Time filter

Source Type

Cleveland, OH, United States

Vardaman E.J.,Austin International Inc.
Electronics System Integration Technology Conference, ESTC 2010 - Proceedings | Year: 2010

Performance requirements such as increased bandwidth and lower power are driving the adoption of 3D ICs designed with through silicon vias. Many companies and research organizations have described the advantages of stacking chips vertically. There is no question that 3D TSV will be adopted, but the timing for mass production depends on how the cost of the new technology compares with that of existing technologies. As companies move from R&D into production the difficult work begins in addressing the issues of design, thermal management, test, and assembly. Different needs and economic factors determine the timing of adoption in each application. Issues in moving to volume production include the installation and qualification of high-volume 300mm production lines, assembly and test capability, the availability of TSV interposers, and reliability data. This presentation provides an assessment of the infrastructure for 3D TSV and provides an update on the remaining barriers to adoption. Source

Held M.,Austin International Inc.
AIChE Annual Meeting, Conference Proceedings | Year: 2013

Prevention and control of ignition sources is the key element in manufacturing and processing of explosives. The fundamental approach of BOS (Basis of Safety) and its application principles will be described. Examples will be given to demonstrate how safe operation principles based on BOS are implemented in inherent plant design for manufacturing of explosives of varying sensitivity and also describe trends in modern plant processes. Source

Vardaman E.J.,Austin International Inc.
Advancing Microelectronics | Year: 2014

The author, Jan Vardeman, discusses the challenges in the adoption of the three dimensional integrated circuits (3D ICs) with through silicon vias (TSV). Challenges include the bond/debonding process in wafer thinning, thermal dissipation where logic and memory are stacked, and test. Another area that is receiving considerable attention is the micro bump assembly process. The introduction of 3D ICs requires new developments in test methodologies and strategies in design for test. Critical needs must be met in order to improve yields and final assembly and reduce costs. The understanding of interactions between materials and equipment will determine successful implementation of the 3D TSV process. Source

Austin International Inc. | Date: 2014-03-19

5th wheel glider hitches.

Park H.,Cornell University | Kim S.,Cornell University | Morris K.,Cornell University | Moukperian M.,Cornell University | And 2 more authors.
Applied Ergonomics | Year: 2015

The biomechanical experiment with eight male and four female firefighters demonstrates that the effect of adding essential equipment: turnout ensemble, self-contained breathing apparatus, and boots (leather and rubber boots), significantly restricts foot pronation. This finding is supported by a decrease in anterior-posterior and medial-lateral excursion of center of plantar pressure (COP) trajectory during walking. The accumulation of this equipment decreases COP velocity and increases foot-ground contact time and stride time, indicating increased gait instability. An increase in the flexing resistance of the boots is the major contributor to restricted foot pronation and gait instability as evidenced by the greater decrease in excursion of COP in leather boots (greater flexing resistance) than in rubber boots (lower resistance). The leather boots also shows the greatest increase in foot contact time and stride time. These negative impacts can increase musculoskeletal injuries in unfavorable fire ground environments. © 2014 Elsevier Ltd and The Ergonomics Society. Source

Discover hidden collaborations