Batavia, IL, United States
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Deptuch G.W.,ASIC Development Group | Carini G.,SLAC | Collier T.,CVInc | Grybos P.,AGH University of Science and Technology | And 6 more authors.
IEEE Transactions on Nuclear Science | Year: 2015

The VIPIC1 readout integrated circuit was designed for X-ray Photon Correlation Spectroscopy experiments that are typically performed using mono-energetic (8 keV) X-rays at a synchrotron radiation facility. The device is a pixel detector with sparsification and parallel readout from the groups, yielding high timing resolution. Recent improvements in bonding alignment of wafers resulted in deliveries of 3D bonded wafers. The stacks, bonded with both the Cu-Cu thermo-compression method and the Cu DBI bonding method, yielded operational devices that have been tested. Chips (with a pixel pitch of 80μm) were also bonded to silicon pixelated sensors (with a pixel pitch of 100 μm) and the assemblies were exposed to X-ray sources for the first time. The paper focuses on the test results, including the calibrated noise (ENC) and the conversion gain. The noise measured corresponded to 39 e- and 70 e-, respectively for the readout channels that were not connected and connected to the sensor diodes. The conversion gain varied from 43 to 52 μV/e- as a function of the bias current in the front-end block. Essentially all the pixels on a small prototype were operational. © 2015 IEEE.


Deptuch G.W.,ASIC Development Group | Carini G.,SLAC | Grybos P.,AGH University of Science and Technology | Kmon P.,AGH University of Science and Technology | And 5 more authors.
IEEE Transactions on Nuclear Science | Year: 2014

The Vertically Integrated Photon Imaging Chip (VIPIC) project explores opportunities of the three-dimensional integration for imaging of X-rays. The design details of the VIPIC1 chip are presented and are followed by results of testing of the chip. The VIPIC1 chip was designed in a 130 nm process, in which through silicon vias are embedded right after the front-end-of-line processing. The integration of tiers is achieved by the Cu-Cu thermo-compression or Cu-based oxide-oxide bonding. The VIPIC1 readout integrated circuit was designed for high timing resolution, pixel based, X-ray Photon Correlation Spectroscopy experiments typically using 8 keV X-rays at a synchrotron radiation facility. The design was done for bonding a Silicon pixel detector, however other materials can be serviced as long as the positive polarity of charge currents is respected. © 1963-2012 IEEE.


Deptuch G.W.,ASIC Development Group | Trimpl M.,ASIC Development Group | Yarema R.,ASIC Development Group | Siddons D.P.,Brookhaven National Laboratory | And 6 more authors.
IEEE Nuclear Science Symposium Conference Record | Year: 2010

We report on the design of the VIPIC IC (Vertically Integrated Pixel Imaging Chip) designed for X-ray Photon Correlation Spectroscopy (XPCS) experiments by FNAL in collaboration with AGH-UST. The VIPIC chip is a prototype matrix with 64 64 pixels with 80 m 80 m pixel size and consists of two layers: analog and digital. The single analog pixel cell consists of a charge sensitive amplifier, a shaper, a single current discriminator and trim DACs. The simulated gain is 52 V/e+, the noise ENC 150 e+ rms (with C det 100 fF) and the peaking time tp 250 ns. The power consumption is 25 W/pixel in the analog part. The digital layer of the VIPIC integrated circuit is divided into 16 readout groups of pixels read out in parallel via separate serial ports with nominal frequency of the 100 MHz clock using the LVDS standard. The readout within each group is zero-suppressed. The sparsification scheme (addresses of hit pixels only) allows a dead-time free readout. © 2010 IEEE.

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