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Nagpal R.,ASET | Bhatia P.,G.J.U.
2010 International Conference on Computer and Communication Technology, ICCCT-2010 | Year: 2010

Today a major drift is observed from static website to dynamic websites. The dynamic websites deliver the customized contents to their users. These websites cover a wide spectrum of applications which largely vary in its content, configuration and volume of traffic. The popular metrics designed to evaluate a dynamic website are response time, user satisfaction, performance, scalability, usability, personalization, reliability, reusability and security. But for dynamic website delivery, update, consistency maintenance are main hurdles. To overcome them and to serve and deliver the contents efficiently for dynamic website researchers have proposed several caching mechanisms with an aim to reduce the construction overhead to improve the response time as well as reusability of its contents. A great research has been performed on various aspects of caching. Based on these the caching techniques are classified depending on its location, content, replacement, replication and updation strategy and many more. A caching technique can be suitable for one website and may not be effective for other website, depending upon the configuration, content and application of website one should choose the suitable caching technique. Thus a need of designing a set of metrics on which these caching techniques can be evaluated is much required. In this paper we will study about the classification of caching techniques and then discuss the issues related to caching and various criteria on which metrics are needed to be designed to evaluate the effectiveness of caching techniques. ©2010 IEEE.

Kumari R.,Gd Goenka World Institute | Gambhir D.,ASET | Kumar V.,Asia Pacific Institute of Management
2014 International Conference on Signal Processing and Integrated Networks, SPIN 2014 | Year: 2014

Restoration of the image corrupted by impulse noise is proposed in this paper. Adaptive neuro fuzzy inference system (ANFIS) has been used to detect the impulse noisy pixels to keep preserve the fine details of the image. Feed-forward neural network with resilient backpropagation method is used to estimate the value of the pixel by which the corrupted pixel is replaced by the estimated value. Proposed method is experimented on some popular test images and the results are shown for visual analysis as well as for quantitative measures. © 2014 IEEE.

Murugesan M.,NICHE | Kobayashi H.,ASET | Shimamoto H.,ASET | Yamada F.,ASET | And 5 more authors.
Technical Digest - International Electron Devices Meeting, IEDM | Year: 2012

One of the most serious reliability issues, the local deformation produced in the stacked LSI die/wafer with respect to the die thickness and the sub-surface structures formed after several stress-relief methods are systematically and extensively studied. From the electron backscatter diffraction (EBSD) analysis, a more than one degree (>1°) of local misorientation is created in the stacked LSI Si around μ-bump region. This induces a large tensile stress above the μ-bump region and relatively small compressive stress in the bump-space region, which leads to an enhancement in the n-MOSFET mobility in the μ-bump region and decrease in mobility at bump-space region. As compared to CuSn system, the InAu μ-bump induced huge amount of tensile stress (> 300 MPa) in the stacked LSI die even for the bonding temperature of 200 °C. The groove structures or scratches found at the background surface after stress relief by plasma etching (PE) or Dry Polishing (DP) severely deteriorates the device characteristics after stacking, owing to the enhanced local deformation as against the stress relief method of chemical mechanical polishing (CMP). Even after 500 cycles of temperature cycle (TC) test, a 20 μm-width Cu-TSV array with 40- μm pitch values induces not only around -570 MPa of compressive stress in the stacked LSI die, but also a large variation in the induced stress values between different TSVs in the same array. For the LSI die/wafer thickness of anything less than 50 μm, the Young modulus (E) and Hardness (H) of the thinned die no longer behaves like a bulk single crystal Si, which severely increases the reliability risks in the highly integrated 3D-LSIs. © 2012 IEEE.

Murugesan M.,NICHE | Nohira H.,Tokyo City University | Kobayashi H.,ASET | Fukushima T.,NICHE | And 2 more authors.
Proceedings - Electronic Components and Technology Conference | Year: 2012

Induced local stress arising from local deformation of top silicon die in the vertically stacked LSI die has been investigated via x-ray photoelectron spectroscopy (XPS) and micro-Raman spectroscopy (μRS). The large positive shift in the core level Si-2s and Si-2p XP spectra for the thinned die revealed that thinned dies were under heavy stress/strain even before stacking. The core level binding energy shift, ΔEb for Si-1s core level and the relative chemical shift ΔEr for Si in the vertically integrated die system showed that the stacked Si dies were under different stresses in the μ-bump and the bump-space regions. It was also inferred from the μRS results that the stacked 10 μm-thick-Si dies were under large tensile strain of >1.5 GPa and a relatively small compressive stress of ∼0.5 GPa in the μ-bump and bump-space region, respectively. © 2012 IEEE.

Nagal R.,ASET | Kumar P.,Amity University | Bansal P.,MSIT
Proceedings of the 5th International Conference on Confluence 2014: The Next Generation Information Technology Summit | Year: 2014

This paper presents the implementation of adaptive algorithms like Least Mean Square (LMS) and Normalized Least Mean Square (NLMS) in the frequency domain and their comparison to that implemented in the time domain. Adaptive filtering using adaptive algorithm in frequency domain can be done by taking Fourier Transform of input signal and independent weigh coefficient. By frequency domain approach significant reduction in mathematical computation has been achieved. An expression for updating the weights is implemented in the frequency domain and statistical analysis has been performed. The SNR (Signal to Noise Ratio) is a parameter used to evaluate the performance with different step size. The signal power and noise power has also been calculated using MATLAB. The SNR of output signal rises about 8-9 times in frequency domain than the time domain. © 2014 IEEE.

