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News Article | July 12, 2017
Site: marketersmedia.com

Global Flip Chip market competition by top manufacturers, with production, price, revenue (value) and market share for each manufacturer; the top players including Geographically, this report is segmented into several key Regions, with production, consumption, revenue (million USD), market share and growth rate of Flip Chip in these regions, from 2012 to 2022 (forecast), covering United States EU China Japan South Korea Taiwan On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into Memory High Brightness, Light-Emitting Diode (LED) RF, Power and Analog ICs Imaging 2D Logic Soc On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate of Flip Chip for each application, including Medical Devices Industrial Applications Automotive GPUs and Chipsets Smart Technologies Robotics Electronic Devices At any Query @ https://www.wiseguyreports.com/enquiry/894515-global-flip-chip-market-research-report-2017 Table of Contents Global Flip Chip Market Research Report 2017 1 Flip Chip Market Overview 1.1 Product Overview and Scope of Flip Chip 1.2 Flip Chip Segment by Type (Product Category) 1.2.1 Global Flip Chip Production and CAGR (%) Comparison by Type (Product Category) (2012-2022) 1.2.2 Global Flip Chip Production Market Share by Type (Product Category) in 2016 1.2.3 Memory 1.2.4 High Brightness, Light-Emitting Diode (LED) 1.2.5 RF, Power and Analog ICs 1.2.6 Imaging 1.2.7 2D Logic Soc 1.3 Global Flip Chip Segment by Application 1.3.1 Flip Chip Consumption (Sales) Comparison by Application (2012-2022) 1.3.2 Medical Devices 1.3.3 Industrial Applications 1.3.4 Automotive 1.3.5 GPUs and Chipsets 1.3.6 Smart Technologies 1.3.7 Robotics 1.3.8 Electronic Devices 1.4 Global Flip Chip Market by Region (2012-2022) 1.4.1 Global Flip Chip Market Size (Value) and CAGR (%) Comparison by Region (2012-2022) 1.4.2 United States Status and Prospect (2012-2022) 1.4.3 EU Status and Prospect (2012-2022) 1.4.4 China Status and Prospect (2012-2022) 1.4.5 Japan Status and Prospect (2012-2022) 1.4.6 South Korea Status and Prospect (2012-2022) 1.4.7 Taiwan Status and Prospect (2012-2022) 1.5 Global Market Size (Value) of Flip Chip (2012-2022) 1.5.1 Global Flip Chip Revenue Status and Outlook (2012-2022) 1.5.2 Global Flip Chip Capacity, Production Status and Outlook (2012-2022) 7 Global Flip Chip Manufacturers Profiles/Analysis 7.1 ASE Group 7.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.1.2 Flip Chip Product Category, Application and Specification 7.1.2.1 Product A 7.1.2.2 Product B 7.1.3 ASE Group Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.1.4 Main Business/Business Overview 7.2 Amkor 7.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.2.2 Flip Chip Product Category, Application and Specification 7.2.2.1 Product A 7.2.2.2 Product B 7.2.3 Amkor Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.2.4 Main Business/Business Overview 7.3 Intel Corporation 7.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.3.2 Flip Chip Product Category, Application and Specification 7.3.2.1 Product A 7.3.2.2 Product B 7.3.3 Intel Corporation Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.3.4 Main Business/Business Overview 7.4 Powertech Technology 7.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.4.2 Flip Chip Product Category, Application and Specification 7.4.2.1 Product A 7.4.2.2 Product B 7.4.3 Powertech Technology Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.4.4 Main Business/Business Overview 7.5 STATS ChipPAC 7.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.5.2 Flip Chip Product Category, Application and Specification 7.5.2.1 Product A 7.5.2.2 Product B 7.5.3 STATS ChipPAC Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.5.4 Main Business/Business Overview 7.6 Samsung Group 7.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.6.2 Flip Chip Product Category, Application and Specification 7.6.2.1 Product A 7.6.2.2 Product B 7.6.3 Samsung Group Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.6.4 Main Business/Business Overview 7.7 Taiwan Semiconductor Manufacturing 7.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.7.2 Flip Chip Product Category, Application and Specification 7.7.2.1 Product A 7.7.2.2 Product B 7.7.3 Taiwan Semiconductor Manufacturing Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.7.4 Main Business/Business Overview 7.8 United Microelectronics 7.8.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.8.2 Flip Chip Product Category, Application and Specification 7.8.2.1 Product A 7.8.2.2 Product B 7.8.3 United Microelectronics Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.8.4 Main Business/Business Overview 7.9 Global Foundries 7.9.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.9.2 Flip Chip Product Category, Application and Specification 7.9.2.1 Product A 7.9.2.2 Product B 7.9.3 Global Foundries Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.9.4 Main Business/Business Overview 7.10 STMicroelectronics 7.10.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors 7.10.2 Flip Chip Product Category, Application and Specification 7.10.2.1 Product A 7.10.2.2 Product B 7.10.3 STMicroelectronics Flip Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017) 7.10.4 Main Business/Business Overview 7.11 Flip Chip International 7.12 Palomar Technologies 7.13 Nepes 7.14 Texas Instruments For more information, please visit https://www.wiseguyreports.com/sample-request/894515-global-flip-chip-market-research-report-2017


