Atotech Deutschland Gmbh

Berlin, Germany

Atotech Deutschland Gmbh

Berlin, Germany
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In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to (1) a process comprising treatment with an alkali metal hydroxide solution, (2) a process comprising treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt% and a pH of 8 to 1, (4) a process comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polysty-renesulphonic acid, and (5) a process comprising copper electroplating, which are implemented sequentially.


Patent
Atotech Deutschland Gmbh | Date: 2017-03-22

An electroless aqueous gold plating bath, comprising at least one source of gold ions and at least one reducing agent for gold ions, characterized in that it comprises at least one ethylenediamine derivative according to formula (I)^(1) and R^(2) comprise 2 to 12 carbon atoms and are selected from the group consisting of branched alkyl, unbranched alkyl, cycloalkyl or combinations thereof wherein the individual residues R^(1) and R^(2) are the same or different as plating enhancer compound. The electroless aqueous gold plating bath is suitable to provide soft gold layers useful for wire bonding and soldering applications which are required for electronic components.


The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.


Patent
Atotech Deutschland Gmbh | Date: 2017-03-15

The present invention relates to aqueous acidic plating baths for copper deposition in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of copper ions, at least one acid and an additive obtainable by a reaction of at least one aminoglycidyl compound comprising at least one amino group which bears at least one glycidyl moiety and at least one second compound selected from ammonia and amine compounds wherein the amine compounds comprise at least one primary or secondary amino group with the proviso that the aminoglycidyl compound contains at least one polyoxyalkylene residue and / or the amine compound contains at least one polyoxyalkylene residue. The plating bath is particularly useful for filling recessed structures with copper and build-up of pillar bump structures.


Patent
Atotech Deutschland Gmbh | Date: 2017-02-08

The present invention relates to a composition of an etching solution and a process for metallizing electrically nonconductive plastic surfaces of articles using the etching solution. The etching solution is based on a stabilized acidic permanganate solution. After the treatment with the etching solution, the articles can be metallized.


An etching solution for treating electrically nonconductive plastic surfaces of articles comprising phosphoric acid, sulphuric acid, water and at least one oxidising agent suitable to oxidise an electrically nonconductive plastic surface characterised in that the molar ratio of water to sulphuric acid in the etching solution ranges from 1/1 to 2/1 and wherein the concentration of sulphuric acid ranges from 5.29 mol/I to 8.50 mol/I sulphuric acid. Such etching solutions are stable over a prolonged time and thus particularly cost-efficient as well as ecologically benign. Plastic surfaces treated with such etching solutions yield excellent adhesion strength of subsequently formed metal layers thereon.


Patent
Atotech Deutschland Gmbh | Date: 2017-02-15

The present invention relates to a plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous acidic plating bath according to the present invention comprises a source for palladium ions, a reducing agent, a nitrogenated complexing agent for palladium ions and a water-soluble stabilizing agent selected from the group consisting of aromatic compounds comprising at least two residues wherein at least one residue is a hydrophilic residue and at least one residue has a negative mesomeric effect. The plating bath has an increased stability against undesired decomposition while maintaining a sufficient plating rate.


Patent
Atotech Deutschland Gmbh | Date: 2017-06-07

This invention concerns a method for galvanic metal deposition of a substrate using an anode and an electrolyte, wherein from each of a plurality of electrolyte nozzles a locally confined electrolyte stream is directed towards a part of a substrate surface which is to be treated, wherein a relative movement is carried out between the substrate and the electrolyte stream during deposition, characterized in that a first movement is carried out along a first path, wherein at least along a part of the first path a second movement is carried out along a second path, wherein the first and the second movement each are relative movements between the electrolyte stream and the substrate. Further, the invention concerns a substrate holder reception apparatus and an electrochemical treatment apparatus.


Patent
Atotech Deutschland Gmbh | Date: 2017-04-26

A surface treatment solution for copper and copper alloy surfaces comprising an acid and an oxidising agent characterised in that it further comprises at least one source of chloride ions and at least one source of bromide ions. The surface treatment solution is particularly useful in the manufacturing of printed circuit boards, IC substrates and other electronic appliances.


Patent
Atotech Deutschland Gmbh | Date: 2017-03-01

An aqueous plating bath for the electroless deposition of iron boron alloy coatings, characterized in that it comprises at least one iron ion source, at least one boron based reducing agent, at least one complexing agent, at least one pH buffer and at least one base wherein its pH value is 11 or higher and the molar ratio of the boron based reducing agents in relation to the iron ions in the aqueous plating bath is at least 6:1. Also, a process for the use of said aqueous plating bath is disclosed. The aqueous plating bath according to the invention shows good stability and plating rate and yields glossy and homogeneous iron boron alloy coatings on various substrates. It is an advantage of the plating bath that it does not require any sacrificial anodes.

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