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Wiseguyreports.Com Adds “EDA Software -Market Demand, Growth, Opportunities and analysis of Top Key Player Forecast to 2021” To Its Research Database This report studies sales (consumption) of EDA Software in Global market, especially in United States, China, Europe, Japan, focuses on top players in these regions/countries, with sales, price, revenue and market share for each player in these regions, covering Market Segment by Regions, this report splits Global into several key Regions, with sales (consumption), revenue, market share and growth rate of EDA Software in these regions, from 2011 to 2021 (forecast), like United States China Europe Japan Split by product Types, with sales, revenue, price and gross margin, market share and growth rate of each type, can be divided into Electronic Circuit Design and Simulation Tool PCB Software IC Design Software PLD Design Tools Other EDA Software Split by applications, this report focuses on sales, market share and growth rate of EDA Software in each application, can be divided into Application 1 Application 2 Application 3 Global EDA Software Sales Market Report 2016 1 EDA Software Overview 1.1 Product Overview and Scope of EDA Software 1.2 Classification of EDA Software 1.2.1 Electronic Circuit Design and Simulation Tool 1.2.2 PCB Software 1.2.3 IC Design Software 1.2.4 PLD Design Tools 1.2.5 Other EDA Software 1.3 Application of EDA Software 1.3.1 Application 1 1.3.2 Application 2 1.3.3 Application 3 1.4 EDA Software Market by Regions 1.4.1 United States Status and Prospect (2011-2021) 1.4.2 China Status and Prospect (2011-2021) 1.4.3 Europe Status and Prospect (2011-2021) 1.4.4 Japan Status and Prospect (2011-2021) 1.5 Global Market Size (Value and Volume) of EDA Software (2011-2021) 1.5.1 Global EDA Software Sales and Growth Rate (2011-2021) 1.5.2 Global EDA Software Revenue and Growth Rate (2011-2021) 7 Global EDA Software Manufacturers Analysis 7.1 Cadence (USA) 7.1.1 Company Basic Information, Manufacturing Base and Competitors 7.1.2 EDA Software Product Type, Application and Specification 7.1.2.1 Type I 7.1.2.2 Type II 7.1.3 Cadence (USA) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.1.4 Main Business/Business Overview 7.2 Mentor Graphics?USA? 7.2.1 Company Basic Information, Manufacturing Base and Competitors 7.2.2 111 Product Type, Application and Specification 7.2.2.1 Type I 7.2.2.2 Type II 7.2.3 Mentor Graphics?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.2.4 Main Business/Business Overview 7.3 ALTIUM?Australia? 7.3.1 Company Basic Information, Manufacturing Base and Competitors 7.3.2 136 Product Type, Application and Specification 7.3.2.1 Type I 7.3.2.2 Type II 7.3.3 ALTIUM?Australia? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.3.4 Main Business/Business Overview 7.4 ZUKEN?Japan? 7.4.1 Company Basic Information, Manufacturing Base and Competitors 7.4.2 Nov Product Type, Application and Specification 7.4.2.1 Type I 7.4.2.2 Type II 7.4.3 ZUKEN?Japan? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.4.4 Main Business/Business Overview 7.5 Synopsys?USA? 7.5.1 Company Basic Information, Manufacturing Base and Competitors 7.5.2 Product Type, Application and Specification 7.5.2.1 Type I 7.5.2.2 Type II 7.5.3 Synopsys?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.5.4 Main Business/Business Overview 7.6 Magma Design Automation?USA? 7.6.1 Company Basic Information, Manufacturing Base and Competitors 7.6.2 Million USD Product Type, Application and Specification 7.6.2.1 Type I 7.6.2.2 Type II 7.6.3 Magma Design Automation?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.6.4 Main Business/Business Overview 7.7 Agilent EEsof?USA? 7.7.1 Company Basic Information, Manufacturing Base and Competitors 7.7.2 Software Product Type, Application and Specification 7.7.2.1 Type I 7.7.2.2 Type II 7.7.3 Agilent EEsof?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.7.4 Main Business/Business Overview 7.8 SpringSoft?China Taiwan? 7.8.1 Company Basic Information, Manufacturing Base and Competitors 7.8.2 Product Type, Application and Specification 7.8.2.1 Type I 7.8.2.2 Type II 7.8.3 SpringSoft?China Taiwan? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.8.4 Main Business/Business Overview 7.9 ANSYS?USA? 7.9.1 Company Basic Information, Manufacturing Base and Competitors 7.9.2 Product Type, Application and Specification 7.9.2.1 Type I 7.9.2.2 Type II 7.9.3 ANSYS?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.9.4 Main Business/Business Overview 7.10 Apache Design Solutions?USA? 7.10.1 Company Basic Information, Manufacturing Base and Competitors 7.10.2 Product Type, Application and Specification 7.10.2.1 Type I 7.10.2.2 Type II 7.10.3 Apache Design Solutions?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.10.4 Main Business/Business Overview 7.11 Applied Wave Research?USA? 7.12 Vennsa Technologies?Canada? 7.13 CIDC?China?


