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Chen X.,China Electronic Product Reliability and Environmental Testing Research Institute CEPREI | Chen X.,Sun Yat Sen University | Liu L.,China Electronic Product Reliability and Environmental Testing Research Institute CEPREI
Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA | Year: 2016

The failure analysis from the manufacturer could not fully explain the Cu-Al bond open and drift issues in some plastic encapsulated microcircuits. For further investigation, an insight analysis containing chemical deprocessing, cross-sectioning and mechanical opening was performed to define the root cause. Several new findings were observed to support a reasonable cause. The corrosion reaction of intermetallic compounds (IMC) with Cl ions participating was responsible for the anodic bond open failures, cracks grew at the interfaces of Cu ball and IMC, and the re-deposition of Cu ball corrosion resulted in leakage current and drift faults. The results prove that Cu-Al bond is sensitive to H2O and Cl, which play a role as catalysis, and the corrosion tend to happen more easily in anode with bias. © 2016 IEEE.


Zou J.,China Electronic Product Reliability and Environmental Testing Research Institute CEPREI | Wang Y.,China Electronic Product Reliability and Environmental Testing Research Institute CEPREI | Lai P.,China Electronic Product Reliability and Environmental Testing Research Institute CEPREI | Luo D.,China Electronic Product Reliability and Environmental Testing Research Institute CEPREI
Electrical Overstress/Electrostatic Discharge Symposium Proceedings | Year: 2014

ANSI/ESD S20.20 and IEC61340 Standards provide a general framework for developing an ESD control program. However, proper implementation of the Standard has been problematic, , resulting in issues in engineering practice. The current ESD protection situations and implementation of standards in China are investigated. Proposals are also put forward for improving factory ESD control.

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