Entity

Time filter

Source Type

Berlin, Germany

Patent
Atotech Deutschland Gmbh | Date: 2014-01-15

The present invention relates to the etching, activation and deposition of a first metal or metal alloy layer onto non-conductive polymers. The non-conductive polymer is etched with an aqueous solution comprising 0.75 to 3.6 g/l permanganate ions in 60 to 80 vol.-% sulfuric acid, activating with a solution comprising a noble metal and depositing a first metal or metal alloy by immersion-type or electroless (autocatalytic) plating. The first metal or metal alloy layer obtained has a high adhesion on the non-conductive polymer and serves as a plating base for electroplating further metal and/or metal alloy layer(s) thereon.


Patent
Atotech Deutschland Gmbh | Date: 2014-01-07

The present invention relates to a process for corrosion protection of an iron-containing substrate wherein a first zinc-nickel alloy layer, a second zinc-nickel alloy layer and a black passivate layer are deposited onto the substrate. The nickel concentration in the second zinc-nickel alloy layer is higher than the nickel concentration in the first zinc-nickel alloy layer. The substrate surface obtained is homogenously black with an appealing decorative appearance and both resistance against white rust and red rust are improved.


Patent
Atotech Deutschland Gmbh | Date: 2014-05-16

Embodiments of the present invention relate generally to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCBs. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCBs, in particular for PCBs having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.


Patent
Atotech Deutschland Gmbh | Date: 2014-01-07

The present invention relates to method for activating a copper or copper alloy surface for depositing a metal or metal alloy layer by electroless (autocatalytic) plating thereon wherein the formation of undesired voids is suppressed. The copper or copper alloy surface is contacted with palladium ions, at least one phosphonate compound and halide ions followed by electroless (autocatalytic) deposition of a metal such as palladium or a metal alloy such as a NiP alloy.


Patent
Atotech Deutschland Gmbh | Date: 2014-01-22

The aqueous electroplating bath according to the present invention comprises chromium(VI) ions, sulfate ions and methane-trisulfonic acid or a salt thereof as the catalyst. The functional chromium layer deposited from the aqueous electroplating bath according to the present invention has an increased corrosion resistance.

Discover hidden collaborations