News Article | November 18, 2016
Site: marketersmedia.com

Wiseguyreports.Com Adds “EDA Software -Market Demand, Growth, Opportunities and analysis of Top Key Player Forecast to 2021” To Its Research Database This report studies sales (consumption) of EDA Software in Global market, especially in United States, China, Europe, Japan, focuses on top players in these regions/countries, with sales, price, revenue and market share for each player in these regions, covering Market Segment by Regions, this report splits Global into several key Regions, with sales (consumption), revenue, market share and growth rate of EDA Software in these regions, from 2011 to 2021 (forecast), like United States China Europe Japan Split by product Types, with sales, revenue, price and gross margin, market share and growth rate of each type, can be divided into Electronic Circuit Design and Simulation Tool PCB Software IC Design Software PLD Design Tools Other EDA Software Split by applications, this report focuses on sales, market share and growth rate of EDA Software in each application, can be divided into Application 1 Application 2 Application 3 Global EDA Software Sales Market Report 2016 1 EDA Software Overview 1.1 Product Overview and Scope of EDA Software 1.2 Classification of EDA Software 1.2.1 Electronic Circuit Design and Simulation Tool 1.2.2 PCB Software 1.2.3 IC Design Software 1.2.4 PLD Design Tools 1.2.5 Other EDA Software 1.3 Application of EDA Software 1.3.1 Application 1 1.3.2 Application 2 1.3.3 Application 3 1.4 EDA Software Market by Regions 1.4.1 United States Status and Prospect (2011-2021) 1.4.2 China Status and Prospect (2011-2021) 1.4.3 Europe Status and Prospect (2011-2021) 1.4.4 Japan Status and Prospect (2011-2021) 1.5 Global Market Size (Value and Volume) of EDA Software (2011-2021) 1.5.1 Global EDA Software Sales and Growth Rate (2011-2021) 1.5.2 Global EDA Software Revenue and Growth Rate (2011-2021) 7 Global EDA Software Manufacturers Analysis 7.1 Cadence (USA) 7.1.1 Company Basic Information, Manufacturing Base and Competitors 7.1.2 EDA Software Product Type, Application and Specification 7.1.2.1 Type I 7.1.2.2 Type II 7.1.3 Cadence (USA) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.1.4 Main Business/Business Overview 7.2 Mentor Graphics(USA) 7.2.1 Company Basic Information, Manufacturing Base and Competitors 7.2.2 111 Product Type, Application and Specification 7.2.2.1 Type I 7.2.2.2 Type II 7.2.3 Mentor Graphics(USA) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.2.4 Main Business/Business Overview 7.3 ALTIUM(Australia) 7.3.1 Company Basic Information, Manufacturing Base and Competitors 7.3.2 136 Product Type, Application and Specification 7.3.2.1 Type I 7.3.2.2 Type II 7.3.3 ALTIUM(Australia) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.3.4 Main Business/Business Overview 7.4 ZUKEN(Japan) 7.4.1 Company Basic Information, Manufacturing Base and Competitors 7.4.2 Nov Product Type, Application and Specification 7.4.2.1 Type I 7.4.2.2 Type II 7.4.3 ZUKEN(Japan) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.4.4 Main Business/Business Overview 7.5 Synopsys(USA) 7.5.1 Company Basic Information, Manufacturing Base and Competitors 7.5.2 Product Type, Application and Specification 7.5.2.1 Type I 7.5.2.2 Type II 7.5.3 Synopsys(USA) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.5.4 Main Business/Business Overview 7.6 Magma Design Automation(USA) 7.6.1 Company Basic Information, Manufacturing Base and Competitors 7.6.2 Million USD Product Type, Application and Specification 7.6.2.1 Type I 7.6.2.2 Type II 7.6.3 Magma Design Automation(USA) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.6.4 Main Business/Business Overview 7.7 Agilent EEsof(USA) 7.7.1 Company Basic Information, Manufacturing Base and Competitors 7.7.2 Software Product Type, Application and Specification 7.7.2.1 Type I 7.7.2.2 Type II 7.7.3 Agilent EEsof(USA) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.7.4 Main Business/Business Overview 7.8 SpringSoft(China Taiwan) 7.8.1 Company Basic Information, Manufacturing Base and Competitors 7.8.2 Product Type, Application and Specification 7.8.2.1 Type I 7.8.2.2 Type II 7.8.3 SpringSoft(China Taiwan) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.8.4 Main Business/Business Overview 7.9 ANSYS(USA) 7.9.1 Company Basic Information, Manufacturing Base and Competitors 7.9.2 Product Type, Application and Specification 7.9.2.1 Type I 7.9.2.2 Type II 7.9.3 ANSYS(USA) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.9.4 Main Business/Business Overview 7.10 Apache Design Solutions(USA) 7.10.1 Company Basic Information, Manufacturing Base and Competitors 7.10.2 Product Type, Application and Specification 7.10.2.1 Type I 7.10.2.2 Type II 7.10.3 Apache Design Solutions(USA) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.10.4 Main Business/Business Overview 7.11 Applied Wave Research(USA) 7.12 Vennsa Technologies(Canada) 7.13 CIDC(China) For more information, please visit https://www.wiseguyreports.com/sample-request/747637-global-eda-software-sales-market-report-2016


