Veldhoven, Netherlands
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Durham, North Carolina headquartered Cree Inc.'s stock finished Tuesday's session 3.52% higher at $22.96. A total volume of 1.74 million shares was traded, which was above their three months average volume of 1.02 million shares. The Company's shares are trading 9.41% below their 50-day moving average. Additionally, shares of Cree, which provides lighting-class light emitting diode, lighting, and semiconductor products for power and radio-frequency applications in the US, China, Europe, South Korea, Japan, Malaysia, Taiwan, and internationally, have a Relative Strength Index (RSI) of 41.03. On April 26th, 2017, research firm Williams Capital Group reiterated its 'Hold' rating on the Company's stock with a decrease of the target price from $27 a share to $25 a share. On May 02nd, 2017, Cree announced C-Lite™ LED Lighting by Cree, a portfolio of LED lighting products that offers electrical distributors and contractors a broad range of stock and flow items with the energy efficiency and performance they expect. The new portfolio complements market-leading Cree® and Essentia® by Cree branded lighting products, making available high-performance, Cree-backed products across market segments. CREE complete research report is just a click away at: On Tuesday, shares in Petaluma, California headquartered Enphase Energy Inc. recorded a trading volume of 615,905 shares. The stock ended the session 1.71% lower at $1.15. The Company's shares have advanced 13.86% on an YTD basis. The stock is trading 12.47% below its 50-day moving average. Moreover, shares of Enphase Energy, which together with its subsidiaries, designs, develops, and sells microinverter systems for residential and commercial markets in the US and internationally, have an RSI of 39.37. On May 02nd, 2017, Enphase Energy announced the availability of Mobile Connect+, its new 4G cellular solar networking solution. Mobile Connect+ includes a 12-year data plan, allowing customers to connect their Enphase-based home energy systems without the need for a dedicated Internet connection. The complimentary report on ENPH can be downloaded at: Veldhoven, the Netherlands headquartered ASML Holding N.V.'s shares closed the day 1.27% higher at $134.96. The stock recorded a trading volume of 438,180 shares. The Company's shares have gained 3.90% in the last month, 10.58% over the previous three months, and 21.48% on an YTD basis. The stock is trading 5.45% and 19.07% above its 50-day and 200-day moving averages, respectively. Additionally, shares of ASML Holding, which through its subsidiaries, engages in the design, manufacture, market, and servicing of semiconductor processing equipment used in the fabrication of integrated circuits, have an RSI of 61.66. On April 20th, 2017, research firm RBC Capital Markets reiterated its 'Sector Perform' rating on the Company's stock with an increase of the target price from $130 a share to $135 a share. On April 28th, 2017, ASML Holding announced that the Company is filing initial legal claims against Nikon for infringement of more than ten patents related to a broad range of products in the fields of semiconductor manufacturing equipment, flat panel display manufacturing equipment, and digital cameras. This follows Nikon's announcement on April 24th, 2017 that it has sued ASML. The latter categorically denies infringing any of Nikon's patents. Sign up for your complimentary report on ASML at: Shares in Santa Clara, California headquartered Ambarella Inc. finished 0.96% higher at $57.98. The stock recorded a trading volume of 358,096 shares. The Company's shares have advanced 6.33% in the last one month, 8.11% in the previous three months, and 7.11% on an YTD basis. The stock is trading above its 50-day moving average by 5.16%. Furthermore, shares of Ambarella, which develops semiconductor processing solutions for video that enable high-definition video capture, sharing, and display worldwide, have an RSI of 63.40. On May 08th, 2017, Ambarella announced that it will hold its Q1 FY18 conference call on Tuesday, June 06th, 2017, at 1:30 p.m. PT. The Company will issue its earnings release after the market closes the same day. A webcast of the conference call will be available at the company's website. Download the research report for free on AMBA at: Stock Callers (SC) produces regular sponsored and non-sponsored reports, articles, stock market blogs, and popular investment newsletters covering equities listed on NYSE and NASDAQ and micro-cap stocks. SC has two distinct and independent departments. 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A semiconductor foundry capable of processing 450mm wafers offers a tremendous economy of scale versus facilities working with smaller-diameter wafers, albeit with large startup costs required for the needed wafer-handling equipment. The larger wafers yield more semiconductor die, assuming that good material quality can be maintained across the surface of the larger wafers. As a rough approximation, only about one-half the wafer starts are required for a 450mm wafer facility compared to a 300mm wafer facility to produce the same number of die. ASML, one of the major equipment suppliers to chip factories, recently decided to stop trying to develop a new generation of machines that could handle 450mm wafers. No one is definitively ruling out 450mm, but even Intel agrees that it is on hold until the end of the decade. TSMC is not as vocal as Intel, but the Taiwan foundry giant is still interested in 450mm, as well. Still others believe 450mm fabs could get pushed out to the 2020 to 2025 timeframe. Now that work is on hold, along with the Intel investment in ASML's 450mm program. Equipment makers need a timely decision in order to move forward with their 450mm tool R&D efforts. This report addresses the timeline of 450mm acceptance based on the different requirements of logic versus memory chips. It also focused on the markets for copper interconnect and low-k dielectric deposition equipment and forecasts. Chapter 3 300/450mm Wafer Issues and Trends 3.1 Introduction 3.2 Industry Consortia 3.3 Benefits of 450mm Wafers 3.4 Requirements For IC Manufacturers 3.5 Impact on Automation 3.5.1 Software 3.6 450mm Wafer Issues 3.6.1 Overview 3.6.2 Economic Challenges Chapter 4 Copper Issues and Trends 4.1 Advantages of Copper 4.2 Copper Processing Challenges 4.3 Metal Deposition 4.3.1 Seed Layer 4.3.2 Bulk Copper Fill 4.4 Barriers 4.5 Planarization 4.6 Metrology 4.7 Competing against Aluminum Damascene 4.8 Copper for 22nm 4.8.1 Low-K and Hard Metal Mask Deposition 4.8.2 Lithography 4.8.3 Etch 4.8.4 Post-etch residue removal 4.8.5 Chemical mechanical polishing 4.9 Equipment Suppliers' Copper Electroplating Products 4.10 Summary 4.10.1 Advantages/Disadvantages of Cu 4.10.2 Processing Issues 4.10.3 Challenges For more information about this report visit http://www.researchandmarkets.com/research/2vlvsk/450mmcopperlowk To view the original version on PR Newswire, visit:http://www.prnewswire.com/news-releases/global-450mmcopperlow-k-convergence-timing-trends-issues-market-analysis-2017---research-and-markets-300457389.html


