Singapore, Singapore
Singapore, Singapore

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Patent
ASM Technology Singapore Pte Ltd | Date: 2016-08-26

An optical station for a laser processing device including a plurality of holders for holding respective optical elements; a rotatable magazine having a plurality of accommodation spaces for accommodating the plurality of holders; a positioning device having a holder clamp for clamping and positioning a selected one of the optical elements. a magazine actuator for rotating the magazine; linear shifting means for shifting the magazine in a direction parallel to the optical axis, wherein the magazine is shifted towards the positioning device such that the positioning device lifts the holder from its accommodation space.


Patent
ASM Technology Singapore Pte Ltd. | Date: 2017-03-08

An optical station for a laser processing device comprises:- a plurality of holders for holding respective optical elements;- a rotatable magazine having a plurality of accommodation spaces for accommodating the plurality of holders;- a positioning device having a holder clamp for clamping and positioning a selected one of the optical elements.- a magazine actuator for rotating the magazine;- linear shifting means for shifting the magazine in a direction parallel to the optical axis; The magazine is shifted towards the positioning device such that the positioning device lifts the holder from its accommodation space.


Patent
ASM Technology Singapore Pte Ltd | Date: 2016-04-11

A method is described of radiatively cutting a wafer, the method comprising the steps of low power cutting of two trenches followed by high power cutting of a fissure. A single pulsed radiation beam is split into a first pulsed radiation beam for cutting at least one of the trenches and a second pulsed radiation beam for cutting the fissure. When cutting a fissure on the wafer in a cutting direction along a cutting street, the first and second radiation beams are directed simultaneously with the first radiation beam leading and the second radiation beam trailing. For cutting a fissure in the opposite cutting direction, a third pulsed radiation beam for trenching is split from said single pulsed radiation beam.


Patent
ASM Technology Singapore Pte Ltd | Date: 2015-05-13

A semiconductor package testing apparatus comprises a package holder for holding a semiconductor package and which is positionable together with the semiconductor package at a test contactor station. There are probe pins located at the test contactor station for contacting a bottom surface of the semiconductor package and which are configured to apply an upwards force on the semiconductor package during testing of the semiconductor package. A restraining mechanism that is movable from a first position remote from the package holder and a second position over the package holder is configured to restrict lifting of the semiconductor package by the probe pins during testing of the semiconductor package when the restraining mechanism is at its second position.


Patent
ASM Technology Singapore Pte Ltd. | Date: 2016-11-30

A die bonding apparatus (10) comprises a first inert gas container (40) having a first inert gas concentration and a second inert gas container (50) having a second inert gas concentration enclosed within the first inert gas container (40). The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus (10) further comprises a bond head (52) located in the second inert gas container (50) for receiving a die (24) for bonding and a third inert gas container (80) having an inert gas environment that is separate from the first and second inert gas containers (40, 50) and where a substrate (26) is locatable for die bonding. The bond head (52) is operative to move the die (24) between a first position within the second inert gas container (50) and a second position within the third inert gas container (80) to bond the die (24) onto the substrate (26) located in the third inert gas container (80). The third inert gas container (80) may comprise a portion of a bond stage (60) enclosed by the walls (62) on the sides, by a bond stage pedestal (66) on the bottom and by the first inert gas container (40) base plate (42) on the top. The bond stage (60) is movable for receiving the substrate (26) to be processed and below the first inert gas container (40). The bond stage walls (62) may comprise a plurality of inert gas outlets (64, 68, 69) for expelling inert gas towards the first inert gas container (40) to form an air curtain to restrict ambient air from entering the third inert gas container (80).


Patent
ASM Technology Singapore Pte Ltd | Date: 2015-06-25

A method of dicing a plurality of integrated devices included in a semiconductor substrate using laser energy comprises the steps of directing a first laser beam onto a cutting line along the substrate to ablate a portion of the substrate located along the cutting line to be diced, the portion of the substrate that is ablated forming a recast material adjacent to the cutting line of the substrate that has been diced. A second laser beam is directed onto another portion of the substrate adjacent to the cutting line to conduct heat processing of the recast material formed adjacent to the cutting line.


Patent
ASM Technology Singapore Pte Ltd | Date: 2016-05-20

A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.


Patent
Asm Technology Singapore Pte Ltd | Date: 2015-03-16

A method of feeding underfill material to fill a space between a semiconductor die and a substrate onto which the semiconductor die has been bonded, the method comprises positioning a stencil over the semiconductor die. The stencil has an elongated slot extending adjacent to an edge of the semiconductor die. Underfill material is printed through the slot such that the underfill material falls through the slot onto the substrate next to the edge of the semiconductor die. Thereafter, the underfill material is heated such that the underfill material flows across the space between the semiconductor die and the substrate from the edge of the semiconductor die to an opposite edge thereof through capillary action.


Patent
ASM Technology Singapore Pte Ltd. | Date: 2016-01-20

A method of dicing a plurality of integrated devices included in a semiconductor substrate using laser energy comprises the steps of directing a first laser beam onto a cutting line along the substrate to ablate a portion of the substrate located along the cutting line to be diced, the portion of the substrate that is ablated forming a recast material adjacent to the cutting line of the substrate that has been diced. A second laser beam is directed onto another portion of the substrate adjacent to the cutting line to conduct heat processing of the recast material formed adjacent to the cutting line.


Patent
ASM Technology Singapore Pte Ltd | Date: 2015-07-20

A wire bonding apparatus comprises an ultrasonic transducer including a capillary, a flexible connecting frame having a first side to which the ultrasonic transducer is connected and at least one electrically-driven actuator which is connected to a second side of the flexible connecting frame that is opposite to the first side thereof, the actuator having a longitudinal actuation direction. An elongated slit located in the flexible connecting frame extends substantially transversely to the actuation direction of the at least one actuator to form at least one pivot point adjacent to an end of the slit about which the flexible connecting frame is rotatable when it is driven by the at least one actuator.

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