Wiseguyreports.Com Adds “EDA Software -Market Demand, Growth, Opportunities and analysis of Top Key Player Forecast to 2021” To Its Research Database This report studies sales (consumption) of EDA Software in Global market, especially in United States, China, Europe, Japan, focuses on top players in these regions/countries, with sales, price, revenue and market share for each player in these regions, covering Market Segment by Regions, this report splits Global into several key Regions, with sales (consumption), revenue, market share and growth rate of EDA Software in these regions, from 2011 to 2021 (forecast), like United States China Europe Japan Split by product Types, with sales, revenue, price and gross margin, market share and growth rate of each type, can be divided into Electronic Circuit Design and Simulation Tool PCB Software IC Design Software PLD Design Tools Other EDA Software Split by applications, this report focuses on sales, market share and growth rate of EDA Software in each application, can be divided into Application 1 Application 2 Application 3 Global EDA Software Sales Market Report 2016 1 EDA Software Overview 1.1 Product Overview and Scope of EDA Software 1.2 Classification of EDA Software 1.2.1 Electronic Circuit Design and Simulation Tool 1.2.2 PCB Software 1.2.3 IC Design Software 1.2.4 PLD Design Tools 1.2.5 Other EDA Software 1.3 Application of EDA Software 1.3.1 Application 1 1.3.2 Application 2 1.3.3 Application 3 1.4 EDA Software Market by Regions 1.4.1 United States Status and Prospect (2011-2021) 1.4.2 China Status and Prospect (2011-2021) 1.4.3 Europe Status and Prospect (2011-2021) 1.4.4 Japan Status and Prospect (2011-2021) 1.5 Global Market Size (Value and Volume) of EDA Software (2011-2021) 1.5.1 Global EDA Software Sales and Growth Rate (2011-2021) 1.5.2 Global EDA Software Revenue and Growth Rate (2011-2021) 7 Global EDA Software Manufacturers Analysis 7.1 Cadence (USA) 7.1.1 Company Basic Information, Manufacturing Base and Competitors 7.1.2 EDA Software Product Type, Application and Specification 7.1.2.1 Type I 7.1.2.2 Type II 7.1.3 Cadence (USA) EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.1.4 Main Business/Business Overview 7.2 Mentor Graphics?USA? 7.2.1 Company Basic Information, Manufacturing Base and Competitors 7.2.2 111 Product Type, Application and Specification 7.2.2.1 Type I 7.2.2.2 Type II 7.2.3 Mentor Graphics?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.2.4 Main Business/Business Overview 7.3 ALTIUM?Australia? 7.3.1 Company Basic Information, Manufacturing Base and Competitors 7.3.2 136 Product Type, Application and Specification 7.3.2.1 Type I 7.3.2.2 Type II 7.3.3 ALTIUM?Australia? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.3.4 Main Business/Business Overview 7.4 ZUKEN?Japan? 7.4.1 Company Basic Information, Manufacturing Base and Competitors 7.4.2 Nov Product Type, Application and Specification 7.4.2.1 Type I 7.4.2.2 Type II 7.4.3 ZUKEN?Japan? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.4.4 Main Business/Business Overview 7.5 Synopsys?USA? 7.5.1 Company Basic Information, Manufacturing Base and Competitors 7.5.2 Product Type, Application and Specification 7.5.2.1 Type I 7.5.2.2 Type II 7.5.3 Synopsys?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.5.4 Main Business/Business Overview 7.6 Magma Design Automation?USA? 7.6.1 Company Basic Information, Manufacturing Base and Competitors 7.6.2 Million USD Product Type, Application and Specification 7.6.2.1 Type I 7.6.2.2 Type II 7.6.3 Magma Design Automation?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.6.4 Main Business/Business Overview 7.7 Agilent EEsof?USA? 7.7.1 Company Basic Information, Manufacturing Base and Competitors 7.7.2 Software Product Type, Application and Specification 7.7.2.1 Type I 7.7.2.2 Type II 7.7.3 Agilent EEsof?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.7.4 Main Business/Business Overview 7.8 SpringSoft?China Taiwan? 7.8.1 Company Basic Information, Manufacturing Base and Competitors 7.8.2 Product Type, Application and Specification 7.8.2.1 Type I 7.8.2.2 Type II 7.8.3 SpringSoft?China Taiwan? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.8.4 Main Business/Business Overview 7.9 ANSYS?USA? 7.9.1 Company Basic Information, Manufacturing Base and Competitors 7.9.2 Product Type, Application and Specification 7.9.2.1 Type I 7.9.2.2 Type II 7.9.3 ANSYS?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.9.4 Main Business/Business Overview 7.10 Apache Design Solutions?USA? 7.10.1 Company Basic Information, Manufacturing Base and Competitors 7.10.2 Product Type, Application and Specification 7.10.2.1 Type I 7.10.2.2 Type II 7.10.3 Apache Design Solutions?USA? EDA Software Sales, Revenue, Price and Gross Margin (2011-2016) 7.10.4 Main Business/Business Overview 7.11 Applied Wave Research?USA? 7.12 Vennsa Technologies?Canada? 7.13 CIDC?China?


