Entity

Time filter

Source Type

Tucson, AZ, United States

The Araca Group is a Tony Award-winning live entertainment merchandise and production company founded in 1997 by partners Matthew Rego, Michael Rego, and Hank Unger. First achieving notoriety as producers of the musical Urinetown, the company has gradually become more involved in merchandising following the success of Wicked.The mission of The Araca Group's merchandise division is: "to develop, design and produce singular, fashionable and quality products that support the client's marketing strategy throughout the world". Wikipedia.


Patent
Araca | Date: 2010-12-16

In a certain embodiment, the invention comprises an apparatus for injecting slurry between the wafer and the pad in chemical mechanical polishing of semiconductor wafers comprising an injector the leading edge of which possess bays, depressions or notches that capture spent slurry and hold it long enough for it to transfer heat from the polishing reaction to the pad or through the injector to the new slurry before the said spent slurry is thrown from the polishing pad. The effect is to considerably improve the removal rate, reduce slurry consumption and reduce operating time.


Patent
Araca | Date: 2012-05-08

Disclosed is an apparatus for injecting slurry onto the polishing pad surface of a chemical mechanical polishing (CMP) tool. The disclosed apparatus includes a rectilinear shaped injector bottom, where multiple slots are created in the top surface of the injector bottom, allowing the injector bottom to flex and to conform to the polishing pad profile. CMP slurry or components thereof are introduced through one or more top surface openings, travel through the injector body, and exit through a slit or bottom surface opening. The slurry is spread into a thin film by the injector, and is introduced at the gap between the surface of the polishing pad and the wafer, along the leading edge of the wafer, in quantities small enough that all or most of the slurry is introduced between the wafer and the polishing pad.


Grant
Agency: NSF | Branch: Standard Grant | Program: | Phase: STTR PHASE II | Award Amount: 850.00K | Year: 2012

This Small Business Innovation Research (SBIR) Phase II project aims to develop a novel slurry injection device for applications in chemical mechanical planarization (CMP), a key technology for integrated circuit (IC) manufacturing. Different from the current slurry application method that applies slurry on the pad center area during wafer polishing, this novel slurry injector device is placed on top of the pad surface, injects the fresh slurry to where it is needed, and reduces slurry mixing and dilution effects by blocking used slurry, pad debris, and rinsing water from re-entering the pad-wafer interface. Tests will be performed on various polishers to optimize the slurry injector device design for different CMP processes. This slurry injector device is expected to achieve higher material removal rates and reduce polishing defects compared to current pad center area slurry application method.

The broader/commercial impacts of this project will be the potential to reduce slurry consumption and increase yield during CMP processes for the IC manufacturing industry. In 2012, the global point-of-use slurry usage is estimated to be in excess of 600 million liters corresponding to a total slurry expenditure of approximately $1 billion. Assuming a conservative slurry savings of 15 percent by this slurry injector device, it represents a potential $150 million savings in slurry and an additional $25 million savings in waste treatment.


A method and apparatus for performing chemical-mechanical planarization (CMP) is disclosed, which in one embodiment includes a CMP tool for polishing a semiconductor wafer. The CMP tool includes a slurry mixture that has slurry beads. The slurry beads are formed of a polymer material. The slurry beads are used to remove summits and non-uniformities on the semiconductor wafer. In some embodiments the CMP tool includes a counter-face that replaces the polishing pad of a conventional CMP tool. In some embodiments the counter-face is made of polycarbonate. In another embodiment a slurry mixture for use with a CMP tool is disclosed. The slurry mixture includes slurry beads, where each of the slurry beads has a diameter of between 0.1 and 1000 microns, or in some embodiments a diameter of between 10 and 50 microns.


Grant
Agency: National Science Foundation | Branch: | Program: SBIR | Phase: Phase I | Award Amount: 150.00K | Year: 2011

This Small Business Innovation Research (SBIR) Phase I project will develop and implement a novel slurry injection device for applications in chemical mechanical planarization (CMP), a key-enabling technology for integrated circuit (IC) manufacturing. In the most current CMP commercial polishers, the slurry is injected on the pad center area during wafer polishing. As a large amount of fresh slurry flows directly off the pad surface without entering the pad-wafer interface and reacting with the wafer surface, it results in very low slurry utilization. In addition, spent slurry containing polishing by-products and residual de-ionized water from the pad rinsing step can mix with the fresh slurry during polishing, causing lower material removal rates and higher polishing defects. In this project, a novel slurry injection device is being developed and implemented for different commercial CMP polishers, and the slurry injector polishing performance will be evaluated. The novel slurry injection device designed is expected to not only increase the slurry utilization efficiency by injecting the fresh slurry to where it is needed (pad-wafer interface), but also enhance the removal rate and reduce polishing defects by blocking the spent slurry and residue from re-entering the pad-wafer interface during wafer polishing. The commercial potential of this project is a significant reduction in the cost of ownership (COO) of the CMP module and making CMP processes more environmentally benign for the IC manufacturing industry. Among the consumables used in CMP processes, slurries may account for up to 50% of the total COO for the CMP module. In addition, slurry consumption has tremendous environmental impacts as waste slurries can contain hazardous chemicals and metal contents with large amounts of nanosized abrasive particles. Through more efficient slurry delivery and minimum slurry mixing and dilution, the novel slurry injection device designed can achieve the same material removal rate and fewer polishing defects with significantly lower slurry consumption. As the slurry consumption is reduced, less waste slurry is generated. Therefore, the novel slurry injector device will not only reduce the COO of CMP processes for IC manufacturers, but also make the CMP processes more environmentally benign.

Discover hidden collaborations