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Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2007.4.2 | Award Amount: 11.80M | Year: 2008

Europe is in transition to a knowledge economy and effective knowledge management is fundamental to successful economic activity. Still, enterprises find it hard to transform most of their essential tacit (implicit) knowledge into transferable, easily accessible, and actionable knowledge assets.ACTIVE aims to increase the productivity of knowledge workers in a pro-active, contextualised, yet easy and unobtrusive way. The aim is to convert tacit knowledge the hidden intelligence of enterprises into actionable knowledge to support collaboration and automated problem solving. A key aspect will be the support for informal procedural knowledge the informal collaboration and problem-solving tasks that drive much knowledge work in the enterprise.ACTIVE will integrate concepts, methods, and tools from the fields of (i) Social Software and Web 2.0, (ii) Semantic Technologies, (iii) Context Mining and Modelling, and Context Sensitive Task Management, and (iv) Knowledge Process Mining and Modelling and Pro-Active Knowledge Process Support into innovative application systems. The development will be accompanied by an analysis of key economic and organizational factors and incentive mechanisms, and strongly user-centric system development and evaluation.The key result of ACTIVE will be a breakthrough which empowers enterprises to make knowledge technology effective for a larger share of their essential knowledge, in particular both tacit knowledge and knowledge not held in formal enterprise repositories.ACTIVE will generate sustainable impact by deploying the tools and applications in three industry sectors: consulting, telecommunication and engineering. The added value of ACTIVE technology will be evaluated in economic, organizational, and user studies, and conclude with rigorous field tests. A major focus of ACTIVE will be uptake by industry beyond the immediate consortium.

SAN JOSE, Calif., March 2, 2017 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that Digital Media Professionals is using the Cadence® Palladium® XP Verification Computing Platform along with the company's Hosted Design Solutions (HDS) to expand its emulation...

News Article | February 21, 2017
Site: www.prnewswire.com

Single Tensilica Fusion F1 DSP implements IEEE 802.11ah MAC firmware plus additional IoT/sensor processing applications SAN JOSE, Calif., Feb. 21, 2017 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its Cadence® Tensilica® Fusion F1 DSP is part of the...

Single Cadence Tensilica Fusion F1 DSP runs ultra-low-power modem and smart IoT applications SAN JOSE, Calif., Feb. 21, 2017 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its collaboration with CommSolid, the cellular internet of things (IoT) company, to...

SAN JOSE, Calif., Feb. 23, 2017 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its collaboration with Alango Technologies Ltd., a leading provider of voice and audio enhancement technologies. The companies collaborated to provide the latest Alango Voice...

News Article | February 16, 2017
Site: www.prnewswire.com

SAN JOSE, Calif., Feb. 16, 2017 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS) will showcase the Cadence® Verification Suite and its most recent innovations at DVCon 2017. The event is being held February 27 to March 2, 2017 in San Jose, Calif., with Cadence, a gold sponsor,...

News Article | February 23, 2017
Site: www.prnewswire.com

MaxxVoice enhanced with far-field pickup SAN JOSE, Calif. and KNOXVILLE, Tenn., Feb. 23, 2017 /PRNewswire/ -- Cadence Design Systems, Inc. (NASDAQ: CDNS) and Waves Audio Ltd., the world-leading developer of audio DSP technologies, today announced the availability of the Waves Nx...