Home > Press > GLOBALFOUNDRIES Expands Partner Program to Speed Time-to-Market of FDX™ Solutions: Increased support affirms FDXcelerator™ Program’s vital role in promoting broader deployment of GLOBALFOUNDRIES’ FDX™ portfolio Abstract: GLOBALFOUNDRIES today announced the addition of eight new partners to its growing FDXcelerator Program, including Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Rambus, Sasken, Sonics, and QuickLogic. These new partners join Synopsys, Cadence, INVECAS, VeriSilicon, CEA Leti, Dreamchip, and Encore Semi to provide a suite of services that will enable GLOBALFOUNDRIES customers to rapidly implement 22FDX® system-on-chip (SoC) designs in low-power applications spanning Internet-of-Things (IoT), mobile, RF connectivity, and networking markets. The FDXcelerator Partner Program builds upon GLOBALFOUNDRIES’ 22FDX and 12FDX™ technologies, an alternative to FinFET-based technologies for chips that require performance on demand and energy efficiency at the lowest solution cost. GLOBALFOUNDRIES' 22FDX platform provides a lower-cost migration path from bulk nodes such as 40nm and 28nm, which allows customers to design differentiated, intelligent, and fully-integrated system solutions. FDXcelerator partners play a critical role by providing a set of specific solutions and resources that help increase design productivity on FDX technology and reduce time-to-market for its customers. GLOBALFOUNDRIES works closely with program partners to help customers create high-performance 22FDX designs while minimizing development costs through access to a broad set of quality offerings, specific to 22FDX technology. The partner ecosystem allows GLOBALFOUNDRIES to accelerate its traction in the market and more effectively offer its FDX products and services to a broader range of customers. The partner program extends the reach of the FD-SOI ecosystem, creating an open framework that allows selected partners to integrate their products or services into a validated, plug-and-play catalog of design solutions. The program encompasses FDX-tailored solutions and services, including: EDA tools that leverage differentiated FD-SOI body-bias features, built into industry-leading design flows; IP design elements and complete libraries, including foundational IP, interfaces and complex IP to enable foundry customers to start designs quickly with validated IP elements; ASIC platforms for a complete 22FDX ASIC offering; Reference solutions and system-level expertise in emerging application areas to speed time-to-market; Outsourced assembly and test (OSAT) solution featuring extensive manufacturing capacity to enable state-of-the art SoC delivery, and; Design consultation and other services dedicated to FDX technology. “As the FDXcelerator program continues to expand, partners play a critical role in helping to serve our growing number of customers and extend the reach of our FD-SOI ecosystem by providing innovative FDX-tailored solutions and services,” said Alain Mutricy, senior vice president of product management at GLOBALFOUNDRIES. “These new partners will help drive deeper engagement and enhance technology collaboration, including tighter interlock around quality, qualification and development methodology, enabling us to deliver advanced 22FDX SoC solutions.” GLOBALFOUNDRIES is focused on building strong ecosystem partnerships with industry leaders. With the FDXcelerator program, GLOBALFOUNDRIES’ partners and customers can now benefit from a greater availability of resources to take advantage of the broad adoption and accelerating growth of the FDX market. To learn more about GLOBALFOUNDRIES’ FDXcelerator partner program, please visit our Partners page. Supporting Quotes "With a fast-evolving IoT and wearables application landscape, ASE is pleased to have been selected by GLOBALFOUNDRIES as a trusted partner to provide a robust and reliable supply chain for IC assembly and test services, ultimately accelerating time-to-market for our mutual customers. Through this collaboration, ASE has successfully qualified GLOBALFOUNDRIES’ FDX technology platform using our innovative wire bond, flip chip and wafer level packaging technologies. Going forward, we are excited to further expand our partnership with GLOBALFOUNDRIES so customers can increasingly draw from our complementary portfolios encompassing foundry and packaging & test capabilities, all of which are being developed to align with emerging market needs." Rich Rice, Senior Vice President, Business Development, ASE Group "Amkor Technology is pleased to join GLOBALFOUNDRIES’ FDXcelerator partner program. This ecosystem alliance provides an accelerated time-to-market approach for those customers desiring to benefit from the gains in FD-SOI technology in areas where FinFET struggles with complexity and ability to meet pricing objectives. We look forward to supporting the ecosystem alliance and all of our customers seeking to take advantage of the FDX value proposition." Ron Huemoeller, Corporate Vice President, WW R&D and Technology Strategy, Amkor Technology “Infosys helps clients accelerate their time to market with our silicon to systems range of Engineering Services. Being a partner with GLOBALFOUNDRIES FDXcelerator program, further enhances our silicon engineering offerings and puts us in a unique position to address technology requirements for our semiconductor clients.” Sudip Singh, SVP & Global Head of Engineering Services, Infosys “Mentor Graphics is pleased to be working with GLOBALFOUNDRIES to provide the industry with more process options for chip design. Mentor’s support for the FDXcelerator program includes not only the Calibre® platform, but also participation from our Digital IC Design product offerings, the Analog FastSPICE (AFS)™ and Eldo® analog/mixed-signal platforms, and the Tessent® test suite. The