Rolla, MO, United States
Rolla, MO, United States

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Patent
Brewer Science Inc. | Date: 2016-08-04

A sensor system comprises a first sensor, a second sensor, a high pass filter, and a summation unit. The first sensor senses an environmental parameter and outputs a first electronic signal with a response having a first time constant. The second sensor senses the environmental parameter and outputs a second electronic signal with a response having a second time constant greater than the first time constant. The high pass filter has a filter time constant roughly equal to the second time constant and filters the first electronic signal, outputting a filtered first electronic signal in which changes in a level or value of the first electronic signal with transition times that are less than the filter time constant are passed. The summation unit receives the filtered first electronic signal and the second electronic signal and outputs a sum of the filtered first electronic signal and the second electronic signal.


The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200 C. PECVD processing.


Patent
Brewer Science Inc. | Date: 2015-05-05

A user interface for monitoring a number of parameters of a system includes an electronic display element and a display driver for controlling the electronic display element so as to display a data graph thereon. The data graph includes a bounded area divided into a plurality of segments, each segment representing one of the parameters; and a number of concentric portions formed in each segment, each concentric portion representing a state or value of the parameter represented by its corresponding segment. The display driver receives data representative of a current state or value of each of the parameters and indicates the current state or value of the parameters by marking the concentric portions that represent the current states or values.


Patent
Brewer Science Inc. | Date: 2015-07-22

Printed resistive-based sensors and transducers comprising a thin, electronically active sensing layer within a dielectric and/or metallic layered structure are provided. The electronic resistance of the active sensing layer is measured during a change in the sensor environment. By utilizing a multi-layered architecture around the active sensing layer, the electronic signal of the sensing element can be improved. By carefully selecting the architecture and materials that surround the active sensing layer, the sensitivity, stability, and selectivity of the sensor to detect changes in the environment are improved. This design allows for a number of specific application areas for environmental sensing.


Patent
Brewer Science Inc. | Date: 2015-07-22

The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250 C. to about 350 C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.


Patent
Brewer Science Inc. | Date: 2016-06-21

Planarizing and spin-on-carbon (SOC) compositions that fill vias and/or trenches on a substrate while planarizing the surface in a single thin layer coating process are provided. The compositions can planarize wide ranges of substrates with vias or trenches of from about 20 nm to about 220 nm wide, and up to about 700 nm deep. These extraordinary properties come from the low molecular weight of the polymers used in the materials, thermally-labile protecting groups on the polymers, and a delayed crosslinking reaction.


Patent
Brewer Science Inc. | Date: 2016-03-16

Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.


Patent
Brewer Science Inc. | Date: 2015-01-16

Compositions for directed self-assembly (DSA) patterning techniques are provided. Methods for directed self-assembly are also provided in which a DSA composition comprising a block copolymer (BCP) is applied to a substrate and then self-assembled to form the desired pattern. The block copolymer includes at least two blocks and is selected to have a high interaction parameter (). The BCPs are able to form perpendicular lamellae by simple thermal annealing on a neutralized substrate, without a top coat. The BCPs are also capable of micro-phase separating into lines and spaces measuring at 10 nm or smaller, with sub-20-nm L_(0 )capability.


The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200 C. PECVD processing.


Patent
Brewer Science Inc. | Date: 2015-12-14

Novel hyper-branched, dense, high-refractive-index polymers, and compositions utilizing those polymers are provided, along with methods of forming high refractive index films with those compositions. The refractive index of the material is at least about 1.8 at 400 nm. Further, it can be made into optically transparent thin films of only a couple hundred angstroms thickness to thick films of several micrometers thick, as well as into bulk solids. The use of a thermal acid or a photo acid generator facilitates crosslinking after the coating process.

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