Changhong Electrical Co.

Mianyang, China

Changhong Electrical Co.

Mianyang, China

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Xiang D.,Tsinghua University | Gao L.,Tsinghua University | Cui Y.,Tsinghua University | Pan X.Y.,Changhong Electrical Co. | Wang N.J.,Changhong Electrical Co.
Environment, Energy and Sustainable Development - Proceedings of the 2013 International Conference on Frontier of Energy and Environment Engineering, ICFEEE 2013 | Year: 2014

In many situations, measures for energy saving may make negative effects on product performance. In order to address the conflict between energy saving and performance optimization, the Energy Flow Model is built to systematically express the transmission, distribution, and change of energy. On the basis of the Energy Flow Model, two indices are developed to guide the energy saving process while guarantee the performance. The first index is the Performance Pertinence, a measure for the influence of design changes on performance. The second index is the Performance Margin, a measure for the optimization potential of components. The two indices are used to solve the conflict by identifying the components that should be optimized. Finally, the proposed method is illustrated by a case study of a split air-conditioner's outdoor unit. © 2014 Taylor & Francis Group, London.


Yang J.,PLA Logistical Engineering University | Pan X.,Changhong Electrical Co. | Xiang D.,Tsinghua University | Zhi H.,Changhong Electrical Co. | And 2 more authors.
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | Year: 2010

Among all the recycling technologies, waste printed circuit board (PCB) disassembly based on physical methods is getting more and more attention. Based on the analysis of package types of components and assembly manners of typical PCBs, the methods of heating & desoldering and force-applying for PCB disassembly are analyzed qualitatively, and two disassembly processes suitable for PCBs of electrical products and PCBs of electronic products are proposed respectively. According to these two processes, two kinds of disassembly apparatus are developed respectively. Mainboards of waste computer and waste television are used for PCB disassembly experiments on these apparatus according to these disassembly processes. The results of experiments show that under suitable disassembly process parameters, for PCBs of electronic products, the separation ratios of through-hole devices (THD), surface mount devices (SMD) and tiny chip components are 91.6%, 100% and 99.1% respectively; for PCBs of electrical products, the separation ratio of solder joints of THD reaches 94.9%. Experimental results reinforce the idea that disassembly processes based on physical methods can dismantle PCB effectively. This research will be helpful to develop practical PCB disassembly processes and disassembly apparatus. © 2010 Journal of Mechanical Engineering.


Gao L.,Tsinghua University | Xiang D.,Tsinghua University | Peng L.,Changhong Electrical Co. | Fang X.,Changhong Electrical Co.
Jisuanji Jicheng Zhizao Xitong/Computer Integrated Manufacturing Systems, CIMS | Year: 2014

To solve the conflict between the customization, technology improvement and commonality in product development, a modular design method for multi-strategies was proposed. The Quality Function Development (QFD) method for multi-strategies was introduced to build the distribution model and evolution model of the main parameters. The functional module partition method based on flow principle was used to divided modules preliminarily. Aiming at the relationship between multi-strategies design analysis modules and main parameters, the partitioning principle and the instance design principle were proposed to evaluate the initial module partitioning result. The effectiveness and feasibility of the method were verified by a case study of modular design for a refrigerator product family.


Wang J.,Southwest Jiaotong University | Wang J.,Changhong Electrical Corporation | Fan X.M.,Southwest Jiaotong University | Wu D.Z.,Southwest Jiaotong University | And 4 more authors.
Applied Surface Science | Year: 2011

CuO/tetrapod-like ZnO whisker (T-ZnOw) nanocomposites were successfully synthesized using a simple photo-deposition method. Some nanocomposites exhibit remarkably improved photocatalytic property, while the extents of the improvements vary with different Cu/Zn molar ratios and polyethylene glycol (PEG) concentrations. Moreover, it is found that excessively high Cu/Zn molar ratio or PEG concentration would reduce the photocatalytic property of the nanocomposites. A direct relationship between the morphology and the photocatalytic property of CuO/T-ZnOw was established and then analyzed by discussing the photocatalytic mechanism of the CuO/T-ZnOw nanocomposites. © 2011 Elsevier B.V. All rights reserved.


Zhao H.,Xi'an Jiaotong University | Sun H.,Xi'an Jiaotong University | Yang Q.,Changhong Electrical Co. | Min T.,Xi'an Jiaotong University | Zheng N.,Xi'an Jiaotong University
Proceedings - International Symposium on Quality Electronic Design, ISQED | Year: 2016

This paper explores the efficient use of STT-RAM in video processing system by choosing display processing as a case study. Through architectural analysis, we demonstrate that volatile STT-RAM rather than non-volatile STT-RAM is more appropriate for video processing system, as video data is mostly processed in streaming-style and relaxing the retention time can significantly reduce the write latency and energy of STT-RAM. Moreover, the error resilience of video display processing system is also evaluated to address the potential bit error rate increase when we relax the retention time of STT-RAM cells. Simulation results demonstrate that, the use of volatile STT-RAM and extra design techniques can significantly reduce the overall memory energy consumption to 38.24% with respect to that of baseline SRAM architecture, and video display processing system can tolerate up to 1×10-5 bit error rate without any visible image quality degradation. © 2016 IEEE.


