Veldhoven, Netherlands
Veldhoven, Netherlands

Time filter

Source Type

Nikon heeft elf octrooi-inbreukzaken tegen ASML aangespannen bij de rechtbank Den Haag in Nederland. Ook spant zij octrooi-inbreukzaken aan tegen ASML bij de rechtbank in Tokio en tegen Carl Zeiss in Mannheim, Duitsland, waar dit bedrijf optische componenten produceert die worden gebruikt in ASML’s immersielithografiesystemen die het onderwerp van deze rechtszaken zijn. Volgens de openbare verslagen die ASML heeft gepubliceerd over het jaar 2016, bestond 76,3% ofwel circa €3,5 miljard van haar totale verkoop in het jaar dat eindigde in december 2016 uit de verkoop van immersielithografiesystemen. Nikon meent dat deze systemen gebruik maken van Nikons geoctrooieerde technologie en zij eist een verbod om de verkoop en distributie van deze systemen door ASML en Zeiss te stoppen alsmede ook een schadevergoeding. Immersielithografietechnologie, die door Nikon werd ontwikkeld aan het begin van de jaren 2000, is tegenwoordig essentieel bij het vervaardigen van state-of-the-art halfgeleiders die worden gebruikt in smartphones, geheugenchips en talloze andere producten. Vandaag de dag zijn ASML en Nikon de enige bedrijven in de wereld die systemen voor immersielithografie produceren en verkopen. “Wij zijn ervan overtuigd dat ASML’s ongeautoriseerde gebruik van Nikons octrooien op onze meest geavanceerde technologieën, waaronder de technologie voor immersielithografie, ASML in staat heeft gesteld om haar lithografie-activiteiten uit te breiden. Het respecteren van intellectueel eigendom is van fundamenteel belang voor eerlijke en gezonde concurrentie, en is essentieel om de innovatie te bevorderen die de samenleving voorziet van de meest vooruitstrevende producten en diensten. Dat is waarom wij hebben besloten deze rechtszaken aan te spannen.” Nikon zag zich eerder genoodzaakt om juridische procedures te starten tegen ASML en Zeiss in verband met ongeautoriseerd gebruik van haar geoctrooieerde technologie. Eerdere zaken in de Verenigde Staten zijn geschikt op voor Nikon gunstige voorwaarden. Nu, dertien jaar later, is Nikon opnieuw voornemens om, krachtig en zover wettelijk mogelijk, maatregelen jegens ASML en Zeiss te nemen waaronder inbreukverboden, om ASML en Zeiss te stoppen om zonder toestemming Nikons intellectuele eigendom te gebruiken, en schadevergoedingen.

EINDHOVEN, 03-May-2017 — /EuropaWire/ — The TU/e team of soccer robots, Tech United, won the final of the Portuguese Robotics Open in Portugal today, beating their Portuguese opponents CAMBADA by a score of 2-0. The Portuguese tournament is the unofficial European Championship for robot soccer. At the end of July the TU/e team will be defending its World title in Japan. Tech United and the home team CAMBADA were clearly the two best teams of the tournament, having both reach the final after seven victories and one draw, against each other when the score was 2-2. In the final the Eindhoven robots quickly raced to 2-0 halfway through the first half (after around 15 minutes), an advantage they held until the last whistle. Despite having to play much of the second half without one of its players, due to a technical hitch, the team still managed to hold on to its lead. “It’s great to win here,” team captain Lotte de Koning said after the match. “It’s gives us confidence heading to the Worlds in Japan.” She felt that the difference with the drawn match earlier against CAMBADA lay in her team’s less predictable play and better ball interceptions. Of particular note is the performance of the Veldhoven team, ASML Falcons, formed just a couple of years ago, which took third spot, beating a number of experienced teams along the way. The ASML team plays with robots derived from those of TU/e. Pictures from the tournament can be found on Flickr: Videos of the tournament are on YouTube:

Butler H.,ASML Inc
IEEE Control Systems Magazine | Year: 2011

Lithographic steppers and scanners are highly complex machines used to manufacture integrated circuits (ICs). These devices use an optical system to form an image of a pattern on a quartz plate, called the reticle, onto a photosensitive layer on a substrate, called the wafer. The circular wafer, having a diameter of 200 or 300 mm, is usually made of silicon. Since one wafer can contain many ICs, typically 100 or more, the wafer needs to be repositioned from exposure to exposure. Exposure itself takes place during a scanning motion of the wafer and the reticle. © 2011 IEEE.

