ASM International, formerly known as the American Society for Metals, is a professional organization for materials scientists and engineers. Their website defines the society as an engineering and scientific community, "led by its members, guided by the members needs and fueled by member participation," sharing information and ideas through local chapter meetings, international conferences and expositions, affiliate societies, education courses and various technical publications Wikipedia.
ASM International | Date: 2015-06-11
Metallic layers can be selectively deposited on one surface of a substrate relative to a second surface of the substrate. In some embodiments, the metallic layers are selectively deposited on copper instead of insulating or dielectric materials. In some embodiments, a first precursor forms a layer on the first surface and is subsequently reacted or converted to form a metallic layer. The deposition temperature may be selected such that a selectivity of above about 50% or even about 90% is achieved.
ASM International | Date: 2015-07-31
In one aspect, methods of silicidation and germanidation are provided. In some embodiments, methods for forming metal silicide can include forming a non-oxide interface, such as germanium or solid antimony, over exposed silicon regions of a substrate. Metal oxide is formed over the interface layer. Annealing and reducing causes metal from the metal oxide to react with the underlying silicon and form metal silicide. Additionally, metal germanide can be formed by reduction of metal oxide over germanium, whether or not any underlying silicon is also silicided. In other embodiments, nickel is deposited directly and an interface layer is not used. In another aspect, methods of depositing nickel thin films by vapor phase deposition processes are provided. In some embodiments, nickel thin films are deposited by ALD.
ASM International | Date: 2015-12-15
Atomic layer deposition apparatus for depositing a film in a continuous fashion. The apparatus includes a process tunnel, extending in a transport direction and bounded by at least a first and a second wall. The walls are mutually parallel and allow a flat substrate to be accommodated there between. The apparatus further includes a transport system for moving a train of substrates or a continuous substrate in tape form, through the tunnel. At least the first wall of the process tunnel is provided with a plurality of gas injection channels that, viewed in the transport direction, are connected successively to a first precursor gas source, a purge gas source, a second precursor gas source and a purge gas source respectively, so as to create a tunnel segment thatin usecomprises successive zones containing a first precursor gas, a purge gas, a second precursor gas and a purge gas, respectively.
ASM International | Date: 2015-10-13
Atomic layer deposition (ALD) processes for forming Te-containing thin films, such as SbTe, GeTe, GeSbTe, BiTe, and ZnTe thin films are provided. ALD processes are also provided for forming Se-containing thin films, such as SbSe, GeSe, GeSbSe, BiSe, and ZnSe thin films are also provided. Te and Se precursors of the formula (Te,Se)(SiR
ASM International | Date: 2015-07-29
Methods of producing metal-containing thin films with low impurity contents on a substrate by atomic layer deposition (ALD) are provided. The methods preferably comprise contacting a substrate with alternating and sequential pulses of a metal source chemical, a second source chemical and a deposition enhancing agent. The deposition enhancing agent is preferably selected from the group consisting of hydrocarbons, hydrogen, hydrogen plasma, hydrogen radicals, silanes, germanium compounds, nitrogen compounds, and boron compounds. In some embodiments, the deposition-enhancing agent reacts with halide contaminants in the growing thin film, improving film properties.