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You M.-Y.,China Electronics Technology Group Corporation | Meng G.,Shanghai JiaoTong University
IEEE Transactions on Reliability

This paper presents a framework of similarity-based residual life prediction (SbRLP) approaches in which historical samples that fail and do not fail (due to preventive maintenance or suspension) are both utilized. Within the framework, two solutions are proposed to estimate the lifetimes of the preventively maintained or suspended historical samples, and to utilize their degradation histories in a SbRLP approach. An extensive numerical investigation verifies the superiority of the proposed framework using Solution A over the corresponding classical SbRLP approach. In addition, the investigation results reveal that the proposed framework using Solution B is ineffective when failed historical samples are limited, but its performance improves fast with the increment of available failed historical samples. The findings in the numerical investigation suggest the use of the proposed framework using Solution A when failed historical samples are limited, and the use of the proposed framework using Solution B when abundant failed historical samples are available. © 1963-2012 IEEE. Source

Li Y.,China Electronics Technology Group Corporation
Yadian Yu Shengguang/Piezoelectrics and Acoustooptics

The stable platform has wide applications and plays an important role. The stability condition and gyroscope are the key factors for the stable control of the inertially stablized platform. The inertial stability control conditions of the inertially stablized platform have been proposed through the establishment of the inertial coordinate system and the detailed analysis of the carrier movement. For the dual-axis stable platform system, the four mounting positions of gyro and the corresponding angular velocity compensation method have been studied in detail. Through analyzing the inertial stable characteristics, the optimal gyro installment position has been given. The gyro drift and the platform stability accuracy have been discussed. Some suggestions for the platform system design were proposed. Source

Hu X.,Nanchang University | Li K.,Nanchang University | Min Z.,China Electronics Technology Group Corporation
Journal of Alloys and Compounds

Sn-0.7 wt.%Cu-0.7 wt.%Bi (Sn0.7Cu0.7Bi) lead-free solder alloy was directionally solidified undergoing temperature gradient of 12 K/mm and growth rate (V) varying from 5 to 100 μm/s. The microstructure was characterized along the growth direction and the present experimental results included the inter-fiber spacing (λ), fiber diameter (d), ultimate tensile strength (UTS), yield tensile strength (YS) and elongation to fracture (EL) at room temperature. The aim is to examine the effects of growth rate on both microstructure and mechanical properties. The microstructure observation shows that the microstructure consists of β-Sn matrix and rod-like Cu 6Sn5 intermetallics compounds (IMCs). For a constant temperature gradient (12 K/mm), it is found that the inter-Cu6Sn 5 fiber spacing and fiber diameter are mainly controlled by the growth rate (V), and both of them decrease with increased growth rate. The tensile results show that the UTS and YS initially increase with increased growth rate which ranges from 5 to 60 μm/s, then decrease with further increased growth rate, such as 100 μm/s. In addition, the EL is between 25% and 32.5% as the growth rate is ranging from 5 to 60 μm/s, and achieves to the highest value (41%) with the growth rate of 100 μm/s. That is due to the formation of finer Cu6Sn5 in the solders. Finally, the fracture surfaces of the solders are examined. © 2013 Elsevier B.V. All rights reserved. Source

China Electronics Technology Group Corporation | Date: 2013-07-04

A method for manufacturing a graphene transistor based on self-aligning technology, the method comprising: on a substrate (

China Electronics Technology Group Corporation | Date: 2012-05-04

The present disclosure provides a method for manufacturing a particle source comprising: placing a metal wire in vacuum, introducing active gas, adjusting a temperature of the metal wire and applying a positive high voltage V to the metal wire to generate at a side of the head of the metal wire an etching zone in which field induced chemical etching (FICE) is performed; increasing by the FICE a surface electric field at the top of the metal wire head to be greater than a field evaporation electric field of material for the metal wire, so that metal atoms at the top of the metal wire are evaporated off; after the field evaporation is activated by the FICE, causing mutual adjustment between the FICE and the field evaporation, until the head of the metal wire has a shape of combination of a base and a tip on the base; and stopping the FICE and the field evaporation when the head of the metal wire takes a predetermine shape.

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