Berlin, Germany
Berlin, Germany

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A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I), wherein:


Patent
Atotech Deutschland Gmbh | Date: 2016-10-11

A process for depositing a zinc-iron alloy layer material having a body centred cubic crystal structure of the -phase, a (330) texture and an iron content of 12 to 20 wt.-% including the steps (i) providing a metallic substrate, (ii) contacting the substrate with an alkaline aqueous zinc-iron alloy plating bath containing 4 to 6 g/l zinc ions, 1 to 3 g/l iron ions, 25 to 35 g/l hydroxyl ions, 0.5 to 2.5 g/l of a quaternary ammonium polymer and at least one complexing agent selected from the group consisting of hydroxyl carboxylic acids and salts thereof and simultaneously applying a current to the substrate. The zinc alloy layer material provides a high corrosion protection to metallic substrates, has a high hardness and a bright appearance.


Patent
Atotech Deutschland Gmbh | Date: 2017-04-26

A surface treatment solution for copper and copper alloy surfaces comprising an acid and an oxidising agent characterised in that it further comprises at least one source of chloride ions and at least one source of bromide ions. The surface treatment solution is particularly useful in the manufacturing of printed circuit boards, IC substrates and other electronic appliances.


Patent
Atotech Deutschland Gmbh | Date: 2017-03-01

An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. The aqueous plating bath according to the invention shows good stability and plating rate and yields glossy and homogeneous iron boron alloy coatings on various substrates. It is an advantage of the plating bath that it does not require any sacrificial anodes.


In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to (1) a process comprising treatment with an alkali metal hydroxide solution, (2) a process comprising treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt% and a pH of 8 to 1, (4) a process comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polysty-renesulphonic acid, and (5) a process comprising copper electroplating, which are implemented sequentially.


An etching solution for treating electrically nonconductive plastic surfaces of articles comprising phosphoric acid, sulphuric acid, water and at least one oxidising agent suitable to oxidise an electrically nonconductive plastic surface characterised in that the molar ratio of water to sulphuric acid in the etching solution ranges from 1/1 to 2/1 and wherein the concentration of sulphuric acid ranges from 5.29 mol/I to 8.50 mol/I sulphuric acid. Such etching solutions are stable over a prolonged time and thus particularly cost-efficient as well as ecologically benign. Plastic surfaces treated with such etching solutions yield excellent adhesion strength of subsequently formed metal layers thereon.


Patent
Atotech Deutschland Gmbh | Date: 2017-06-07

This invention concerns a method for galvanic metal deposition of a substrate using an anode and an electrolyte, wherein from each of a plurality of electrolyte nozzles a locally confined electrolyte stream is directed towards a part of a substrate surface which is to be treated, wherein a relative movement is carried out between the substrate and the electrolyte stream during deposition, characterized in that a first movement is carried out along a first path, wherein at least along a part of the first path a second movement is carried out along a second path, wherein the first and the second movement each are relative movements between the electrolyte stream and the substrate. Further, the invention concerns a substrate holder reception apparatus and an electrochemical treatment apparatus.


The present invention relates to a method for reducing the optical reflectivity of a copper and copper alloy circuitry wherein a thin palladium or palladium alloy layer is deposited by immersion-type plating onto said copper or copper alloy. Thereby, a dull greyish or greyish black or black layer is obtained and the optical reflectivity of said copper or copper alloy circuitry is reduced. The method according to the present invention is particularly suitable in the manufacture of image display devices, touch screen devices and related electronic components.


Patent
Atotech Deutschland Gmbh | Date: 2017-06-28

An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I)^(1) is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.


The invention relates to an aqueous plating bath composition for electroless deposition of nickel or a nickel alloy, the composition comprising: (i) a source of nickel ions, wherein the aqueous plating bath composition further comprises (ii) at least one accelerating compound which is a 1-acylguanidine compound having general chemical formula I, wherein R^(1) is selected from the group comprising alkyl and aryl; R^(2) is a radical having general chemical formula -R^(4)-SO_(3)M, wherein R^(4) is selected from the group comprising alkylene and arylene; wherein M is hydrogen or a metal atom or any other cation forming radical having a valency of one or is an M^(th) fraction of a metal atom or any other cation forming radical having a valency of m, wherein m is 2 or 3; R^(3) is selected from the group comprising -Hal, -OR^(5), and -NR^(5)R^(6), wherein R^(5), R^(6) are independently selected from the group comprising hydrogen, alkyl and aryl; and n is an integer ranging from 1 to 5.

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