Van Den Brink M.,ASML Inc
Digest of Technical Papers - IEEE International Solid-State Circuits Conference | Year: 2013

Chip makers are increasingly concerned about the shrink and cost. This concern drives different lithography solutions for different products. Two major trends can be observed: aggressive adoption of EUV, or aggressive extension of immersion. Further cost reduction could be achieved by introducing 450mm wafers. © 2013 IEEE.

An actuator to displace, for example a mirror, provides movement with at least two degrees of freedom by varying the currents in two electromagnets (370). A moving part includes a permanent magnet (362) with a magnetic face constrained to move over a working area lying substantially in a first plane perpendicular to a direction of magnetization of the magnet. The electromagnets have pole faces lying substantially in a second plane closely parallel to the first plane, each pole face substantially filling a quadrant of the area traversed by the face of the moving magnet. A ferromagnetic shield (820) is provided around the moving part and has at least one interruption (822) to reduce the influence of adjacent actuators or stray fields whilst also minimizing attraction between the permanent magnet (362) and the shield (820).

A second set of superimposed gratings are superposed over a first set of superimposed gratings. The second set of gratings have a different periodicity from the first set of gratings or a different orientation. Consequently the first order diffraction pattern from the second set of superimposed gratings can be distinguished from the first order diffraction pattern from the first set of superimposed gratings.

ASML Inc and Carl Zeiss GmbH | Date: 2014-10-01

A holding device for an optical element in an objective has a mount that is connected to the objective, on the one hand, and at least indirectly to the optical element, on the other hand. Arranged between the mount and the optical element is a reinforcing element whose coefficient of thermal expansion corresponds substantially to the coefficient of thermal expansion of the optical element.

ASML Inc | Date: 2013-02-22

A radiation source includes an uncapped Mo/Si multilayer mirror, and a cleaning apparatus configured to remove a deposition comprising Sn on the uncapped Mo/Si multilayer mirror. The cleaning apparatus is configured to provide a gas comprising one or more of H_(2), D_(2 )and HD and one or more additional compounds selected from hydrocarbon compounds and/or silane compounds in at least part of the radiation source, to produce hydrogen and/or deuterium radicals and radicals of the one or more additional compounds, from the gas, and to supply the hydrogen and/or deuterium radicals and radicals of the one or more additional compounds to the uncapped Mo/Si multilayer mirror to remove at least part of the deposition.

ASML Inc | Date: 2016-01-21

A substrate stage is used in a lithographic apparatus. The substrate stage includes a substrate table constructed to hold a substrate and a positioning device for in use positioning the substrate table relative to a projection system of the lithographic apparatus. The positioning device includes a first positioning member mounted to the substrate table and a second positioning member co-operating with the first positioning member to position the substrate table. The second positioning member is mounted to a support structure. The substrate stage further comprises an actuator that is arranged to exert a vertical force on a bottom surface of the substrate table at a substantially fixed horizontal position relative to the support structure.

In scatterometry, a merit function including a regularization parameter is used in an iterative process to find values for the scattering properties of the measured target. An optimal value for the regularization parameter is obtained for each measurement target and in each iteration of the iterative process. Various methods can be used to find the value for the regularization parameter, including the Discrepancy Principle, the chi-squared method and novel modifications of the Discrepancy Principle and the chi-squared method including a merit function.

Loading ASML Inc collaborators
Loading ASML Inc collaborators