result is a Mentor offering that allows mutual customers to fully leverage the unique capabilities of GLOBALFOUNDRIES FDX processes, and move from design to silicon with confidence.” Joe Sawicki, Vice President and General Manager of the Design-to-Silicon Division at Mentor Graphics “We are pleased to be part of the FDXcelerator program and to broaden our collaboration with GLOBALFOUNDRIES. Through our participation in this program, our DPA-resistant security cores will be made available as part of the pre-validated ecosystem of 22FDX™ IP. This program helps extend the reach of our best-in-class security cores and accelerates the time-to-market for our customers.” Dr. Martin Scott, General Manager of the Rambus Security Division “Sasken has a deep understanding of the software solutions and processes needed to help OEMs keep pace with the evolution of IoT, automotive, industrial and emerging devices technology. With the increasing demand for custom and bespoke system-on-chip (SoC) solutions, reference designs and newer devices, the FDXcelerator program will enable rapid SoC production and speed up time-to-market. Sasken’s excellence in complete product realization, which includes software and hardware, along with GLOBALFOUNDRIES’ FDXcelerator Partnership Program will enable custom design solutions at a faster pace.” Rajiv Mody, Chairman, Managing Director, and CEO, Sasken Communication Technologies Ltd. “Sonics is partnering with GLOBALFOUNDRIES FDXcelerator program because we share a commitment to lowering energy consumption and increasing performance for our SoC design customers. Sonics’ leadership in network-on-chip (NoC) technologies has made it the industry’s most trusted solution provider for on-chip communications. Now, our new energy processing unit (EPU) technology provides innovative on-chip energy management capabilities at the architecture level where the greatest potential for power savings is available. Sonics is excited to bridge application and silicon level power control leveraging the unique advantages of 22FDX.” Grant Pierce, CEO of Sonics “We are very excited to launch our ultra-low power ArcticPro™ eFPGA IP solution on GLOBALFOUNDRIES’ cost- and power-optimized 22 FDX process. This partnership leverages our nearly three decades of FPGA experience to provide GLOBALFOUNDRIES customers with a proven ultra-low power solution that dramatically increases the flexibility of a SoC design. This increased flexibility can significantly broaden the market for SoC designs and accelerate time to market for both semiconductor companies and the OEMs that use eFPGA solutions." Brian Faith, President and CEO of QuickLogic Corporation About GLOBALFOUNDRIES GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, please click If you have a comment, please us. Issuers of news releases, not 7th Wave, Inc. or Nanotechnology Now, are solely responsible for the accuracy of the content.


News Article | November 10, 2016
Site: www.newsmaker.com.au

Chip scale packaging is one of the packaging types for integrated circuits. Quad flat No Leads (QFN) is a one such chip scale packages with lead frame substrate. The quad flat no- leads which is plastic encapsulated package is a surface mount technology where IC’s are attached to the surfaces of printed circuit boards. Quad flat no-leads electrically connect the integrated circuits to printed circuit boards (PCB). The QFN are available in configurations such as saw singulated and punch formats. High performance (thermal and electrical), compacted size and lower costs are some of the important differentiating features than the conventional lead frame type of packages. QFN is widely used in RF applications, Bluetooth In 2015, global printed circuit board market was US$ 58.5 Bn, and it is expected to growth due to high demand. Thus, boosting global quad flat no-leads packaging market. The QFN market is primarily driven by the high demand in printed circuit board and flexible printed circuit board. Availability of QFN with various sizes boosts the global QFN market. Besides, the trend of smaller circuit designs in the electronic industry, increase in smartphone production and other handheld devices fuel the global QFN market. Other factors which aid in driving the global QFN market are its greater surface mount area, lower cost, light in weight. However, the specifications and guidelines for QFN manufacturing such as Japan Electronics and Information Technology Industries Association (JEITA), Joint Electron Device Engineering Council (JEDEC) and others are tight hence the global QFN market scenario limited with established players. The global quad flat no-leads market is segmented on the basis type of QFN and application. Based on type of QFN, global quad flat no-leads market is segmented into: Based on application, global quad flat no-leads market is segmented into: Geographically the global quad flat no-leads market is divided into five key regions including North America, Latin America, Europe, Asia-Pacific (APAC) and the Middle East & Africa (MEA).North America holds the major share in the quad flat no-leads market due to increasing in sales of flexible circuits. Followed by North America is Asia Pacific, especially China, holds a maximum share of Quad Flat No-leadsmarket. The quadflat no-leads marketin Europe, Latin America, and MEA are comparatively less robust than APAC market since the presence of the majority of electronic manufacturing sites in Asian countries. The some of the key players identified in the global Quad Flat No-leads Packaging market are Amkor Technology, Lumileds Holding B.V., ASE Group, Henkel Corporation, Broadcom Limited, China Wafer Level CSP Co., Ltd, etc.


