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Sankt Stefan ob Leoben, Austria

Patent
At&S Ag and Rosenberger Osi Gmbh & Co. Ohg | Date: 2012-04-04

An optical coupling system for coupling a first optical waveguide having a first core surrounded by a first sheath to a second optical waveguide having a second core surrounded by a second sheath. An end face of the first core of the first optical waveguide abuts an end face of the second core of the second optical waveguide at a coupling location and the second core is flush with the first core in the axial direction, wherein, in the region of the coupling location, over at least part of a predetermined axial portion, both the second sheath of the second optical waveguide and the first sheath of the first optical waveguide together form a cladding of the optical waveguide in the predetermined portion.


Le Gouguec T.,University Of Brest Ubo | Mahdi N.,University Of Brest Ubo | Cadiou S.,University Of Brest Ubo | Quendo C.,University Of Brest Ubo | And 3 more authors.
International Journal of Microwave and Wireless Technologies | Year: 2016

The recent developments in electronic cards such as the network equipment are characterized by the miniaturization of the board size and the increasing complexity of the layout. Because of these requirements, multi-layered printed circuit boards are commonly used and vias connecting signal lines on different layers, or integrated circuit devices to power and ground planes, are frequently used and often essential. However, a via is not an ideal transmission line. Besides, it creates discontinuities at high frequencies leading to high insertion loss degradation of signal which limits the performances of integrated circuit and systems. In this paper, the impacts of coupling between via and parallel-plates cavity on the response of microwave integrated devices are highlighted in the first part. Then, to describe the intrinsic interaction between the via transition and parallel-plate modes, the notion of parallel-plates matrix impedances is presented and new boundary conditions like open or plated through holes shielded boundaries of the cavities are introduced. Then, using this physics-based model, an intuitive equivalent circuit has been developed. Finally, the proposed approach and the equivalent circuits were validated by using comparisons with electromagnetic simulations and measurements in different scenarios. Copyright © Cambridge University Press and the European Microwave Association 2016 Source

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