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Kataoka S.,Assembleon Asia Pacific | Klaver E.,Assembleon
Printed Circuit Design and Fab/Circuits Assembly | Year: 2010

The use of laser alignment and novel placement force control ensures the accuracy of 50 μm at 4-Sigma. Laser alignment unit can detect continuous presence to ensure a component stays in its correct placement position until the nozzle moves down to place it. Static electricity affects the position in the tape disappearing, tilting, rotating component and the paper dust influences the overall quality of the end-product, as it can diminish solderability. The advanced algorithms can take measurements and compare them against a measured blueprint to ensure every pick is performed with controlled low forces. The laser alignment can determine whether a 01005 component is attached to the nozzle on-edge or tombstoned, particularly important for resistors. Non-contact positional feedback of components determines position and dimensions by collecting and analyzing the shadows. The low, accurate and stable placement force control is crucial for 01005 placements.


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2012

Traditional wire bonding is changing to direct chip attach and packaging equipment now has to handle a wave of passives. While die bonders can place passive components, they cannot do this at the speed of traditional SMT chip-shooters. Performing this task with packaging equipment is far more costly, and placing micro-miniature components is still a real challenge. These two specialized worlds are now colliding.


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2014

There are many tools and software available that can help reduce the trial and error runs while designing an assembly. A perfect first board would mean that the correct components were all picked from the correct feeder and placed on the correct location at the correct placement angle. This means ensuring that all the many pre-defined variables are correct. Going through the placement program line by line helps correct any deviations immediately. Then, placements exactly match the PCB layout defined by CAD, filtering out any possible mistakes or offsets. Depending on the number of unknown new components, subscriptions to large shape libraries can save considerable work in entering all the component data into local libraries. Data that can be re-used 100% reduces ramp-up time significantly. Manual pin setup can be accomplished faster if done offline or by automating it with automatic placement. Flexible board support systems can give near-zero support setup times and fewer errors when placing components on the first run.


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2013

The push for smaller and smaller components seems to be a never-ending process. How can manufacturers deal with such devices?


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2013

Eric Klaver shares his views on how PCB assembly equipment is expanding. The combined drive for speed, accuracy, reliability and mounting complexity has opened up the other segments to traditional PCBA equipment, which is at the center of all these segments. Technology and standardization have made equipment more accurate and reliable, serving a market that has low cost price as a main target. A large portion of the cost price is driven by the speed of the pick-and-place equipment, as it is a high-volume market. Reducing repeatability and accuracy below 10 microns has also made it possible for pick-and-place machines to break into backend manufacture. Flip chip bonding is growing at a significant rate while wire bonders continue to survive in thee market.


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2012

With 01005 components finding their way onto PCBs, what's next? Even smaller components? Passive manufacturers are indeed looking at 0050025 components along with many more possibilities including wafer-level packaging and imprinting into PCBs. For components, the next step is already here: Embedded components.


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2012

With batch sizes becoming smaller and smaller, much assembly time is wasted by an increased number of setup changes. Time-consuming elements often include loading or unloading feeders, changing feeders and nozzles, tuning and teaching new components, and ramping up. How can such challenges be addressed?


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2013

Eric Klaver suggests that industrial units need to multi-task to carry out maintenance work in their facilities. These include cleaning, lubricating, and attending to standard checklist actions. Performing these actions while production continues will keep machines in better condition than waiting for scheduled maintenance. Eric Klaver states that new tools and technologies need to be used to achieve these objectives. The rapid acceptance of smartphones and tablets mean that they are ideal for smart production environments. These methods are being used for verification and reel replenishment or warning notifications, allowing operators to react on and immediately make corrections. Smartphones and tablets can combine with intelligent maintenance procedures and help in tracking all the required actions and remind certain tasks.


Van Gastel S.,Assembleon
Printed Circuit Design and Fab/Circuits Assembly | Year: 2011

A benchmark study of cost as a function of various yield rates and line capacity was conducted to find the effect of placement yield on rework costs for a printed circuit board (PCB). The actual number of defects that a given production line will produce for a board of a particular complexity iwa also calculated with the help of defects per million opportunities (DPMO) for the line. The first-pass yield gives the percentage of boards with good quality, so (1-FPY) gives the percentage of boards needing repair or rework. Actual savings depend on line capacity, and are almost double for a line placing 200,000 cph vs. one placing 100,000 cph. Rework costs are found to be a factor of 3.5 lower for benchmark pick-and- place machine lines, and that is just in the low-wage countries.


