Sunnyvale, CA, United States
Sunnyvale, CA, United States

Applied Materials, Inc. is an American corporation that supplies equipment, services and software to enable the manufacture of semiconductor, flat panel display, Glass, WEB and solar (crystalline and thin film) products. The company is headquartered in Santa Clara, California in the Silicon Valley. Applied Materials creates and commercializes nanomanufacturing technology used in the production of semiconductor (integrated circuit) chips for electronic gear, flat panel displays for computers, smartphones and television, glass coatings for homes and buildings, web (flexible substrate) coatings for industry and photovoltaic solar cells and modules using both thin film and crystalline (wafer or bulk) photovoltaic technology. Wikipedia.


Time filter

Source Type

Patent
Applied Materials | Date: 2017-01-18

Thin film batteries (TFB) are fabricated by a process which eliminates and/or minimizes the use of shadow masks. A selective laser ablation process, where the laser patterning process removes a layer or stack of layers while leaving layer(s) below intact, is used to meet certain or all of the patterning requirements. For die patterning from the substrate side, where the laser beam passes through the substrate before reaching the deposited layers, a die patterning assistance layer, such as an amorphous silicon layer or a microcrystalline silicon layer, may be used to achieve thermal stress mismatch induced laser ablation, which greatly reduces the laser energy required to remove material.


A deposition source (100, 200, 300, 400) for coating a movable substrate (20) is described. The deposition source includes: a source housing (120) to be fixed to a process chamber in such a way that a substrate (20) can be moved past an open front side of the process chamber during deposition; a gas inlet (130) for introducing a process gas into a coating processing region (125) of the source housing; and an evacuation outlet (140) for removing the process gas from a pumping region of the source housing. An evacuation partition unit (150) is arranged between the coating processing region (125) and the pumping region (126) with at least one opening or with a plurality of openings (152) defining a process gas flow path (155) from the coating processing region (125) into the pumping region (126).


Patent
Applied Materials | Date: 2017-02-03

Embodiments of the present disclosure generally relate to an apparatus and method for reducing particle generation in a processing chamber. In one embodiment, an apparatus for processing a substrate is disclosed. The apparatus includes a chamber body, a lid assembly disposed above the chamber body, the lid assembly comprising a top electrode and a bottom electrode positioned substantially parallel to the top electrode, a gas distribution plate disposed between a substrate processing region and the lid assembly, and a substrate support disposed within the chamber body, the substrate support supporting having a substrate supporting surface, wherein the top electrode is in electrical communication with a radio frequency (RF) power supply and a DC bias modulation configuration, and the DC bias modulation configuration is configured to operate the top electrode at a constant zero DC bias voltage during a process.


Patent
Applied Materials | Date: 2017-02-08

Embodiments described herein provide methods and apparatus for forming graphitic carbon such as graphene on a substrate. The method includes providing a precursor comprising a linear conjugated hydrocarbon, depositing a hydrocarbon layer from the precursor on the substrate, and forming graphene from the hydrocarbon layer by applying energy to the substrate. The precursor may include template molecules such as polynuclear aromatics, and may be deposited on the substrate by spinning on, by spraying, by flowing, by dipping, or by condensing. The energy may be applied as radiant energy, thermal energy, or plasma energy.


Patent
Applied Materials | Date: 2017-02-02

A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings that slip or deflect laterally on the wafer surface may also be used. In these designs, the slipping is substantially uniform and consistent, resulting in improved performance.


Patent
Applied Materials | Date: 2017-02-08

A vacuum processing system (100) for a flexible substrate (260; 560) is provided. The processing system includes a first chamber (110) adapted for housing one of a supply roll for providing the flexible substrate and a take-up roll for storing the flexible substrate (260; 560); a second chamber (120) adapted for housing one of a supply roll for providing the flexible substrate and a take-up roll for storing the flexible substrate (260; 560); a maintenance zone (130) between the first chamber (110) and the second chamber (120; 220; 420; 520); and a first process chamber (140) for depositing material on the flexible substrate, wherein the second chamber (140) is provided between the maintenance zone (130) and the first process chamber (110). The maintenance zone (130) allows for maintenance access to at least one of the first chamber (110) and the second chamber (120).


Patent
Applied Materials | Date: 2017-02-08

Embodiments of the present disclosure generally relate to expandable substrate inspection systems. The inspection system includes multiple metrology units adapted to inspect, detect, or measure one or more characteristics of a substrate, including thickness, resistivity, saw marks, geometry, stains, chips, micro cracks, and crystal fraction. The inspection systems may be utilized to identify defects on substrates and estimate cell efficiency prior to processing a substrate. Substrates may be transferred through the inspection system and/or between metrology units on a track or conveyor, and then sorted via at least one gripper coupled with the high speed rotatory sorting apparatus into respective bins based upon the inspection data. The rotary sorting apparatus maintains a sorting capability of at least 5,400 substrates per hour. Each bin may optionally have a gas support cushion for supporting the substrate as it falls from the rotary sorting apparatus into the respective bin.


Patent
Applied Materials | Date: 2017-01-18

A process chamber includes a chamber body having a chamber lid assembly disposed thereon, one or more monitoring devices coupled to the chamber lid assembly, and one or more antennas disposed adjacent to the chamber lid assembly that are in communication with the one or more monitoring devices.


Patent
Applied Materials | Date: 2017-02-22

An apparatus for printing on a substrate is disclosed. The apparatus includes a material recovery device (20) and a first linear motor configured for adjusting a distance of the material recovery device (20) with respect to a substrate support (40). Further, a method for printing of a material on a substrate is provided that includes positioning a material recovery device (20) with respect to a substrate support (40) using a first linear motor.


A difference between a first expected required polish time for a first substrate and a second expected required polish time for a second substrate is determined using a first pre-polish thickness and a second pre-polish thickness measured at an in-line metrology station. A duration of an initial period is determined based on the difference between the first expected required polish time and the second expected required polish time. For the initial period at a beginning of a polishing operation, no pressure is applied to whichever of the first substrate and the second substrate has a lesser expected required polish time while simultaneously pressure is applied to whichever of the first substrate and the second substrate has a greater expected required polish time. After the initial period, pressure is applied to both the first substrate and the second substrate.

Loading Applied Materials collaborators
Loading Applied Materials collaborators