News Article | December 16, 2016
Site: www.marketwired.com

SANTA CLARA, CA--(Marketwired - December 15, 2016) - GLOBALFOUNDRIES today announced the addition of eight new partners to its growing FDXcelerator Program, including Advanced Semiconductor Engineering, Inc. (ASE Group), Amkor Technology, Infosys, Mentor Graphics, Rambus, Sasken, Sonics, and QuickLogic. These new partners join Synopsys, Cadence, INVECAS, VeriSilicon, CEA Leti, Dreamchip, and Encore Semi to provide a suite of services that will enable GLOBALFOUNDRIES customers to rapidly implement 22FDX® system-on-chip (SoC) designs in low-power applications spanning Internet-of-Things (IoT), mobile, RF connectivity, and networking markets. The FDXcelerator Partner Program builds upon GLOBALFOUNDRIES' 22FDX and 12FDX™ technologies, an alternative to FinFET-based technologies for chips that require performance on demand and energy efficiency at the lowest solution cost. GLOBALFOUNDRIES' 22FDX platform provides a lower-cost migration path from bulk nodes such as 40nm and 28nm, which allows customers to design differentiated, intelligent, and fully-integrated system solutions. FDXcelerator partners play a critical role by providing a set of specific solutions and resources that help increase design productivity on FDX technology and reduce time-to-market for its customers. GLOBALFOUNDRIES works closely with program partners to help customers create high-performance 22FDX designs while minimizing development costs through access to a broad set of quality offerings, specific to 22FDX technology. The partner ecosystem allows GLOBALFOUNDRIES to accelerate its traction in the market and more effectively offer its FDX products and services to a broader range of customers. The partner program extends the reach of the FD-SOI ecosystem, creating an open framework that allows selected partners to integrate their products or services into a validated, plug-and-play catalog of design solutions. The program encompasses FDX-tailored solutions and services, including: "As the FDXcelerator program continues to expand, partners play a critical role in helping to serve our growing number of customers and extend the reach of our FD-SOI ecosystem by providing innovative FDX-tailored solutions and services," said Alain Mutricy, senior vice president of product management at GLOBALFOUNDRIES. "These new partners will help drive deeper engagement and enhance technology collaboration, including tighter interlock around quality, qualification and development methodology, enabling us to deliver advanced 22FDX SoC solutions." GLOBALFOUNDRIES is focused on building strong ecosystem partnerships with industry leaders. With the FDXcelerator program, GLOBALFOUNDRIES' partners and customers can now benefit from a greater availability of resources to take advantage of the broad adoption and accelerating growth of the FDX market. To learn more about GLOBALFOUNDRIES' FDXcelerator partner program, please visit our Partners page. "With a fast-evolving IoT and wearables application landscape, ASE is pleased to have been selected by GLOBALFOUNDRIES as a trusted partner to provide a robust and reliable supply chain for IC assembly and test services, ultimately accelerating time-to-market for our mutual customers. Through this collaboration, ASE has successfully qualified GLOBALFOUNDRIES' FDX technology platform using our innovative wire bond, flip chip and wafer level packaging technologies. Going forward, we are excited to further expand our partnership with GLOBALFOUNDRIES so customers can increasingly draw from our complementary portfolios encompassing foundry and packaging & test capabilities, all of which are being developed to align with emerging market needs." "Amkor Technology is pleased to join GLOBALFOUNDRIES' FDXcelerator partner program. This ecosystem alliance provides an accelerated time-to-market approach for those customers desiring to benefit from the gains in FD-SOI technology in areas where FinFET struggles with complexity and ability to meet pricing objectives. We look forward to supporting the ecosystem alliance and all of our customers seeking to take advantage of the FDX value proposition." "Infosys helps clients accelerate their time to market with our silicon to systems range of Engineering Services. Being a partner with GLOBALFOUNDRIES FDXcelerator program, further enhances our silicon engineering offerings and puts us in a unique position to address technology requirements for our semiconductor clients." "Mentor Graphics is pleased to be working with GLOBALFOUNDRIES to provide the industry with more process options for chip design. Mentor's support for the FDXcelerator program includes not only the Calibre® platform, but also participation from our Digital IC Design product offerings, the Analog FastSPICE (AFS)™ and Eldo® analog/mixed-signal platforms, and the Tessent® test suite. The result is a Mentor offering that allows mutual customers to fully leverage the unique capabilities of GLOBALFOUNDRIES FDX processes, and move from design to silicon with confidence." Joe Sawicki, Vice President and General Manager of the Design-to-Silicon Division at Mentor Graphics "We are pleased to be part