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Fernandez D.,Baolab Microsystems | Martinez-Alvarado L.,Mexicali Institute of Technology | Madrenas J.,Polytechnic University of Catalonia
IEEE Journal of Solid-State Circuits | Year: 2012

A field-programmable analog array (FPAA) using a standard-CMOS wide-dynamic-range translinear element (TE) is introduced. The FPAA configurable analog blocks (CABs) are based on a reconfigurable translinear cell (RTC), capable of implementing the basic circuit elements required by translinear and log-domain circuit design. The interfacing is provided by an I/O programmable cell, which allows for easier connectivity between the signal-processing core and the external circuitry. As a proof-of-concept, a 5 × 5 RTC FPAA testchip was implemented in 0.35-μm CMOS technology. A set of various circuit primitives, such as one- and four-quadrant multipliers, an Euclidean distance operator and a fourth-order log-domain filter, were mapped on the chip in order to demonstrate the versatility of the approach. FPAA bandwidth reaches 20 MHz with a power consumption of 30 μW/TE and precision errors below 3%. © 2011 IEEE.


Patent
Baolab Microsystems | Date: 2012-02-01

Systems and methods for manufacturing a chip comprising a plurality of MEMS devices arranged in an integrated circuit are provided. In one aspect, the systems and methods provide for a chip including electronic elements formed on a semiconductor material substrate. The chip further includes a stack of interconnection layers including layers of conductor material separated by layers of dielectric material. MEMS devices are formed within the stack of interconnection layers by applying gaseous HF to a first layer of dielectric material positioned highest in the stack of interconnection layers. The stack of interconnection layers includes at least one unetched layer of dielectric material, and at least one layer of conductor material for routing connections to and from the electronic elements.


Systems and methods for manufacturing a chip comprising a MEMS-based radio frequency filter arranged in an integrated circuit are provided. In one aspect, the systems and methods provide for a chip including electronic elements formed on a semiconductor material substrate. The chip further includes a stack of interconnection layers including layers of conductor material separated by layers of dielectric material. A radio frequency filter is formed within the stack of interconnection layers by applying gaseous HF to the interconnection layers. The radio frequency filter includes a plurality of mechanically decoupled resonator elements.


Patent
Baolab Microsystems | Date: 2011-07-22

The systems and methods described herein address deficiencies in the prior art by enabling spatial multiplexing in cellular and/or wireless networks to overcome capacity limitations. In one embodiment, the limitations are overcome by forming a spatially multiplexed network of portable communications devices having MEMS-based vibrating antennas. Other suitable applications of vibrating antennas are also described.


A method for manufacturing an integrated circuit including producing layers that form one or more electrical and/or electronic elements on a semiconductor material substrate. Then, producing ILD layers above the layers forming one or more electrical and/or electronic elements, including the steps of depositing a first layer of etch stopper material, depositing a second layer of dielectric material above and in contact with the first layer, forming at least one track extending through the first and second layers, and filling the at least one track with a non-metallic material.


Systems and methods for CMOS-based MEMS programmable memories are described. In one aspect, the systems and methods provide for a programmable memory having multiple memory cells. Each memory cell includes an electrode disposed within the memory cell, and a conductor material having two ends disposed proximate to the electrode. The programmable memory provides means for applying a voltage between the electrode and the conductor material, e.g., a voltage source. The applied voltage generates an electrostatic force sufficient to permanently alter the conductor material, thereby programming the memory cell.


Patent
Baolab Microsystems | Date: 2013-11-13

A MEMS integrated circuit including a plurality of layers where a portion includes one or more electronic elements on a semiconductor material substrate. The circuit includes a structure of interconnection layers having a bottom layer of conductor material and a top layer of conductor material where the layers are separated by at least one layer of dielectric material. The bottom layer may be formed above and in contact with an Inter Dielectric Layer. The circuit also includes a hollow space within the structure of interconnection layers and a MEMS device in communication with the structure of interconnection layers.


Patent
Baolab Microsystems | Date: 2010-05-20

A MEMS integrated circuit including a plurality of layers where a portion includes one or more electronic elements on a semiconductor material substrate. The circuit includes a structure of interconnection layers having a bottom layer of conductor material and a top layer of conductor material where the layers are separated by at least one layer of dielectric material. The bottom layer may be formed above and in contact with an Inter Dielectric Layer. The circuit also includes a hollow space within the structure of interconnection layers and a MEMS device in communication with the structure of interconnection layers.


Patent
Baolab Microsystems | Date: 2011-06-20

The systems and methods described herein address deficiencies in the prior art by enabling the fabrication and use of accelerometers, whether MEMS-based, NEMS-based, or CMOS-MEMS based, in the same integrated circuit die as a CMOS chip. In one embodiment, the accelerometer is fabricated on the same integrated circuit die as a CMOS chip using a typical CMOS manufacturing process.


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