Arakawa Chemical Industries Ltd. and Pelnox Co. | Date: 2013-03-02
The present invention provides a heat dissipating coating composition in a liquid or paste form for application to a heat generating article, comprising an infrared absorbing binder resin (A), infrared absorbing inorganic particles (B), and an organic solvent, having such proportions of the component (A) and the component (B) that the component (A) is 10 to 70 vol % and the component (B) is 90 to 30 vol % based on the total of both components being 100 vol %, and satisfying conditions 1, 2, and 3 specified herein, and also provides a heat dissipating coating film obtained by applying the heat dissipating coating composition to a heat dissipating article and then thermally curing the composition.
Arakawa Chemical Industries Ltd. | Date: 2013-09-17
An object of the present invention is to provide a flexible circuit board that maintains high insulation reliability, exhibits high wiring adhesion, has low thermal expansion, and allows the formation of a fine circuit thereon. Specifically, the present invention provides a flexible circuit board, wherein at least a nickel plating layer is laminated on a polyimide film to form a polyimide film provided with a nickel plating layer and a wiring pattern is applied to the nickel plating layer thereof. The polyimide film has a thermal expansion coefficient of 0 to 8 ppm/ C. in the temperature range from 100 to 200 C., and the nickel plating layer has a thickness of 0.03 to 0.3 m.
Arakawa Chemical Industries Ltd. and Lintec Corporation | Date: 2012-03-22
The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.
Arakawa Chemical Industries Ltd. | Date: 2013-01-28
The purpose of the present invention is to provide a method for efficiently removing a quaternary salt from an organic solvent. The present invention relates to a method for removing a quaternary salt, the method including: contacting a solution of a quaternary salt in an organic solvent with an aqueous solution containing at least one member selected from the group consisting of (a1) compounds having one or more anionic functional groups and (a2) polymers having at least one member selected from the group consisting of carboxyl group and sulfonic acid group, thereby removing the quaternary salt from the organic solvent.
Tackifier, Tackifier For Medical Or Industrial Use, Adhesive And/Or Pressure-Sensitive Adhesive For Medical Or Industrial Use, Adhesive Sheet And/Or Pressure-Sensitive Adhesive Sheet For Medical Or Industrial Use, And Pressure-Sensitive Adhesive Tape For Medical Or Industrial Use
Arakawa Chemical Industries Ltd. | Date: 2013-01-25
Provided is a resin acid ester-based tackifier having a good compatibility with a synthetic rubber elastomer, being capable of reducing the melt viscosity of the elastomer, and being capable of imparting excellent adhesive properties and/or pressure-sensitive adhesive properties to the elastomer. The tackifier is composed of an ester composition characterized by (i) the ester composition comprising 70% by weight or more of a resin acid ester represented by the general formula (1): and