Unterpremstatten, Austria
Unterpremstatten, Austria

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A position sensor device comprises at least two Hall elements (11, 12) and a signal evaluation circuit (14) that is coupled on its input side to the at least two Hall elements (11, 12) and is designed to provide a digital position signal (ANS). Moreover, the position sensor device (10) comprises a processing unit (15) comprising a loop filter (16) that is coupled on its input side to the signal evaluation unit (14). The processing unit (15) is designed to adaptively control a filter parameter of the loop filter (16) during operation.


The presented principle relates to an optical reader device, to a tag for use on a disposable or replaceable component, to an optical data validation system and to a method for optical data validation. The optical reader device (1) comprises a sensor unit and a signal processing unit. In particular, the sensor unit comprises a light source (5, 6) and an optical sensor arrangement. The light source comprises (5, 6) at least one light emitting component and is arranged for emitting light. The optical sensor arrangement is arranged for generating a first sensor signal indicative of light emitted from the light source and reflected back from a code marking (7) of a tag to be placed in front of the light source (5, 6) in a determined distance. The optical sensor is further arranged for generating a second sensor signal indicative of light emitted by a photo-responsive taggant of the tag after being excited by the light emitted from the light source (5, 6). The signal processing unit comprises a signal processing unit being arranged to process the first sensor signal and the second sensor signal.


Patent
Ams Ag Inc. | Date: 2017-05-10

An optical package is proposed comprising a carrier (4), an optoelectronic component (2), an aspheric lens (1), and a reflective layer (3). The carrier (4) comprises electrical interconnections (5) and the optoelectric component (2) is arranged for emitting and/or detecting electromagnetic radiation in a specified wavelength range. Furthermore, the optoelectric component (2) is mounted on the carrier (4) or integrated into the carrier (4) and electrically connected to the electric interconnections (5). The aspheric lens (1) has an upper surface (11), a lateral surface (12), and a bottom surface (13) and the bottom surface (13) is arranged on or near the optoelectric component (2). The aspheric lens (1) comprises a material which is at least transparent in the specified wavelength range. The reflective layer (3) comprises a reflective material, wherein the reflective layer at least partly covers the lateral surface (12) of the aspheric lens (1), and wherein the reflective material is at least partly reflective in the specified wavelength range.


A method for passive optical motion detection uses an optical sensor arrangement (1) comprising an optical sensor having at least one signal channel. The optical sensor arrangement (1) is initialized for repeated signal acquisition and an initial frame comprising a tuple of sensor data is collected from the at least one signal channel. The initial frame is set as a previous frame. A loop of motion detection is entered and the following steps are repeated. First, a current frame comprising another tuple of sensor data is collected from the at least one signal channel. Then, a motion parameter (M) is computed from a motion metric depending on the current and previous frames. The so computed motion parameter (M) is compared with a threshold value (Mthr). A motion event parameter (P) is set depending on the comparison of the motion parameter (M) with the threshold value (Mthr). The current frame is set as previous frame so that the loop can start all over again.


The sensor semiconductor device comprises a substrate (1) with a main surface (2), a sensor region (3) on or above the main surface, a coating layer (4) above the main surface, and a trench (5) formed in the coating layer around the sensor region. The trench provides drainage of a liquid from the coating layer.


According to the improved concept, a method for analyzing a semiconductor element (SE) comprising polymer residues (RS, RB) located on a surface of the semiconductor element (SE) is provided. The method comprises marking at least a fraction of the residues (RS, RB) by exposing the semiconductor element (SE) to a fluorescent substance and detecting the marked residues (RS, RB) by visualizing the marked residues (RS, RB) on the surface of the semiconductor element (SE) using fluorescence microscopy.


Patent
Ams Ag Inc. | Date: 2017-05-24

A sensor arrangement for determining time-of-flight comprises an emitter (E) configured to periodically emit pulses (EP) of electromagnetic radiation depending on a first clock signal (C1), a photonic demodulator (PDM) configured to detect electromagnetic radiation during detection intervals (DI) comprising first and second intervals (I1, I2) and a processing circuit (PRC). A timing of the detection intervals (DI) is defined by a second clock signal (C2) having a phase difference with respect to the first clock signal (C1). The demodulator (PDM) is configured to generate demodulator signals (DS1, DS2) depending on energy of the radiation detected during at least one of the first intervals (I1) and at least one of the second intervals (I2), respectively. The processing circuit (PRC) is configured to adapt the phase difference based on the demodulator signals (DS 1, DS2) and to generate an output signal (OS) indicative of the time-of-flight based on the phase difference.