News Article | November 7, 2016
Site: www.newsmaker.com.au

This report studies Surface Mount System in Global market, especially in North America, Europe, China, Japan, Southeast Asia and India, focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering  SONY  Assembleon  Siemens  Panasonic  FUJI  YAMAHA  JUKI  MIRAE  SAMSUNG  EVEST  UNIVERSAL Market Segment by Regions, this report splits Global into several key Regions, with production, consumption, revenue, market share and growth rate of Surface Mount System in these regions, from 2011 to 2021 (forecast), like  North America  Europe  China  Japan  Southeast Asia  India Split by product type, with production, revenue, price, market share and growth rate of each type, can be divided into  Type I  Type II  Type III Split by application, this report focuses on consumption, market share and growth rate of Surface Mount System in each application, can be divided into  Application 1  Application 2  Application 3 Global Surface Mount System Market Research Report 2016  1 Surface Mount System Market Overview  1.1 Product Overview and Scope of Surface Mount System  1.2 Surface Mount System Segment by Type  1.2.1 Global Production Market Share of Surface Mount System by Type in 2015  1.2.2 Type I  1.2.3 Type II  1.2.4 Type III  1.3 Surface Mount System Segment by Application  1.3.1 Surface Mount System Consumption Market Share by Application in 2015  1.3.2 Application 1  1.3.3 Application 2  1.3.4 Application 3  1.4 Surface Mount System Market by Region  1.4.1 North America Status and Prospect (2011-2021)  1.4.2 Europe Status and Prospect (2011-2021)  1.4.3 China Status and Prospect (2011-2021)  1.4.4 Japan Status and Prospect (2011-2021)  1.4.5 Southeast Asia Status and Prospect (2011-2021)  1.4.6 India Status and Prospect (2011-2021)  1.5 Global Market Size (Value) of Surface Mount System (2011-2021) 7 Global Surface Mount System Manufacturers Profiles/Analysis  7.1 SONY  7.1.1 Company Basic Information, Manufacturing Base and Its Competitors  7.1.2 Surface Mount System Product Type, Application and Specification  7.1.2.1 Type I  7.1.2.2 Type II  7.1.3 SONY Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.1.4 Main Business/Business Overview  7.2 Assembleon  7.2.1 Company Basic Information, Manufacturing Base and Its Competitors  7.2.2 Surface Mount System Product Type, Application and Specification  7.2.2.1 Type I  7.2.2.2 Type II  7.2.3 Assembleon Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.2.4 Main Business/Business Overview  7.3 Siemens  7.3.1 Company Basic Information, Manufacturing Base and Its Competitors  7.3.2 Surface Mount System Product Type, Application and Specification  7.3.2.1 Type I  7.3.2.2 Type II  7.3.3 Siemens Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.3.4 Main Business/Business Overview  7.4 Panasonic  7.4.1 Company Basic Information, Manufacturing Base and Its Competitors  7.4.2 Surface Mount System Product Type, Application and Specification  7.4.2.1 Type I  7.4.2.2 Type II  7.4.3 Panasonic Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.4.4 Main Business/Business Overview  7.5 FUJI  7.5.1 Company Basic Information, Manufacturing Base and Its Competitors  7.5.2 Surface Mount System Product Type, Application and Specification  7.5.2.1 Type I  7.5.2.2 Type II  7.5.3 FUJI Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.5.4 Main Business/Business Overview  7.6 YAMAHA  7.6.1 Company Basic Information, Manufacturing Base and Its Competitors  7.6.2 Surface Mount System Product Type, Application and Specification  7.6.2.1 Type I  7.6.2.2 Type II  7.6.3 YAMAHA Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.6.4 Main Business/Business Overview  7.7 JUKI  7.7.1 Company Basic Information, Manufacturing Base and Its Competitors  7.7.2 Surface Mount System Product Type, Application and Specification  7.7.2.1 Type I  7.7.2.2 Type II  7.7.3 JUKI Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.7.4 Main Business/Business Overview  7.8 MIRAE  7.8.1 Company Basic Information, Manufacturing Base and Its Competitors  7.8.2 Surface Mount System Product Type, Application and Specification  7.8.2.1 Type I  7.8.2.2 Type II  7.8.3 MIRAE Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.8.4 Main Business/Business Overview  7.9 SAMSUNG  7.9.1 Company Basic Information, Manufacturing Base and Its Competitors  7.9.2 Surface Mount System Product Type, Application and Specification  7.9.2.1 Type I  7.9.2.2 Type II  7.9.3 SAMSUNG Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.9.4 Main Business/Business Overview  7.10 EVEST  7.10.1 Company Basic Information, Manufacturing Base and Its Competitors  7.10.2 Surface Mount System Product Type, Application and Specification  7.10.2.1 Type I  7.10.2.2 Type II  7.10.3 EVEST Surface Mount System Production, Revenue, Price and Gross Margin (2015 and 2016)  7.10.4 Main Business/Business Overview  7.11 UNIVERSAL

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