News Article | February 28, 2017
Site: globenewswire.com

San Jose, California, 28 February 2017 - ASML Holding NV (ASML) today announced a partnership with Cadence Design Systems, Inc. to expand the capabilities of its holistic lithography product portfolio, further streamlining chipmakers' process flow from design to mask production. The collaboration will bring together ASML's computational lithography solutions and the Cadence physical design back-end tools, leading to enhanced Design Technology Co-Optimization (DTCO) capabilities for advanced nodes, and other technologies. "In the face of shrinking process nodes, engineers are increasingly relying on designer-friendly, production-accurate manufacturability checks throughout the design phase to realize tighter imaging performance and cycle time goals," said Dr. Anirudh Devgan, senior vice president and general manager of the Digital & Signoff Group and the System & Verification Group at Cadence. "Together with ASML, we are now able to efficiently bridge the gap between design and manufacturing, empowering our customers to take better control of their design intent, reliability and yield through improved lithography awareness capabilities." As part of its holistic lithography approach, ASML has developed powerful lithography and patterning models that can simulate how a chip design is realized in silicon, representing the actual manufacturing processes. The integration of these design models into Cadence products enables DTCO to deliver optimal design scaling while securing manufacturability and yield. As the first result of their collaboration, the newly released Cadence® LPA PLUS enables engineers to simulate the manufacturability of their design at any time during implementation and signoff, enabling more efficient delivery of high-quality designs. ASML's partnership with Cadence represents another major step toward realizing a full end-to-end design-to-mask process flow. When combined with an earlier partnership with NCS, engineers can now leverage litho-aware design and mask data preparation on a seamlessly integrated platform. "Since ASML's early days, we've developed our systems in a cooperative network of partners, a practice we call Open Innovation," said Christophe Fouquet, Executive Vice President of Applications at ASML. "This enables us to remain focused on developing our core holistic lithography technology leadership in modeling, scanner imaging and patterning process control, while leveraging our partnerships to deliver improved cycle time and productivity along the whole value chain from design technology development to production implementation of the physical design, mask design, and mask data preparation." About ASML ASML is one of the world's leading manufacturers of chip-making equipment. Our vision is to enable affordable microelectronics that improve the quality of life. To achieve this, our mission is to invent, develop, manufacture and service advanced technology for high-tech lithography, metrology and software solutions for the semiconductor industry. ASML's guiding principle is continuing Moore's Law towards ever smaller, cheaper, more powerful and energy-efficient semiconductors. This results in increasingly powerful and capable electronics that enable the world to progress within a multitude of fields, including healthcare, technology, communications, energy, mobility, and entertainment. ASML is a multinational company with offices in 60 cities in 16 countries, headquartered in Veldhoven, the Netherlands. We employ more than 16,500 people on payroll and flexible contracts (expressed in full time equivalents). ASML is traded on Euronext Amsterdam and NASDAQ under the symbol ASML. More information about ASML, our products and technology, and career opportunities is available on www.asml.com. Forward Looking Statements This document contains statements relating to certain projections and business trends that are forward-looking, including statements with respect our partnership with Cadence Design Systems, Inc. and our intention to collaborate with Cadence on various holistic lithography initiatives, the benefits of our partnership with Cadence in respect of our holistic lithography product portfolio, and the further development and enhancement of holistic lithography products and tools. You can generally identify these statements by the use of words like "may", "will", "could", "should", "project", "believe", "anticipate", "expect", "plan", "estimate", "forecast", "potential", "intend", "continue" and variations of these words or comparable words. These statements are not historical facts, but rather are based on current expectations, estimates, assumptions and projections about the business and our future financial results and readers should not place undue reliance on them. Forward-looking statements do not guarantee future performance and involve risks and uncertainties. These risks and uncertainties include, without limitation, the possibility that our partnership with Cadence fails to become successful or that it may not benefit our holistic lithography product portfolio as anticipated, product demand and semiconductor equipment industry capacity, worldwide demand and manufacturing capacity utilization for semiconductors (the principal product of our customer base), including the impact of general economic conditions on consumer confidence and demand for our customers' products, competitive products and pricing, the impact of any manufacturing efficiencies and capacity constraints, performance of our systems, the continuing success of technology advances and the related pace of new product development, our ability to enforce patents and protect intellectual property rights, the risk of intellectual property litigation, trade environment and other risks indicated in the risk factors included in ASML's Annual Report on Form 20-F and other filings with the US Securities and Exchange Commission. These forward-looking statements are made only as of the date of this document. ASML does not undertake any obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.

News Article | February 15, 2017
Site: www.businesswire.com

ROCHESTER, N.Y.--(BUSINESS WIRE)--CloudCheckr, the leading cloud management platform today announced a partnership with Spotinst, the leading workload management platform, which provides lifecycle management for AWS EC2 Spot Instances. The partnership enables AWS customers utilizing the CloudCheckr platform to reduce their EC2 costs by up to 80% through highly available, automated Spot Instance management. "Cloud cost management and optimization are top of mind for all organizations as cloud adoption increases in the enterprise," said Amiram Shachar, CEO & Founder at Spotinst. "The combination of CloudCheckr’s cloud management platform with Spotinst’s EC2 workload management will enable businesses to seamlessly leverage excess capacity for computing resources at a low cost with high availability.” CloudCheckr Spot Management, powered by Spotinst, provides users the ability to leverage AWS Spot Instance opportunities and save upwards of 80% on the EC2 usage costs. When combined with CloudCheckr’s cost and expense management capabilities for reserved instances and on-demand instances, customers get total visibility, predictability, and cost savings across their entire EC2 fleet. With this partnership and integration, CloudCheckr customers can activate their Spot Management usage immediately by leveraging single sign-on from the CloudCheckr platform. “CloudCheckr is dedicated to providing next-generation cost management capabilities for the public cloud, and this strategic partnership demonstrates CloudCheckr’s commitment to helping our customers manage costs and save money,” stated Aaron Newman, Co-Founder and CEO of CloudCheckr. “Enabling customers to optimize their cloud usage is a fundamental vision we both share. With Spotinst’s intuitive toolset and spot management expertise, we are excited to bring the power of the AWS Spot market to our customers.” For more information on CloudCheckr Spot Management, powered by Spotinst, please visit http://cloudcheckr.com/spot-management. Spotinst has created a SaaS-based workload management that reduces cloud computing costs by up to 80% using predictive analytics and proprietary algorithms to forecast and leverage Spot markets available from AWS, Google Cloud, Microsoft Azure and Packet.net’s bare metal cloud. Through its unique Elastigroup Platform, Spotinst reliably delivers 100 percent cluster portability and availability while dramatically reducing cloud costs. The Elastigroup Platform already is deployed by more than 400 leading companies including Cadence Design Systems, Chegg, Vungle and TicketMaster. To learn more, please visit http://www.spotinst.com. Government organizations and Global 2000 enterprises trust CloudCheckr to deliver the most robust cloud management platform in today’s marketplace. CloudCheckr’s platform helps customers save on average of 30% on their monthly AWS spend while providing total visibility, actionable analytics, configuration and activity monitoring, and critical automation for your cloud. By unifying DevOps, Security and Finance teams, CloudCheckr helps organizations be more efficient and secure in the cloud. Get started at cloudcheckr.com/getstarted.

