Asahi Sunac Corporation

Owariasahi, Japan

Asahi Sunac Corporation

Owariasahi, Japan
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Choi K.,National Institute of Occupation Safety and Health | Sakurai N.,Asahi Sunac Corporation | Yanagida K.,Asahi Sunac Corporation | Itoh H.,Asahi Sunac Corporation
Journal of Loss Prevention in the Process Industries | Year: 2010

Electrostatic Powder coating which is a surface finishing technique has widely been used in paint industry since its invention in the 1960s. However, so far, insufficient attention has been paid to the powder fires and/or explosion hazards caused by electrostatic spark during coating process. This paper is a report of the electrostatic spark ignitability of aluminous coating powders (dry blend-type) used in practical electrostatic powder coating. The Hartman vertical-tube apparatus was used for the minimum ignition energy (MIE) test. Various aluminous coating powders, different with respect to the amount of aluminum pigment, were used in this study. Experimental results obtained in this study are as follows: (1) The aluminous coating powder was so sensitive that even an electrostatic spark with an energy as low as 10 mJ could ignite it. (2) The particle size of aluminous coating powder has a considerable effect on the ignitability when the aluminum pigment concentration is within 6 wt% of the practical coating powder manufacturing standards. Thus, the conventional expression for estimating the MIE can be useful when assessing the electrostatic hazards associated with aluminum coating powders. © 2009 Elsevier Ltd. All rights reserved.


Lee H.,University of Arizona | Zhuang Y.,University of Arizona | Zhuang Y.,Araca | Sugiyama M.,University of Minnesota | And 7 more authors.
Thin Solid Films | Year: 2010

Pad flattening ratio (PFR) was investigated as a non-destructive pad surface analysis method on the IC1000 K-groove pad during silicon dioxide chemical mechanical planarization. The PFR defines as the ratio of the bright area to the total image area. A series of marathon polishing runs were performed under ex-situ diamond disc pad conditioning, ex-situ high-pressure micro jet (HPMJ) pad conditioning and no pad conditioning methods where PFR analysis was performed to estimate the amount of pad surface flattening or glazing under these conditions. With no conditioning, PFR increased rapidly to 40% indicating severe glazing. With ex-situ diamond disc pad conditioning, PFR remained relatively constant below 12%, suggesting a rough and stable pad surface for polishing, while with ex-situ HPMJ conditioning it increased gradually and stabilized at the value of about 23%. Real-time analysis of friction force and silicon dioxide removal rate showed a clear correlation among the PFR, the coefficient of friction and the removal rate during the silicon dioxide chemical mechanical planarization. © 2009 Elsevier B.V. All rights reserved.


Murata M.,Kyushu University | Doi T.,Kyushu University | Kurokawa S.,Kyushu University | Ohnishi O.,Kyushu University | And 5 more authors.
Proceedings of the 6th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2011 | Year: 2011

This research aims to change the coating method to fabricate organic thin film solar cells from the conventional spin system to spray system. In the spray coating method, sprayed solution consists of poly (3-hexylthiophene) (P3HT): [6,6]-phenyl C61 butyric acid methyl ester (PCBM) for solute, and mono chlorobenzene (MCB) for solvent. This paper presents the effect of spray conditions on the deposited organic film characteristics experimentally. As a result, the optimum spray conditions from a viewpoint of discharge rate, spray distance and air pressure were proposed. Moreover, the effect of temperature and humidity as deposition environment was discussed. Finally, several advantages of the spray coating method were performed through the experimental examination.


Seike Y.,Asahi Sunac Corporation | Ohtsubo M.,Kyushu University | Shimai F.,Tokyo Ohka Kogyo | Maruyama K.,Tokyo Ohka Kogyo | And 6 more authors.
International Journal of Nanomanufacturing | Year: 2013

Semiconductor devices are increasingly sophisticated in their application of three-dimensional laminated chips inside through-silicon via (TSV). TSV is a technology that connects the stacked chips using through electrodes instead of higher integrated circuits densities. In this report, we invented a new photo-resist coating method inside the TSV using the rotary atomising aerosol spray. We measured the characteristics of the flying droplets from the atomising aerosol spray nozzle by a shadow Doppler particle analyser (SDPA) to indicate that the new method is capable of coating the photo-resist inside the TSV. Furthermore, we tried to make the prototype coating system with the rotary atomising aerosol spray nozzle and run the experiments in to coat the photo-resist inside the TSV test element group (TEG) wafer. Results indicate that the photo-resist is coated on the TSV TEG wafer having opening diameter of 50 μm to 200 μm, depth of 50 μm and square pyramid via holes with tapered angle of 54.7 degrees by using the prototype equipment. It is confirmed that coating along the inner walls of via holes is feasible. Copyright © 2013 Inderscience Enterprises Ltd.