Patent
Ams Ag Inc. | Date: 2017-05-24

A photodiode array is disclosed and comprises a first photodiode comprising a first set of spatially separate and electrically interconnected photodiode segments (D1). A second photodiode comprises a second set of spatially separate and electrically interconnected photodiode segments (D2). A first group (12) of photodiode segments comprises photodiode segments from the first and/or second set of photodiode segments. The photodiode segments from the first group of photodiode segments are radially arranged around a common center of symmetry (C0) in a common first distance with respect to the common center of symmetry. A second group (34) of photodiode segments comprises photodiode segments from the first and/or second set of photodiode segments. Photodiode segments from the second group of photodiode segments are radially arranged around the common center of symmetry in a second common distance with respect to the common center of symmetry, wherein the first distance is different from the second distance.


Grant
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-02-2014 | Award Amount: 87.61M | Year: 2015

The key objective of PowerBase Enhanced substrates and GaN pilot lines enabling compact power applications is to ensure the availability of Electronic Components and Systems (ECS) for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of the technology development, bridging the gap between research and exploitation, creating economic and employment growth in the European Union. The project PowerBase aims to contribute to the industrial ambition of value creation in Europe and fully supports this vision by addressing key topics of ECSEL multi annual strategic plan 2014. By positioning PowerBase as innovation action a clear focus on exploitation of the expected result is primary goal. To expand the limits in current power semiconductor technologies the project focuses on setting up a qualified wide band gap GaN technology Pilot line, on expanding the limits of todays silicon based substrate materials for power semiconductors, improving manufacturing efficiency by innovative automation, setting up of a GaN compatible chip embedding pilot line and demonstrating innovation potential in leading compact power application domains. PowerBase is a project proposal with a vertical supply chain involved with contributions from partners in 7 European countries. This spans expertise from raw material research, process innovation, pilot line, assembly innovation and pilot line up to various application domains representing enhanced smart systems. The supporting partners consist of market leaders in their domain, having excellent technological background, which are fully committed to achieve the very challenging project goals. The project PowerBase aims to have significant impact on mart regions. High tech jobs in the area of semiconductor technologies and micro/nano electronics in general are expressed core competences of the regions Austria: Carinthia, Styria, Germany: Sachsen, Bavaria and many other countries/ regions involved.


Grant
Agency: European Commission | Branch: H2020 | Program: ECSEL-IA | Phase: ECSEL-15-2015 | Award Amount: 65.27M | Year: 2016

The EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and creator for answers to the challenges of the modern society. Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establishing three fully connected semiconductor pilot lines in Europe: two 200mm frontend (Dresden and Regensburg) and one backend (Regensburg) lines networking with existing highly specialized manufacturing lines. Focus is the availability of top innovative, competitive sensors and sensor systems Made in Europe for applications in Smart Mobility, Society, Energy, Health and Production. Today competitors are already involved in the development of sensor systems for applications in the emerging Internet of Things. But there is a significant gap between those forces and the capabilities to bring ideas into the high volume market fast enough. IoSense will close this gap by providing three modular flexible pilot lines being seamless integrated in the IoT value crating networks and ready to manufacture each kind of sensor system prototypes. IoSense will increase the manufacturing capacity of sensor/MEMS components in the involved pilot lines by factor of 10 while reducing manufacturing cost and time by 30%. IoSense is designed to enable focused development work on technological and application oriented tasks combining with market orientation. Design to Market Needs will be accomplished by customer involvement, embedding all required functionality besides sensors. Finally, the time for idea-to-market for new sensor systems is intended to be brought down to less than one year. As a result, semiconductor manufacturing will get a new boost in Europe enabling the industry with competitive solutions, securing employment and providing answers to the upcoming challenges in the IoT era.

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