Wiseguyreports.Com Adds “Cloud Electronic Design Automation(EDA) -Market Demand, Growth, Opportunities and analysis of Top Key Player Forecast to 2021” To Its Research Database This report studies the global Cloud Electronic Design Automation(EDA) market, analyzes and researches the Cloud Electronic Design Automation(EDA) development status and forecast in United States, EU, Japan, China, India and Southeast Asia. This report focuses on the top players in global market, like Market segment by Type, Cloud Electronic Design Automation(EDA) can be split into CAE SIP (semiconductor intellectual property) IC physical design and verification Printed circuit board (PCB) and multi-chip module (MCM) Market segment by Application, Cloud Electronic Design Automation(EDA) can be split into Application 1 Application 2 Application 3 United States, EU, Japan, China, India and Southeast Asia Cloud Electronic Design Automation(EDA) Market Size, Status and Forecast 2021 1 Industry Overview of Cloud Electronic Design Automation(EDA) 1.1 Cloud Electronic Design Automation(EDA) Market Overview 1.1.1 Cloud Electronic Design Automation(EDA) Product Scope 1.1.2 Market Status and Outlook 1.2 Global Cloud Electronic Design Automation(EDA) Market Size and Analysis by Regions 1.2.1 United States 1.2.2 EU 1.2.3 Japan 1.2.4 China 1.2.5 India 1.2.6 Southeast Asia 1.3 Cloud Electronic Design Automation(EDA) Market by Type 1.3.1 CAE 1.3.2 SIP (semiconductor intellectual property) 1.3.3 IC physical design and verification 1.3.4 Printed circuit board (PCB) and multi-chip module (MCM) 1.4 Cloud Electronic Design Automation(EDA) Market by End Users/Application 1.4.1 Application 1 1.4.2 Application 2 1.4.3 Application 3 2 Global Cloud Electronic Design Automation(EDA) Competition Analysis by Players 2.1 Cloud Electronic Design Automation(EDA) Market Size (Value) by Players (2015-2016) 2.2 Competitive Status and Trend 2.2.1 Market Concentration Rate 2.2.2 Product/Service Differences 2.2.3 New Entrants 2.2.4 The Technology Trends in Future 3 Company (Top Players) Profiles 3.1 Cadence Design Systems 3.1.1 Company Profile 3.1.2 Main Business/Business Overview 3.1.3 Products, Services and Solutions 3.1.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.1.5 Recent Developments 3.2 Mentor Graphics 3.2.1 Company Profile 3.2.2 Main Business/Business Overview 3.2.3 Products, Services and Solutions 3.2.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.2.5 Recent Developments 3.3 Synopsys 3.3.1 Company Profile 3.3.2 Main Business/Business Overview 3.3.3 Products, Services and Solutions 3.3.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.3.5 Recent Developments 3.4 Agilent 3.4.1 Company Profile 3.4.2 Main Business/Business Overview 3.4.3 Products, Services and Solutions 3.4.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.4.5 Recent Developments 3.5 Agnisys 3.5.1 Company Profile 3.5.2 Main Business/Business Overview 3.5.3 Products, Services and Solutions 3.5.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.5.5 Recent Developments 3.6 Aldec 3.6.1 Company Profile 3.6.2 Main Business/Business Overview 3.6.3 Products, Services and Solutions 3.6.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.6.5 Recent Developments 3.7 Ansys 3.7.1 Company Profile 3.7.2 Main Business/Business Overview 3.7.3 Products, Services and Solutions 3.7.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.7.5 Recent Developments 3.8 JEDA Technologies 3.8.1 Company Profile 3.8.2 Main Business/Business Overview 3.8.3 Products, Services and Solutions 3.8.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.8.5 Recent Developments 3.9 MunEDA 3.9.1 Company Profile 3.9.2 Main Business/Business Overview 3.9.3 Products, Services and Solutions 3.9.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.9.5 Recent Developments 3.10 Sigrity 3.10.1 Company Profile 3.10.2 Main Business/Business Overview 3.10.3 Products, Services and Solutions 3.10.4 Cloud Electronic Design Automation(EDA) Revenue (Value) (2011-2016) 3.10.5 Recent Developments 3.11 Zuken 4 Global Cloud Electronic Design Automation(EDA) Market Size by Type and Application (2011-2016) 4.1 Global Cloud Electronic Design Automation(EDA) Market Size by Type (2011-2016) 4.2 Global Cloud Electronic Design Automation(EDA) Market Size by Application (2011-2016) 4.3 Potential Application of Cloud Electronic Design Automation(EDA) in Future 4.4 Top Consumer/End Users of Cloud Electronic Design Automation(EDA) For more information, please visit https://www.wiseguyreports.com/sample-request/646702-united-states-eu-japan-and-forecast-2021

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