Huang Y.,University of Electronic Science and Technology of China | Huang Y.,Changhong Electrical Co. | Qiao M.,University of Electronic Science and Technology of China | Zhou X.,University of Electronic Science and Technology of China | And 5 more authors.
Superlattices and Microstructures | Year: 2016

Cost-effective mask-sharing technology for the 200 V silicon-on-insulator (SOI) lateral insulated gate bipolar transistor (LIGBT) and p-channel lateral double-diffused MOS (PLDMOS) are proposed in this paper. N-well and P-body implantations are shared as an N-buffer implantation of the LIGBT and P-buffer implantation of the PLDMOS, respectively, which reduces two masks compared with the conventional process. The structure and process parameters for LIGBT and PLDMOS with the new process are optimized by simulation to achieve good performance. The experimental results indicate that the LIGBT and PLDMOS using the new process maintain the same performance compared to the conventional devices. © 2016 Elsevier Ltd. All rights reserved.


Liang T.,University of Electronic Science and Technology of China | Liang T.,Changhong Electrical Co. | He Y.,University of Electronic Science and Technology of China | Lu L.,University of Electronic Science and Technology of China | And 2 more authors.
2016 IEEE 8th International Power Electronics and Motion Control Conference, IPEMC-ECCE Asia 2016 | Year: 2016

A novel high-voltage (HV) thick layer silicon-on-insulator (SOI) field p-channel lateral double-diffused metal-oxide semiconductor (pLDMOS) with single trench isolation is developed for HV switching IC based on 11-μm-thick silicon layer and 1-μm-thick buried oxide layer. The thick gate oxide layer is formed by field oxide process to endure the high voltage between the source and gate electrodes. The deep trench is adopted to realize the compatibility between HV pLDMOS and LV CMOS. The device parameters T, Y for the HV SOI field pLDMOS are optimized to reduce the device size and satisfy the off-state breakdown voltage (BV). The HV SOI field pLDMOS with a BV over 200V is experimentally realized and successfully applied to a 96-bit output driver integrated circuit (IC). © 2016 IEEE.


Qiao M.,University of Electronic Science and Technology of China | Jiang L.,University of Electronic Science and Technology of China | Wang M.,University of Electronic Science and Technology of China | Huang Y.,University of Electronic Science and Technology of China | And 14 more authors.
Proceedings of the International Symposium on Power Semiconductor Devices and ICs | Year: 2011

Based on 11-μm-thick silicon layer and 1-μm-thick buried oxide layer, a novel high-voltage thick layer SOI technology has been developed for driving plasma display panels (PDP). HV pLDMOS, nLDMOS, nLIGBT and LV CMOS are compatible with deep trench isolation. The length T, Y for HV pLDMOS and TD for HV nLDMOS are optimized to reduce the device size and satisfy the off-state breakdown voltage simultaneously. Interdigitated N+&P+ and a deep P+ are adopted in the source region of HV nLDMOS and cathode region of HV nLIGBT to suppress parasitic NPN action and gain better on-state characteristics. A PDP scan driver IC using the developed high-voltage thick layer SOI technology shows that the rise and fall times of the output stages are about 17.6 ns and 16.6 ns respectively. © 2011 IEEE.


Pan X.Y.,Changhong Electrical Co. | Liu Y.L.,Changhong Electrical Co. | Wu J.,Changhong Electrical Co. | Zhang Q.W.,Changhong Electrical Co. | Lai D.,Changhong Electrical Co.
Advanced Materials Research | Year: 2014

In the case of four kinds discarded appliances of TV set, refrigerators, air conditioners and washing machines, build a reverse logistics network model of waste household appliances recycling by planning to establish three nodes of collection points, recycling centers and dismantling treatment plants. The reverse model with the minimum total cost as the objective, including recycling costs, transportation costs, the node infrastructure investment costs, operating costs, government subsidies and renewable resource recycling revenue. Finally, the operation analysis of an example shows that the model is effective and reasonable. The model provides an important theoretical reference to solve the reverse logistics network planning, the optimal siting of new node and distribution optimization problem. © (2014) Trans Tech Publications, Switzerland.


Zhao Y.,Changhong Electrical Co. | Pan X.Y.,Changhong Electrical Co. | Li C.C.,Changhong Electrical Co.
Applied Mechanics and Materials | Year: 2013

A study on production line layout problem indicates there is a lack of research on the production line design issue. Traditional methodology on this problem mainly depends on the designer's experience and calls for theory analysis and quantitative study. To control the cost and optimize the resource utilization of enterprises, this paper develops a multi-stage integer programming model to describe the production line layout problem, and proposes a heuristic algorithm to solve the problem. A practical example illustrates the effectiveness of the model. © (2013) Trans Tech Publications, Switzerland.

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