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Patent
Asia Vital Components Co. | Date: 2015-10-13

A latch device for heat dissipation unit is applied to and mounted on a motherboard in tight contact with at least one heat source. The latch device includes a heat sink, a first elastic abutment member having a first protrusion block and a second elastic abutment member having a second protrusion block. A first latch member and a second latch member are disposed on two opposite sides of the heat sink. The first and second latch members are freely latchable with the corresponding first and second protrusion blocks or unlatchable from the corresponding first and second protrusion blocks. Accordingly, along with the latching or unlatching, the first and second elastic abutment members are elastically deformed into abutment against or out of abutment with the other face of the heat sink. Therefore, the heat sink can be easily and securely fixed on or detached from the motherboard.


Patent
Asia Vital Components Co. | Date: 2015-10-13

A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.


Patent
Asia Vital Components Co. | Date: 2015-10-06

A stator fixing structure includes a tube and a fixing member. The tube has an outer surface, and both a stator set and the fixing member are fitted around the tube in a bottom-up sequence. The fixing member has a main body, which has a contact surface and an engaging unit. The engaging unit is circumferentially extended from the main body towards a center of the main body to form a plurality of free ends to tightly press against the outer surface of the tube. The contact surface is axially tightly in contact with the stator set to prevent the stator set from sliding.


Patent
Asia Vital Components Co. | Date: 2015-10-06

A knockdown heat dissipation unit includes at least one combination body and multiple heat pipes. The combination body has two opposite connection sections. The heat pipes are respectively connected with the connection sections of the combination body to form a large area of thermal contact face. According to the structural design of the knockdown heat dissipation unit, the number of the heat pipes can be increased or reduced according to the heat dissipation requirement of a user. Also, the number of the heat pipes can be flexibly adjusted according to the size of a heat source to enhance the heat dissipation effect.


Patent
Asia Vital Components Co. | Date: 2015-10-27

A water-cooling device includes a liquid reservoir main body having a heat exchange chamber, a pump having a stator and a rotor and a heat exchange component connected with the liquid reservoir main body. The heat exchange chamber is for a cooling liquid to pass through. The rotor is connected with an impeller and exposed to the cooling liquid in the heat exchange chamber. The stator is integrally embedded in the liquid reservoir main body by embedded injection molding. The stator is isolated from the heat exchange chamber. According to the design of the water-cooling device, the structural strength of the liquid reservoir main body is enhanced and a waterproof effect for the stator is achieved.


Patent
Asia Vital Components Co. | Date: 2016-01-11

A combination structure of heat dissipation module includes a heat dissipation set and at least one heat pipe, which is extended through the heat dissipation set. The heat dissipation set includes a first, a second, and a third portion, which are located respectively corresponding to a heat-dissipation section, a curved section, and a heat-absorption section of the heat pipe. The second and the third portion of the heat dissipation set are respectively provided with a plurality of second and third slots, which are gradually extended according to a length of the curved section and a horizontal length of the heat-absorption section of the heat pipe, and the third portion internally defines a receiving opening communicable with the third slots, so as to effectively remove heat through using the curved section of the heat pipe.


Patent
Asia Vital Components Co. | Date: 2015-07-20

A water cooling device with detachably assembled modularized units includes at least one modularized pump unit and at least one modularized heat exchange unit. Different number of the modularized heat exchange unit can be detachably assembled to the modularized pump unit according to the number of heat sources to be cooled.


Patent
Asia Vital Components Co. | Date: 2015-04-02

A manufacturing method of flat-plate heat pipe includes steps of: providing a first board body, a second board body and a capillary structure; selectively affixing the capillary structure to the first board body or the second board body; overlapping and mating the first and second board bodies with each other and sealing the open peripheries of the first and second board bodies to form a flat tubular main body with a reserved air-sucking and water-filling section; and vacuuming the flat tubular main body and filling working fluid into the flat tubular main body and sealing the air-sucking and water-filling section. By means of the manufacturing method of the flat-plate heat pipe, the flat-plate heat pipe can be formed with a thin thickness. After the flat-plate heat pipe is thinned, the flat-plate heat pipe still has a complete vapor passage.


Patent
Asia Vital Components Co. | Date: 2015-06-25

A flexible and transformable water-cooling device includes a liquid reservoir case and a heat exchange unit. The liquid reservoir case is for a cooling liquid to pass therethrough. The liquid reservoir case has a flexible section, which can be flexed. The flexible section has a first end and a second end opposite to each other. A first region outward extends from the first end. The heat exchange unit is disposed in the first region and has multiple radiating fins in contact with the cooling liquid passing through the first region. Due to the flexibility of the flexible section of the water-cooling device, the water-cooling device can be freely flexed and transformed in accordance with an existent space in an electronic device. Therefore, the water-cooling device can be adaptively disposed in the electronic device.


Patent
Asia Vital Components Co. | Date: 2015-06-25

A bendable water-cooling device includes: a pump unit having a pump case and a driver. The pump case has a pump chamber, a first inlet and a first outlet. The pump case is formed with a first pivotal connection section on the same side as the first outlet; a heat exchange unit having a liquid reservoir case and a heat dissipation member, the liquid reservoir case having a heat exchange chamber, a second inlet and a second outlet, the liquid reservoir case being formed with a second pivotal connection section on the same side as the second inlet; and a pivot unit having a first mating section and a second mating section respectively pivotally connected with the first and second pivotal connection sections. The pump unit and the heat exchange unit are bendable around the pivot unit from a horizontal position to an upper and lower overlapping position.

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