intensive v-grooves, can achieve 127 um one-dimensional spacing. There is currently no path to achieving the chip-limited density called for by the industry. In this Phase I SBIR, PROFAs will be developed that will propel optical connectivity to 30 um spacing and two-dimensional arrays with orders of magnitude higher density than is currently available.

The broader impact/commercial potential of this project will be to solve a key bottleneck of connectivity between optical fibers and PICs to achieving exascale computing and high speed communications. It will accelerate the development of next-generation high performance computers by allowing the integration of more complex PICs into telecommunications equipment. This technology will thereby spur the creation of novel PICs which can truly exploit higher on-chip densities in applications that will demand hundreds of thousands of PROFAs. As photonics becomes more pervasive, moving beyond telecommunications into datacom, biomedical and a myriad of industrial and military applications, the need addressed by PROFAs for seamless integration of planar and fiber-based platforms, as well as disparate fiber interfaces, including multi-core fibers, will increase. This technology will enhance the integration of different families of materials and combine their unique strengths. The know-how developed in the course of this project will inform the development of other microformed fiber-based devices, including filters, lasers, sensors and isolators for applications ranging from monitoring nuclear radiation to early endoscopic detection of cancer. This technology is expected to enhance the competitiveness of the United States in the next generation of telecommunications and data processing equipment.

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