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Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2012

Traditional wire bonding is changing to direct chip attach and packaging equipment now has to handle a wave of passives. While die bonders can place passive components, they cannot do this at the speed of traditional SMT chip-shooters. Performing this task with packaging equipment is far more costly, and placing micro-miniature components is still a real challenge. These two specialized worlds are now colliding. Source


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2014

There are many tools and software available that can help reduce the trial and error runs while designing an assembly. A perfect first board would mean that the correct components were all picked from the correct feeder and placed on the correct location at the correct placement angle. This means ensuring that all the many pre-defined variables are correct. Going through the placement program line by line helps correct any deviations immediately. Then, placements exactly match the PCB layout defined by CAD, filtering out any possible mistakes or offsets. Depending on the number of unknown new components, subscriptions to large shape libraries can save considerable work in entering all the component data into local libraries. Data that can be re-used 100% reduces ramp-up time significantly. Manual pin setup can be accomplished faster if done offline or by automating it with automatic placement. Flexible board support systems can give near-zero support setup times and fewer errors when placing components on the first run. Source


Klaver E.,Assembleon
Printed Circuit Design and Fab/Circuits Assembly | Year: 2010

The use of laser alignment and novel placement force control ensures the accuracy of 50 μm at 4-Sigma. Laser alignment unit can detect continuous presence to ensure a component stays in its correct placement position until the nozzle moves down to place it. Static electricity affects the position in the tape disappearing, tilting, rotating component and the paper dust influences the overall quality of the end-product, as it can diminish solderability. The advanced algorithms can take measurements and compare them against a measured blueprint to ensure every pick is performed with controlled low forces. The laser alignment can determine whether a 01005 component is attached to the nozzle on-edge or tombstoned, particularly important for resistors. Non-contact positional feedback of components determines position and dimensions by collecting and analyzing the shadows. The low, accurate and stable placement force control is crucial for 01005 placements. Source


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2012

With batch sizes becoming smaller and smaller, much assembly time is wasted by an increased number of setup changes. Time-consuming elements often include loading or unloading feeders, changing feeders and nozzles, tuning and teaching new components, and ramping up. How can such challenges be addressed? Source


Klaver E.,Assembleon
SMT Surface Mount Technology Magazine | Year: 2012

With 01005 components finding their way onto PCBs, what's next? Even smaller components? Passive manufacturers are indeed looking at 0050025 components along with many more possibilities including wafer-level packaging and imprinting into PCBs. For components, the next step is already here: Embedded components. Source

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