Verma S.,ASET | Kumar S.,Thapar University
International Journal of Physical Sciences | Year: 2011

The key issue of applying Turbo codes is to find an efficient implementation of turbo decoder. This paper addresses the implementation of a simplified and efficient turbo decoder in field programmable gate array (FPGA) technology. A simplified and efficient implementation of a Turbo decoder with minor performance loss has been proposed. An integer Turbo decoder based on the standard 2's complement number system after considering the issues of dynamic range, truncation effect and other algorithm related subjects has been introduced. The efficient implementation comes from algorithm modification, integer arithmetic and compact hardware management. Based on the Max-Log-MAP decoding algorithm, the branch metric is modified by weighting a priori value, resulting in a significant BER improvement. The Turbo decoder takes in 8-level integer inputs generates 7-bit soft-decisions and calculates all metrics on integers, avoiding complex floating point or fixed-point arithmetic. By manipulating memory address, delay associated with interleaving and de-interleaving is eliminated, resulting in much higher throughput. Also, by taking advantage of identical decoder function, Turbo decoder is implemented in a single-decoder structure, making efficient use of memory and logic cells. © 2011 Academic Journals.

Malhotra Y.,ASET | Kaler R.S.,Thapar University
Optik | Year: 2012

We investigate the performance of the Super Dense Wavelength Division Multiplexed (SDWDM) systems with high spectral efficiency and narrow spacing of the channels and optimization in terms of bit rate up to 15 Gbps, channel spacing as low as 12.5 GHz, number of channels up to 64 and repeater less transmission distance up to 100 km and report high capacity SDWDM systems. We demonstrate the minimal allowed channel spacing and provide recommendations for future SDWDM solutions. The simulation results have shown that the minimum channel spacing for 15 Gbps, 32 channel system need to be not less than 0.35 nm and that for a 10 Gbps system it should be not less than 0.25 nm. The 5 Gbps system gives acceptable results at spacing of 0.1 nm for maximum up to single span of 80 km. © 2011 Elsevier GmbH. All rights reserved.

Bai B.K.,ASET | Mittal A.,ASET | Mittal S.,ASET
Communications in Computer and Information Science | Year: 2011

In this infrared source tracking robot system, a target has a light emitting section with a high light emitting directivity, for emitting a light beam modulated into pulses. A tracking robot has a tracking sensor section for monitoring a light beam by a pair of light receiving elements, for processing signals from the received light beam, and for generating and supplying drive control signals to a travel control section. In response to drive control signals the travel control section generates and supplies drive signals to a driver section. The driver section drives the tracking robot so that the robot advances while turning to the right when the output level of the right side light receiving element is higher than that of the left side light receiving element, and to the left when the latter is higher than the former. There are basically two modes, the first being the one in which the robot transmits the path sequence to the computer while tracking the source. In the second mode, the computer transmits the remembered path sequence to the robot which travels along the path guided by the computer signals, without any infrared source assistance. © 2011 Springer-Verlag.

Kiran M.M.,JNTUH College of Engineering | Kohitha Bai B.,ASET
Communications in Computer and Information Science | Year: 2011

Electronics has been reaching to new fronts. Even Agriculture has benefited from this, keeping in the view the basic needs of farmers, horticulture, several advancements have been proposed that could use the electronics exhaustively. The complete thesis is prepared on the basis of analog circuitry. We have used analog circuitry purposefully, as the farmer could relax with this "once and for all" installation. Auto irrigation is the method of application of precise amount of water automatically as per crop requirement through saving resources like water, power, and fertilizer. Also, we have shown how the basic electronic devices can be made to work in horticulture. Some devices like photo transistor, IR LED have been used, which are robust, and very cheap. Going for analog circuitry has another reason. It is extremely cost effective. © 2011 Springer-Verlag.

Verma A.,ASET
Proceedings of the 2013 International Conference on Green Computing, Communication and Conservation of Energy, ICGCE 2013 | Year: 2013

Since last few years, security systems are getting more awareness and importance. A Multi Layer Bank Security System is a system for validating, monitoring and controlling the security at bank locker rooms. Today, there are many banks using authorize access control approach to prevent the locker room from unauthorized access. In this paper highly reliable, multi level and most efficient locker room security system has been designed. The system includes a biometric system, i.e. a fingerprint scanner and an iris scanner, which are responsible for the security of the main door of the locker room and the system also includes a RFID system to provide access of the locker room area to only authorize people. To monitor the unauthorized people in the locker room area a passive infrared sensor is fixed. In case of any unauthorized motion the picture from the camera will be mailed to security officials and the alarms will be on to inform the local security. The system proposed in this paper is a better security system in terms of number of level of security. © 2013 IEEE.

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