of the FDXcelerator program and to broaden our collaboration with GLOBALFOUNDRIES. Through our participation in this program, our DPA-resistant security cores will be made available as part of the pre-validated ecosystem of 22FDX™ IP. This program helps extend the reach of our best-in-class security cores and accelerates the time-to-market for our customers." "Sasken has a deep understanding of the software solutions and processes needed to help OEMs keep pace with the evolution of IoT, automotive, industrial and emerging devices technology. With the increasing demand for custom and bespoke system-on-chip (SoC) solutions, reference designs and newer devices, the FDXcelerator program will enable rapid SoC production and speed up time-to-market. Sasken's excellence in complete product realization, which includes software and hardware, along with GLOBALFOUNDRIES' FDXcelerator Partnership Program will enable custom design solutions at a faster pace." "Sonics is partnering with GLOBALFOUNDRIES FDXcelerator program because we share a commitment to lowering energy consumption and increasing performance for our SoC design customers. Sonics' leadership in network-on-chip (NoC) technologies has made it the industry's most trusted solution provider for on-chip communications. Now, our new energy processing unit (EPU) technology provides innovative on-chip energy management capabilities at the architecture level where the greatest potential for power savings is available. Sonics is excited to bridge application and silicon level power control leveraging the unique advantages of 22FDX." "We are very excited to launch our ultra-low power ArcticPro™ eFPGA IP solution on GLOBALFOUNDRIES' cost- and power-optimized 22 FDX process. This partnership leverages our nearly three decades of FPGA experience to provide GLOBALFOUNDRIES customers with a proven ultra-low power solution that dramatically increases the flexibility of a SoC design. This increased flexibility can significantly broaden the market for SoC designs and accelerate time to market for both semiconductor companies and the OEMs that use eFPGA solutions." About GLOBALFOUNDRIES GLOBALFOUNDRIES is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GLOBALFOUNDRIES makes possible the technologies and systems that transform industries and give customers the power to shape their markets. GLOBALFOUNDRIES is owned by Mubadala Development Company. For more information, visit http://www.globalfoundries.com.


Surface mount technology also called as SMT is a technique of mounting electronic components on the surface of printed circuit boards. Ball Grid Array also called as BGA is one of the types of surface mount packaging. BGA are more convenient and robust type of packages compared to the conventional packaging such as quad flat packaging. The BGA are usually used widely in high-performance applications where high electrical and the thermal requirement is a top priority. BGA are available in plastic, ceramic and tape type of materials. The plastic BGA and thermally enhanced BGA are widely adopted.  The BGA has enhanced ratio between PCB area and pin count due to the input and output connections. Besides, the solder balls are strong than the conventional packaging, provides reduced footprint, increased speed yield of integrated circuits. The global BGA market is expected to grow during the forecast period due growth in the system on the package. The BGA market is driven rapidly due to its low cost, denser type of packing and also higher performance. The increasing demand for diverse and smaller size packaging from electronic OEM’s drives the global BGA market. Also, increasing semiconductor and IC chip industry drives the global BGA market. However, the challenges in designing of BGA are critical which might restrain the global BGA market. The global BGA market is segmented on the basis material type and BGA type. Based on the material type of BGA, global BGA market is segmented into: Based on the type of BGA, global BGA market is segmented into: The global BGA market is geographically divided into five key regions including North America, Latin America, Europe, Asia-Pacific (APAC) and the Middle East & Africa (MEA).Asia Pacific, especially China, Taiwan, Hong Kong, Japan contributes majorly to the BGA market. The semiconductor industry in Asian countries has the strong foothold, thus it is expected that BGA market will show strong growth during the forecast period. Followed by APAC are North America, Europe, Latin America and MEA. Some of the key players identified in the global BGA packaging market are Amkor Technology, TriQuint Semiconductor Inc., Jiangsu Changjiang Electronics Technology Co. STATS ChipPAC Ltd., ASE Group, Advanced Semiconductor Engineering, Inc., PARPRO, etc. The research report presents a comprehensive assessment of the market and contains thoughtful insights, facts, historical data, and statistically supported and industry-validated market data. It also contains projections done using a suitable set of assumptions and methodologies. The research report provides analysis and information according to categories such as market segments, geographies, type, machine size and end use.