Qian Z.-G.,University of Illinois at Urbana - Champaign | Qian Z.-G.,Apache Design Solutions | Chew W.C.,University of Hong Kong
IEEE Transactions on Antennas and Propagation | Year: 2010

The recently developed augmented electric field integral equation (A-EFIE) remedies the well-known low-frequency breakdown. However, it loses accuracy of current when applied to certain low-frequency applications like plane wave scattering. This paper addresses the low-frequency inaccuracy problem, and proposes a perturbation method as a remedy. A-EFIE with perturbation solves the same A-EFIE matrix system with updated right hand side vectors repeatedly to obtain the current and charge on different frequency orders as a perturbation series. This method does not require a search for the loop and tree basis, but the loop and tree currents can also be recovered. Numerical experiments validate the novel method. © 2010 IEEE.


Tong M.S.,University of Illinois at Urbana - Champaign | Qian Z.-G.,University of Illinois at Urbana - Champaign | Qian Z.-G.,Apache Design Solutions | Chew W.C.,University of Illinois at Urbana - Champaign | Chew W.C.,University of Hong Kong
IEEE Transactions on Antennas and Propagation | Year: 2010

The volume integral equations (VIEs) for electromagnetic (EM) scattering by three-dimensional (3D) penetrable objects are solved by Nystrm method. The VIEs are essential and cannot be replaced by surface integral equations (SIEs) for inhomogeneous problems, but they are usually solved by the method of moments (MoM). The Nystrm method as an alternative for the MoM has shown much promise and has been widely used to solve the SIEs, but it is less frequently applied to the VIEs, especially for 3D EM problems. In this work, we implement the Nystrm method for 3D VIEs by developing an efficient local correction scheme for singular and near singular integrals over tetrahedral elements. The scheme first interpolates the unknown functions within the tetrahedral elements and then derives analytical solutions for the resultant singular or near singular integrals after singularity subtraction. The scheme is simpler and more efficient in implementation compared with those based on the redesign of quadrature rules for the singular or near singular integrands. Numerical examples are presented to demonstrate the effectiveness of the proposed scheme and its convergence feature is also studied. © 2006 IEEE.


