Berlin, Germany
Berlin, Germany

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A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I), wherein:


Patent
Atotech Deutschland Gmbh | Date: 2016-10-11

A process for depositing a zinc-iron alloy layer material having a body centred cubic crystal structure of the -phase, a (330) texture and an iron content of 12 to 20 wt.-% including the steps (i) providing a metallic substrate, (ii) contacting the substrate with an alkaline aqueous zinc-iron alloy plating bath containing 4 to 6 g/l zinc ions, 1 to 3 g/l iron ions, 25 to 35 g/l hydroxyl ions, 0.5 to 2.5 g/l of a quaternary ammonium polymer and at least one complexing agent selected from the group consisting of hydroxyl carboxylic acids and salts thereof and simultaneously applying a current to the substrate. The zinc alloy layer material provides a high corrosion protection to metallic substrates, has a high hardness and a bright appearance.


Patent
Atotech Deutschland Gmbh | Date: 2017-03-15

The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and an additive obtainable by a reaction of at least one aminoglycidyl compound comprising at least one amino group which bears at least one glycidyl moiety and at least one second compound selected from ammonia and amine compounds wherein the amine compounds comprise at least one primary or secondary amino group with the proviso that the aminoglycidyl compound contains at least one polyoxyalkylene residue and / or the amine compound contains at least one polyoxyalkylene residue. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.


Patent
Atotech Deutschland Gmbh | Date: 2017-03-22

An electroless aqueous gold plating bath, comprising at least one source of gold ions and at least one reducing agent for gold ions, characterized in that it comprises at least one ethylenediamine derivative according to formula (I)^(1) and R^(2) comprise 2 to 12 carbon atoms and are selected from the group consisting of branched alkyl, unbranched alkyl, cycloalkyl or combinations thereof wherein the individual residues R^(1) and R^(2) are the same or different as plating enhancer compound. The electroless aqueous gold plating bath is suitable to provide soft gold layers useful for wire bonding and soldering applications which are required for electronic components.


The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.


Patent
Atotech Deutschland Gmbh | Date: 2016-06-01

The present invention concerns microorganisms capable of bioremediating glycol ethers, methods of bioremediating glycol ethers utilizing the microorganisms, uses of compositions for bioremediating glycol ether comprising the microorganisms, and screening methods for screening microorganisms capable of bioremediating glycol ethers. The microorganisms and the methods of the present invention can be used for detoxifying process and waste waters in the industry, for example the electronic industry, the paint industry, the chemical industry or the fracking industry.


Patent
Atotech Deutschland Gmbh | Date: 2016-06-01

The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising metal ions of at least one of indium and gallium and iodine containing, inorganic compounds in order to enhance bath stability.


Patent
Atotech Deutschland Gmbh | Date: 2016-06-22

A novel method for the manufacturing of fine line circuitry on a transparent substrates is provided, the method comprises the following steps in the given order providing a transparent substrate, depositing a pattern of light-shielding activation layer on at least a portion of the front side of said substrate, placing a photosensitive composition on the front side of the substrate and on the pattern of light-shielding activation layer, photo-curing the photosensitive composition from the back side of the substrate with a source of electromagnetic radiation, removing any uncured remnants of the photosensitive composition; and thereby exposing recessed structures and deposition of at least one metal into the thus formed recessed structures whereby a transparent substrate with fine line circuitry thereon is formed. The method allows for very uniform and fine line circuitry with a line and space dimension of 0.5 to 10 m.


Patent
Atotech Deutschland Gmbh | Date: 2016-08-17

The present invention relates to methods of treating metal surfaces to enhance adhesion or binding to substrates, and devices formed thereby. In some embodiments of the present invention, methods of achieving improved bonding strength without roughening the topography of a metal surface are provided. The metal surface obtained by this method provides strong bonding to resin layers. The bonding interface between the treated metal and the resin layer exhibits resistance to heat, moisture, and chemicals involved in post-lamination process steps, and therefore can suitably be used in the production of PCBs. Methods according to some embodiments of the present invention are especially useful in the fabrication of high density multilayer PCBs, in particular for PCBs having circuits with line/spacing of equal to and less than 10 microns. Methods according to other embodiments of the present invention are particularly useful in the coating of metal surfaces in a wide variety of applications.


Patent
Atotech Deutschland Gmbh | Date: 2016-06-22

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallisation of display applications.

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