News Article | November 15, 2016
Site: www.newsmaker.com.au

Wiseguyreports.Com Adds “EMS and ODM -Market Demand, Growth, Opportunities and analysis of Top Key Player Forecast to 2021” To Its Research Database This report studies sales (consumption) of EMS and ODM in Global market, especially in United States, China, Europe, Japan, focuses on top players in these regions/countries, with sales, price, revenue and market share for each player in these regions, covering Market Segment by Regions, this report splits Global into several key Regions, with sales (consumption), revenue, market share and growth rate of EMS and ODM in these regions, from 2011 to 2021 (forecast), like United States China Europe Japan Split by product Types, with sales, revenue, price and gross margin, market share and growth rate of each type, can be divided into Type I Type II Type III Split by applications, this report focuses on sales, market share and growth rate of EMS and ODM in each application, can be divided into Application 1 Application 2 Application 3 Global EMS and ODM Sales Market Report 2016 1 EMS and ODM Overview 1.1 Product Overview and Scope of EMS and ODM 1.2 Classification of EMS and ODM 1.2.1 Type I 1.2.2 Type II 1.2.3 Type III 1.3 Application of EMS and ODM 1.3.1 Application 1 1.3.2 Application 2 1.3.3 Application 3 1.4 EMS and ODM Market by Regions 1.4.1 United States Status and Prospect (2011-2021) 1.4.2 China Status and Prospect (2011-2021) 1.4.3 Europe Status and Prospect (2011-2021) 1.4.4 Japan Status and Prospect (2011-2021) 1.5 Global Market Size (Value and Volume) of EMS and ODM (2011-2021) 1.5.1 Global EMS and ODM Sales and Growth Rate (2011-2021) 1.5.2 Global EMS and ODM Revenue and Growth Rate (2011-2021) 7 Global EMS and ODM Manufacturers Analysis 7.1 ASE Group 7.1.1 Company Basic Information, Manufacturing Base and Competitors 7.1.2 EMS and ODM Product Type, Application and Specification 7.1.2.1 Type I 7.1.2.2 Type II 7.1.3 ASE Group EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.1.4 Main Business/Business Overview 7.2 Benchmark Electronics 7.2.1 Company Basic Information, Manufacturing Base and Competitors 7.2.2 114 Product Type, Application and Specification 7.2.2.1 Type I 7.2.2.2 Type II 7.2.3 Benchmark Electronics EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.2.4 Main Business/Business Overview 7.3 Cal-Comp 7.3.1 Company Basic Information, Manufacturing Base and Competitors 7.3.2 134 Product Type, Application and Specification 7.3.2.1 Type I 7.3.2.2 Type II 7.3.3 Cal-Comp EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.3.4 Main Business/Business Overview 7.4 Celestica 7.4.1 Company Basic Information, Manufacturing Base and Competitors 7.4.2 Oct Product Type, Application and Specification 7.4.2.1 Type I 7.4.2.2 Type II 7.4.3 Celestica EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.4.4 Main Business/Business Overview 7.5 Compal Electronics 7.5.1 Company Basic Information, Manufacturing Base and Competitors 7.5.2 Product Type, Application and Specification 7.5.2.1 Type I 7.5.2.2 Type II 7.5.3 Compal Electronics EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.5.4 Main Business/Business Overview 7.6 FIH Mobile 7.6.1 Company Basic Information, Manufacturing Base and Competitors 7.6.2 Million USD Product Type, Application and Specification 7.6.2.1 Type I 7.6.2.2 Type II 7.6.3 FIH Mobile EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.6.4 Main Business/Business Overview 7.7 Flex 7.7.1 Company Basic Information, Manufacturing Base and Competitors 7.7.2 Electronics Product Type, Application and Specification 7.7.2.1 Type I 7.7.2.2 Type II 7.7.3 Flex EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.7.4 Main Business/Business Overview 7.8 Foxconn 7.8.1 Company Basic Information, Manufacturing Base and Competitors 7.8.2 Product Type, Application and Specification 7.8.2.1 Type I 7.8.2.2 Type II 7.8.3 Foxconn EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.8.4 Main Business/Business Overview 7.9 Inventec 7.9.1 Company Basic Information, Manufacturing Base and Competitors 7.9.2 Product Type, Application and Specification 7.9.2.1 Type I 7.9.2.2 Type II 7.9.3 Inventec EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.9.4 Main Business/Business Overview 7.10 Jabil 7.10.1 Company Basic Information, Manufacturing Base and Competitors 7.10.2 Product Type, Application and Specification 7.10.2.1 Type I 7.10.2.2 Type II 7.10.3 Jabil EMS and ODM Sales, Revenue, Price and Gross Margin (2011-2016) 7.10.4 Main Business/Business Overview 7.11 Lite-On Technology 7.12 MiTAC Holdings 7.13 Pegatron 7.14 Plexus 7.15 Qisda Corporation 7.16 Quanta Computer 7.17 Sanmina 7.18 Venture Corp 7.19 Wistron


MOSCOW, 10-Nov-2016 — /EuropaWire/ — Dassault Systèmes, the 3DEXPERIENCE Company, world leader in 3D design software, and the leading Russian nuclear power plant engineering procurement and construction company ASE Group of Companies (ASE), part of ROSATOM, today announced the signing of a global, three-year cooperation agreement at the Third International Conference on Nuclear Knowledge Management held at the International Atomic Energy Agency in Vienna. The agreement is designed to use each company’s core capabilities to deliver greater support for customers’ innovation processes in nuclear power, as well as other segments of the energy, process and utilities industry. ASE will leverage Dassault Systèmes’ 3DEXPERIENCE platform as part of its Multi-D Solution offering for large capital facilities design, construction and operations management in nuclear power and other key industrial segments.  ASE’s Multi-D Solution combines Dassault Systèmes’ applications to optimize complex business processes and carry out detailed modeling of construction and installation processes based on multiple sources’ data, with ASE’s integration and consulting services featuring best practices, methodologies and engineering know-how for managing the construction and operations of capital infrastructure facilities. Previously, Multi-D was implemented exclusively within ASE’s own projects.  