Butler H.,ASML Inc
IEEE Control Systems Magazine | Year: 2011

Lithographic steppers and scanners are highly complex machines used to manufacture integrated circuits (ICs). These devices use an optical system to form an image of a pattern on a quartz plate, called the reticle, onto a photosensitive layer on a substrate, called the wafer. The circular wafer, having a diameter of 200 or 300 mm, is usually made of silicon. Since one wafer can contain many ICs, typically 100 or more, the wafer needs to be repositioned from exposure to exposure. Exposure itself takes place during a scanning motion of the wafer and the reticle. © 2011 IEEE.


Van Den Brink M.,ASML Inc
Digest of Technical Papers - IEEE International Solid-State Circuits Conference | Year: 2013

Chip makers are increasingly concerned about the shrink and cost. This concern drives different lithography solutions for different products. Two major trends can be observed: aggressive adoption of EUV, or aggressive extension of immersion. Further cost reduction could be achieved by introducing 450mm wafers. © 2013 IEEE.


An actuator to displace, for example a mirror, provides movement with at least two degrees of freedom by varying the currents in two electromagnets (370). A moving part includes a permanent magnet (362) with a magnetic face constrained to move over a working area lying substantially in a first plane perpendicular to a direction of magnetization of the magnet. The electromagnets have pole faces lying substantially in a second plane closely parallel to the first plane, each pole face substantially filling a quadrant of the area traversed by the face of the moving magnet. A ferromagnetic shield (820) is provided around the moving part and has at least one interruption (822) to reduce the influence of adjacent actuators or stray fields whilst also minimizing attraction between the permanent magnet (362) and the shield (820).


A second set of superimposed gratings are superposed over a first set of superimposed gratings. The second set of gratings have a different periodicity from the first set of gratings or a different orientation. Consequently the first order diffraction pattern from the second set of superimposed gratings can be distinguished from the first order diffraction pattern from the first set of superimposed gratings.


Patent
ASML Inc and Carl Zeiss GmbH | Date: 2014-10-01

A holding device for an optical element in an objective has a mount that is connected to the objective, on the one hand, and at least indirectly to the optical element, on the other hand. Arranged between the mount and the optical element is a reinforcing element whose coefficient of thermal expansion corresponds substantially to the coefficient of thermal expansion of the optical element.


Patent
ASML Inc | Date: 2013-02-22

A radiation source includes an uncapped Mo/Si multilayer mirror, and a cleaning apparatus configured to remove a deposition comprising Sn on the uncapped Mo/Si multilayer mirror. The cleaning apparatus is configured to provide a gas comprising one or more of H_(2), D_(2 )and HD and one or more additional compounds selected from hydrocarbon compounds and/or silane compounds in at least part of the radiation source, to produce hydrogen and/or deuterium radicals and radicals of the one or more additional compounds, from the gas, and to supply the hydrogen and/or deuterium radicals and radicals of the one or more additional compounds to the uncapped Mo/Si multilayer mirror to remove at least part of the deposition.


Patent
ASML Inc | Date: 2016-01-21

A substrate stage is used in a lithographic apparatus. The substrate stage includes a substrate table constructed to hold a substrate and a positioning device for in use positioning the substrate table relative to a projection system of the lithographic apparatus. The positioning device includes a first positioning member mounted to the substrate table and a second positioning member co-operating with the first positioning member to position the substrate table. The second positioning member is mounted to a support structure. The substrate stage further comprises an actuator that is arranged to exert a vertical force on a bottom surface of the substrate table at a substantially fixed horizontal position relative to the support structure.


In scatterometry, a merit function including a regularization parameter is used in an iterative process to find values for the scattering properties of the measured target. An optimal value for the regularization parameter is obtained for each measurement target and in each iteration of the iterative process. Various methods can be used to find the value for the regularization parameter, including the Discrepancy Principle, the chi-squared method and novel modifications of the Discrepancy Principle and the chi-squared method including a merit function.

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