Asia Vital Components Co.

Taipei, Taiwan

Asia Vital Components Co.

Taipei, Taiwan
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Patent
Asia Vital Components Co. | Date: 2017-04-21

A thermal module is disclosed. The thermal module includes a radiating fin assembly and a base. The base has a bottom and a plurality of slot vertically extending through the base in a thickness direction thereof. The radiating fin assembly includes a plurality of radiating fins, each of which has a heat-dissipation end and a heat-absorption end. The heat-absorption ends are correspondingly extended through the slots and bent to bear on the bottom for contacting with a heat-producing element. Heat produced by the heat-producing element is absorbed by the heat-absorption ends and directly transferred from the heat-absorption ends to the heat-dissipation ends without the problem of thermal resistance. Therefore, upgraded heat transfer efficiency and excellent heat dissipation effect can be achieved with the thermal module.


Patent
Asia Vital Components Co. | Date: 2016-01-11

A combination structure of heat dissipation module includes a heat dissipation set and at least one heat pipe, which is extended through the heat dissipation set. The heat dissipation set includes a first, a second, and a third portion, which are located respectively corresponding to a heat-dissipation section, a curved section, and a heat-absorption section of the heat pipe. The second and the third portion of the heat dissipation set are respectively provided with a plurality of second and third slots, which are gradually extended according to a length of the curved section and a horizontal length of the heat-absorption section of the heat pipe, and the third portion internally defines a receiving opening communicable with the third slots, so as to effectively remove heat through using the curved section of the heat pipe.


An internal frame structure with heat insulation effect and an electronic apparatus with the internal frame structure. The internal frame includes a main body and a frame unit. A heat insulation layer is formed between the main body and the frame unit and positioned on at least two opposite sides of the main body. The heat insulation layer has a first side connected with the main body and a second side connected with the frame unit. The heat insulation layer serves to insulate the heat of the main body from being transferred to the frame unit.


An internal frame structure with heat isolation effect and an electronic apparatus with the internal frame structure. The internal frame is applied to the electronic apparatus. The internal frame includes a main body and a frame unit. The frame unit includes an inner layer, an outer layer and a heat isolation layer positioned between the inner layer and the outer layer. The inner layer is adjacently connected with the main body. The outer layer is positioned on an outermost side of the frame unit. The heat isolation layer serves to isolate the heat of the main body from being transferred to the outer layer of the frame unit.


Patent
Asia Vital Components Co. | Date: 2015-09-17

A method is disclosed for manufacturing a heat dissipation device including a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate due to secondary processing, so as to have reduced manufacturing costs and provide uniform temperature effect.


Patent
Asia Vital Components Co. | Date: 2015-08-07

A heat dissipation device includes a covering member, a heat pipe, and a heat dissipation unit. The covering member has a hollow C-shaped fitting portion, in which the heat pipe is fitted to tightly connect to the covering member. At least one first heat transfer portion is outwardly extended from a periphery of the C-shaped fitting portion of the covering member. The heat dissipation unit has a plurality of parallelly spaced heat radiation fins, each of which has a through hole formed thereon, and at least one first locating slot is outwardly extended from the through hole. When the C-shaped fitting portion and the first heat transfer portion are respectively extended through the through holes and the first locating slots, the covering member is connected to the heat dissipation unit. With the first heat transfer portion, the heat dissipation device can have enhanced heat transfer and dissipation effect.


Patent
Asia Vital Components Co. | Date: 2015-09-04

A heat insulation structure for hand-held device includes a holding body disposed in a hand-held device. The holding body has a frame and internally defines a receiving space, in which a holding section is provided. A heat insulation space is formed between the frame and the holding section. The frame and the holding section are connected to each other via at least one connecting member. With the heat insulation space formed between the frame and the holding section, the heat insulation structure for hand-held device provides effective heat dissipation effect to prevent a hand-held device from burning a users hand due to heat produced by electronic elements in the had-held device.


Patent
Asia Vital Components Co. | Date: 2015-09-04

A switch drive circuit capable of saving timers of fan processor is applied to a processor. The switch drive circuit includes multiple upper arm switch components, multiple lower arm switch components correspondingly electrically connected with the upper arm switch components, a first drive control unit and a second drive control unit. The upper arm switch components are driven by a first pulse width modulation signal and a second pulse width modulation signal. The first and second drive control units serve to receive a third pulse width modulation signal and a high-frequency pulse width modulation signal. The third pulse width modulation signal is switched between a high-level state and a low-level state to trigger and turn on the lower arm switch components.


Patent
Asia Vital Components Co. | Date: 2015-09-17

A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.


Patent
Asia Vital Components Co. | Date: 2015-08-07

A thermal module includes a heat pipe and a heat dissipation unit. The heat pipe has a main body and at least one first heat conduction section integrally radially and axially extending from a circumference of the main body. The heat dissipation unit has multiple radiating fins. The radiating fins are arranged at intervals. Each radiating fin is formed with a perforation. At least one first locating slit outward extend from the perforation. The main body and the first heat conduction section are respectively correspondingly fitted through the perforations and the first locating slits to tightly connect the heat pipe with the heat dissipation unit. The first heat conduction section of the heat pipe provides much larger heat conduction area for the heat pipe so that the heat conduction effect of the heat dissipation unit is greatly enhanced and the heat dissipation performance and efficiency are enhanced.

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