Seike Y.,Asahi Sunac Corporation | Miyachi K.,Asahi Sunac Corporation | Miyachi K.,Kyushu University | Shibata T.,Asahi Sunac Corporation | And 3 more authors.
Japanese Journal of Applied Physics | Year: 2010

A liquid aerosol, which sprays cleaning liquid with a carrier gas, is widely used for cleaning semiconductor devices. The liquid aerosol using a conventional two-fluid nozzle may cause pattern damage on the wafer. To resolve this problem, we have made a prototype new rotary atomizing two-fluid cleaning nozzle (RAC nozzle), which can control the velocity distribution and size distribution of flying liquid droplets separately. It was confirmed by measuring flying liquid droplets using a shadow Doppler particle analyzer system that the mean volumetric diameter of the droplets could be atomized to 20 μm or less at a rotational speed of the air turbine of 50,000 min-1 and that the mean velocity of the flying liquid droplets could be controlled in the range under 65 m/s independently. It was confirmed in a cleaning experiment using polystyrene latex (PSL) particles on a wafer that particle removal efficiency increased when shaping air pressure increased. Also, the particle removal efficiency was improved with the finer atomization promoted by a higher rotational speed of the air turbine. © 2010 The Japan Society of Applied Physics.


Seike Y.,Asahi Sunac Corporation | Koishikawa Y.,Kyushu University | Kato M.,Asahi Sunac Corporation | Miyachi K.,Asahi Sunac Corporation | And 4 more authors.
Digest of Technical Papers - SID International Symposium | Year: 2014

New film forming technique with electrospray (ES) method capable of forming films in the atmosphere is proposed to correspond to larger organic light-emitting diode (OLED) device and reduce manufacturing cost to achieve commercial viability. © 2014 Society for Information Display.


Seike Y.,Asahi Sunac Corporation | Miyachi K.,Asahi Sunac Corporation | Kurokawa S.,Kyushu University | Ohnishi O.,Kyushu University | Doi T.,Kyushu University
Advanced Metallization Conference (AMC) | Year: 2010

A liquid aerosol, which sprays cleaning liquid with a carrier gas, is widely used for cleaning semiconductor devices. The liquid aerosol using a conventional two-fluid nozzle may cause pattern damage on the wafer. To resolve this problem, we have made a prototype new rotary atomizing two-fluid cleaning nozzle (RAC nozzle), which can control the velocity distribution and size distribution of flying liquid droplets separately. It could be atomized to 20 μm or less at a rotational speed of the air turbine of 50,000 min -1 and that the mean velocity of the flying liquid droplets could be controlled in the range under 65 m/s independently. It was confirmed in a cleaning experiment using polystyrene latex (PSL) particles on a wafer that particle removal efficiency increased when shaping air pressure increased. Also, the particle removal efficiency was improved with the finer atomization promoted by a higher rotational speed of the air turbine.


Patent
Asahi Sunac Corporation | Date: 2012-10-03

An electrostatic spraying device includes a device body having a paint supply passage connected to a paint supply source, a paint nozzle located on a distal end of device body and having a paint flow passage communicating with the paint supply passage and a paint outlet formed through a distal end of the paint flow passage, a high-voltage generating part which generates high voltage with which paint sprayed from the paint outlet is charged, and a high-voltage electrode to which the high voltage generated by the high voltage generating part is applied. The high-voltage electrode is disposed at a position a predetermined distance backwardly away from the paint outlet on an outer periphery of the device body, so as to be separated from the paint flow passage thereby to be insulated from the paint flow passage.


Trademark
Asahi Sunac Corporation | Date: 2015-06-26

Paint spraying booths of metal. Painting machines and apparatus. Paint spraying booths not of metal.


The disclosed electrostatic coating system (1) includes a spray gun (2) for electrostatic coating, a high-voltage generator (5), and an alternating-current source unit (4), and further includes a removable grounding member (7), in a state attached to the main body of the gun, provided to close an open-circuit portion (3c) of the grounded power source line (3a), and a control circuit (8) for controlling the alternating current source unit (4) by detecting the current flowing through the power source line (3) or the voltage of the power source line (3) by a current coil (13) to stop application of the alternating voltage (Vac) to the high-voltage generator (5) when the detected electric current or the detected voltage has dropped or either the current or the voltage is not detected during supply of the alternating voltage (Vac) to the high voltage generator (5) of the spray gun (2). This system enables prevention of charging of the removable grounding member (7) to improve the safety in the coating operation.

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