Guo Z.,Apache Design Solutions | Pan G.G.,Arizona State University | Pan H.K.,Intel Corporation
IEEE Transactions on Components, Packaging and Manufacturing Technology | Year: 2011

A unified full-wave characterization of massive number of vias with or without circular pads is formulated analytically by means of equivalent magnetic frill array model and Galerkin's procedure. The proposed method takes advantage of the parallel-plate structure and employs image theory and Fourier transform to simplify the problem from 3-D configuration into 2-D frame. Based on the cylindrical symmetry with Bessel's functions and addition theorem, the final matrix equation is formulated analytically which can be used immediately for sensitivity analysis in both via dimensions and pad size. As a result, the new method is simple, efficient, and accurate. Numerical examples demonstrate good agreement between our analytical solution and the results obtained by commercial software (high frequency structure simulator) over a frequency range up to 20 GHz. © 2011 IEEE.


He X.,Clemson University | Hubing T.H.,Apache Design Solutions
IEEE Transactions on Electromagnetic Compatibility | Year: 2012

A closed-form expression is derived for determining the maximum possible radiated emissions from a heatsink over a printed circuit board or chassis plane as a function of the maximum voltage between the heatsink and plane. Two modes of radiation are considered: a patch-antenna mode and a monopole-antenna mode. The maximum emissions are the sum of the emissions due to each of these modes. Circuit board dimensions are assumed to be large compared to the heatsink dimensions. The most relevant parameters affecting the emissions are the dimensions of the heatsink. The closed-form expression is validated by comparing its results to full-wave simulation results for a variety of heatsink sizes and shapes. © 2006 IEEE.


Chakraborty S.,Indian Institute of Technology Guwahati | Sharma S.,Apache Design Solutions | Nandi S.,Indian Institute of Technology Guwahati
IEEE Transactions on Mobile Computing | Year: 2015

Current deployment of wireless community networks and wireless municipal services utilizes multi-hop backbone mesh network technology to provide ubiquitous Internet connectivity to the end users. IEEE 802.11s Wireless Mesh Network (WMN) is a promising technology to increase spatial reuse in a mesh backbone using high gain directional antennas. Uses of directional communication in a multi-interface mesh network introduce the problem of unbalanced traffic allocation among the end-to-end flows that results in inefficient channel access using the standard EDCA mechanism. Furthermore, the forwarding protocol should coordinate with the channel access to improve the network performance. In this paper, a localized distributed mechanism is proposed to share the channel bandwidth effectively among interfering interfaces based on the solution of the balanced traffic allocation problem. The standard forwarding algorithm is augmented to use the channel access information effectively in a dynamic network scenario. The performance of the proposed scheme is evaluated through the results obtained from a practical indoor IEEE 802.11n+s directional multi-interface mesh testbed. © 2002-2012 IEEE.


News Article | June 30, 2011
Site: techcrunch.com

ANSYS, which offers simulation software and technologies designed to optimize product development processes, has agreed to acquire Apache Design Solutions, a simulation software provider for low power solutions in the electronics industry. The purchase price is approximately $310 million in cash. The price includes an estimated $29 million in cash on Apache’s balance sheet. ANSYS intends to fund the transaction with cash on-hand from the combined organization. The agreement also includes retention provisions and incentives for certain members of management and employees, earned over a three year period, including an additional $13 million of performance equity awards. Notably, Apache recently filed a registration statement with the SEC for a proposed IPO of its common stock (14 March 2011 to be more precise). Apache’s software enables engineers to design and simulate efficient, low power integrated circuits for high-performance electronic products found in devices such as tablets, smartphones, LCD televisions, laptops and high end computer servers. The acquisition of Apache complements ANSYS’ software solutions for integrated circuits, electronic packages and printed circuit boards. Headquartered in San Jose, California, with locations throughout the world, Apache employs approximately 275 people. The combined company will employ approximately 2,000 people.

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