With this agreement, ASE can expand the business value brought by this combined solution to capital construction, production operations and maintenance projects in Russia and abroad on a project management consultancy basis. “The Multi-D Solution facilitates the effective management of parameters such as budget, deadlines and quality for complex engineering facilities,” said Vyacheslav Alenkov, Director, System Engineering, ASE.  “Our cooperation agreement with Dassault Systèmes enables us to broaden the reach of our innovative Multi-D Solution and bring greater benefits to nuclear and other industries.” “Since 2012, we’ve worked with NIAEP, part of ASE Group, to optimize Multi-D for every stage of the business cycle and demonstrate possibilities for greater sustainability in nuclear,” said Thomas Grand, Vice President, Energy, Process and Utilities Industry, Dassault Systèmes.  “The 3DEXPERIENCE platform presents engineering, procurement and construction companies, owners, operators, regulators and suppliers with a trusted collaborative environment to innovate, build, operate, supply and recycle.  The combination of our software capabilities with ASE’s know-how boosts their ability to design and optimize energy production systems and gain a competitive advantage in other industrial sectors.”


Semiconductor Assembly &Testing Services Market is estimated to be valued at US$ 29,585.9 Mn by the end of 2015 and is anticipated to expand at a CAGR of 4.7% from 2015 to 2021, to account for US$ 39,050.7 Mn by 2021. Semiconductor Assembly and Testing Services (SATS) market are witnessing increased demand for outsourced SATS services. Presently, around half of the market is exploiting the Outsourced Semiconductor Assembly and Test (OSAT) services, and the trend is expected to continue in the long run. With increasing competition from the leading and regional players, the market is witnessing consolidation. This helps market participants in utilizing resources of other players to meet increasing technological demands. Currently, the semiconductor assembly and testing services market across the world is mainly driven by factors such as increasing demand for mobility and connectivity in the consumer electronic products. An increasing demand for connected devices worldwide including smartphones and tablets having connectivity and multimedia capabilities are fuelling the demand for higher packaging technologies, setting up potential revenue opportunity for the SATS market. Additional features offered by SATS providers over in-house testing and packaging capabilities is also one of the primary reasons for the market growth. Additionally, SATS providers facilitate a more efficient supply chain and in-turn reduces time-to-market for a product, therefore SATS providers are becoming the primary choice of integrated design manufacturers. Increased use of safety systems in the automobile industry is also one of the factors contributing to the growth of the SATS market. . However, factors such as the high capital requirement for offering higher end packaging solutions, fluctuations in exchange rates, and volatility in the market are expected to constrain the growth of the SATS market. On the basis of services, the semiconductor assembly & testing services market has been segmented into assembly & packaging services and testing services. The assembly & packaging services segment is expected to account for 79.4% share of the global Semiconductor assembly & testing services market by 2015 end and is anticipated to increase at a CAGR of 4.9%, during the forecast period (2015–2021). The Assembly and Packaging services segment is further classified on the basis of packaging solutions (interconnecting technologies) which includes copper and gold wire bonding, copper clip, flip chip, wafer level packaging, and TSV. Copper and gold wire bonding accounted for the 55.5%share of the assembly and packaging services segment in 2014. The wafer level packaging (interconnecting technology) segment in the global SATS market is anticipated to expand at a CAGR of 9.2% during the forecast period. On the basis of application, the semiconductor assembly & testing services market is segmented into communications, computing & networking, consumer electronics, industrial and automotive electronics. Among these, communication segment dominated the market in 2014 and is expected to account for 49.4% share of the global semiconductor assembly & testing services market by 2015 end. This segment is expected to expand at CAGR of 5.9% during the forecast period. Increasing adoption of tablets and wearable devices globally, is expected to drive the market growth of consumer electronics segment during the forecast period. Consumer electronics segment is analyzed to increase at a CAGR of 6.6% during the forecast period. The report provides detailed information about various trends driving each segment and offers analysis and insights about the potential of the semiconductor assembly & testing services market in specific regions. On the basis of region, the semiconductor assembly & testing services market is segmented into six regions; among these, Taiwan is expected to dominate the market representing 46.5% share by the end of 2015. The market in the region is analyzed to represent largest market share by 2021 expanding at a CAGR of 5.8% during the forecast. Key players in global semiconductor assembly & testing services market include ASE Group, Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd., Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI), GlobalFoundries and Chipbond Technology Corporation.


VELIZY-VILLACOUBLAY, France--(BUSINESS WIRE)--Dassault Systèmes (Paris:DSY) (Euronext Paris: #13065, DSY.PA), the 3DEXPERIENCE Company, world leader in 3D design software, 3D Digital Mock Up and Product Lifecycle Management (PLM) solutions, and the leading Russian nuclear power plant engineering procurement and construction company ASE Group of Companies (ASE), part of Rosatom Group, today announced the signing of a global, three-year cooperation agreement at the Third International Conference


Semiconductor Assembly and Testing Services (SATS) market are witnessing increased demand for outsourced SATS services. Presently, around half of the market is exploiting the Outsourced Semiconductor Assembly and Test (OSAT) services, and the trend is expected to continue in the long run. With increasing competition from the leading and regional players, the market is witnessing consolidation. This helps market participants in utilizing resources of other players to meet increasing technological demands. Semiconductor Assembly &Testing Services Market is estimated to be valued at US$ 29,585.9 Mn by the end of 2015 and is anticipated to expand at a CAGR of 4.7% from 2015 to 2021, to account for US$ 39,050.7 Mn by 2021. Currently, the semiconductor assembly and testing services market across the world is mainly driven by factors such as increasing demand for mobility and connectivity in the consumer electronic products. An increasing demand for connected devices worldwide including smartphones and tablets having connectivity and multimedia capabilities are fuelling the demand for higher packaging technologies, setting up potential revenue opportunity for the SATS market. Additional features offered by SATS providers over in-house testing and packaging capabilities is also one of the primary reasons for the market growth. Additionally, SATS providers facilitate a more efficient supply chain and in-turn reduces time-to-market for a product, therefore SATS providers are becoming the primary choice of integrated design manufacturers. Increased use of safety systems in the automobile industry is also one of the factors contributing to the growth of the SATS market. . However, factors such as the high capital requirement for offering higher end packaging solutions, fluctuations in exchange rates, and volatility in the market are expected to constrain the growth of the SATS market. On the basis of services, the semiconductor assembly & testing services market has been segmented into assembly & packaging services and testing services. The assembly & packaging services segment is expected to account for 79.4% share of the global Semiconductor assembly & testing services market by 2015 end and is anticipated to increase at a CAGR of 4.9%, during the forecast period (2015–2021). The Assembly and Packaging services segment is further classified on the basis of packaging solutions (interconnecting technologies) which includes copper and gold wire bonding, copper clip, flip chip, wafer level packaging, and TSV. Copper and gold wire bonding accounted for the 55.5%share of the assembly and packaging services segment in 2014. The wafer level packaging (interconnecting technology) segment in the global SATS market is anticipated to expand at a CAGR of 9.2% during the forecast period. On the basis of application, the semiconductor assembly & testing services market is segmented into communications, computing & networking, consumer electronics, industrial and automotive electronics. Among these, communication segment dominated the market in 2014 and is expected to account for 49.4% share of the global semiconductor assembly & testing services market by 2015 end. This segment is expected to expand at CAGR of 5.9% during the forecast period. Increasing adoption of tablets and wearable devices globally, is expected to drive the market growth of consumer electronics segment during the forecast period. Consumer electronics segment is analyzed to increase at a CAGR of 6.6% during the forecast period. The report provides detailed information about various trends driving each segment and offers analysis and insights about the potential of the semiconductor assembly & testing services market in specific regions. On the basis of region, the semiconductor assembly & testing services market is segmented into six regions; among these, Taiwan is expected to dominate the market representing 46.5% share by the end of 2015. The market in the region is analyzed to represent largest market share by 2021 expanding at a CAGR of 5.8% during the forecast. Key players in global semiconductor assembly & testing services market include ASE Group, Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd., Powertech Technology Inc., CORWIL Technology corporation, Psi Technologies Inc. (IMI), GlobalFoundries and Chipbond Technology Corporation.

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