Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2011.3.5 | Award Amount: 12.11M | Year: 2012
PhoxTrot is a large-scale research effort focusing on high-performance, low-energy and cost and small-size optical interconnects across the different hierarchy levels in Data Center and High-Performance Computing Systems: on-board, board-to-board and rack-to-rack. PhoxTrot will tackle optical interconnects in a holistic way, synergizing the different fabrication platforms (CMOS electronics, Si-photonics, polymers, glass, III-Vs, plasmonics) in order to deploy the optimal mix&match technology and tailor this to each interconnect layer. PhoxTrot will follow a layered approach from near-term exploitable to more forward looking but of high expected gain activities. The main objectives of PhoxTrot include the deployment of:\n. generic building block technologies (transmitters, modulators, receivers, switches, optochips, multi- and single-mode optical PCBs, chip- and board-to-board connectors) that can be used for a broad range of applications, extending performance beyond Tb/s and reducing energy by more than 50%.\n. a unified integration/packaging methodology as a cost/energy-reduction factor for board-adaptable 3D SiP transceiver and router optochip fabrication.\n. the whole food-chain of low-cost and low-energy interconnect technologies concluding to 3 fully functional prototype systems: an >1Tb/s throughput optical PCB and >50% reduced energy requirements, a high-end >2Tb/s throughput optical backplane for board-to-board interconnection, and a 1.28Tb/s 16QAM Active Optical Cable that reduces power requirements by >70%.\nTo ensure high commercial impact after the end of PhoxTrot, all activities have been designed around current market roadmaps that will be updated during the course of the project and are led by industrial partners. PhoxTrot brings together the major European industrial and research players in the field. In so doing it will create a highly timely thrust and of unprecedented momentum in optical interconnects in Europe with worldwide impact.
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: ICT-27-2015 | Award Amount: 4.44M | Year: 2016
Driven by the end-users requirements and needs, the main objective of the HIPERDIAS project is to demonstrate high throughput laser-based manufacturing using high-power, high-repetition rate sub-1ps laser. Although the laser system to be developed within HIPERDIAS can address other material processing applications, the focus here will be 3D structuring of silicon at high-speed, precision processing of diamond material and fine cutting of metal for the watch and the medical industry. Chirped Pulse Amplification (CPA) approach based on highly efficient compressors gratings will be implemented in order to minimize the overall losses of the laser system. The final targets of the project are to demonstrate:- a 10-times increase of ablation rate and productivity of large area 3D-structuring of silicon - a 10 times increase of speed in fine cutting metals - an increase of process speed (6-10 times) at a low processing tools cost of diamond machining Therefore, the laser parameters, as well as the beam shaping, beam guiding (based on Kagom fibers) and machine systems will be developed and optimized to fulfill the above manufacturing targets. The laser architecture will be based on fully passive amplifier stages combining hybrid (fiber-bulk) amplifier and thin-disk multipass amplifiers to achieve sub-500fs at an average output power of 500W and sub-1ps at an average output of 1kW, at a repetition rate of 1-2 MHz. Furthermore, second harmonic generation (SHG, 515 nm) and third harmonic generation (THG, 343 nm) will be implemented to allow processing investigation at these wavelengths. At 515 nm (respectively 343 nm) an average power of >=250W (respectively>=100W) shall be demonstrated.
Agency: European Commission | Branch: H2020 | Program: IA | Phase: NMP-04-2014 | Award Amount: 7.88M | Year: 2015
Bringing intelligence and communication to everyday objects is a major challenge for future electronics. This Internet of Things concept envisions wide dissemination with new performances: robustness, large area, flexibility, eco-efficient large volume manufacturing at low cost. Beyond current TOLAE demonstration, a major technology jump driving the scalability towards nanoscale resolution via high-definition cost-effective printing is required to deliver the properties and electrical performances expected by applications. ATLASS Innovation Action takes this huge step by bringing high resolution technologies to the printing industries for the demonstration of products at TRL6 in high impact markets. New multifunctional high-performing inks (semiconductor mobility >1cm2/Vs, dielectrics, ferroelectrics) and high-resolution (down to 500nm and ~100nm thickness) R2R/S2S printing including nano-imprinting and gravure printing will be engineered and scaled-up on pre-industrial pilot lines, enabling high performance devices (speed ~ 10 MHz). In-line control and novel automatic optical inspection tools and methodology will be installed to ramp-up the yield of developed processes (>99%) thus enabling cost-efficient fabrication of advanced circuits (>1000 transistors, 50kHz clock rate). The technology capability is benchmarked with conventional TOLAE process and demonstrated with 4 applications in the field of Interactive objects and Sensing surfaces (temperature tag for smart food packaging, electronic label for logistics, impact force sensing foils for automotive safety -, proximity sensing for safer human-robot collaboration ). With a consortium of 11 top companies (7 SMEs) from the cutting-edge, fast growing printed electronics sector and 4 RTOs with high-level technology expertise, ATLASS will strongly impact the global market of sensors, labels and smart objects expected to reach revenue of several EUR billion with printed sensors share of EUR 644 million by 2022.
Agency: European Commission | Branch: FP7 | Program: MC-ITN | Phase: FP7-PEOPLE-2013-ITN | Award Amount: 3.78M | Year: 2013
The Spintronics in Graphene Training project (SPINOGRAPH) will create a European network of experts providing state-of-the-art training for early stage researchers (ESR) and Experienced Researchers (ER) in the blooming field of Spintronics in Graphene. The huge success of spintronics in metals which, starting from the pioneering discovery of Giant Magnetoresistance (GMR), has revolutionized the magnetoelectronics industry, and the remarkable progress in the fabrication of graphene devices, have naturally led to the exploration of spintronic devices based on graphene. The primary objective of this network is to significantly enhance the employment prospects of E(S)Rs by: (a) choosing a scientific subject that has both a solid ground and an enormous scientific and industrial potential, (b) engaging E(S)R in research projects in world-leading laboratories, including those of 2 Nobel laureates and in collaboration with small and medium enterprises in the emerging industry of graphene (c) ensuring that all researchers receive scientific and complementary skills training that is critical both to academia and industry.
Agency: European Commission | Branch: FP7 | Program: CPCSA | Phase: ICT-2013.9.9 | Award Amount: 74.61M | Year: 2013
This Flagship aims to take graphene and related layered materials from a state of raw potential to a point where they can revolutionize multiple industries from flexible, wearable and transparent electronics, to new energy applications and novel functional composites.\nOur main scientific and technological objectives in the different tiers of the value chain are to develop material technologies for ICT and beyond, identify new device concepts enabled by graphene and other layered materials, and integrate them to systems that provide new functionalities and open new application areas.\nThese objectives are supported by operative targets to bring together a large core consortium of European academic and industrial partners and to create a highly effective technology transfer highway, allowing industry to rapidly absorb and exploit new discoveries.\nThe Flagship will be aligned with European and national priorities to guarantee its successful long term operation and maximal impact on the national industrial and research communities.\nTogether, the scientific and technological objectives and operative targets will allow us to reach our societal goals: the Flagship will contribute to sustainable development by introducing new energy efficient and environmentally friendly products based on carbon and other abundant, safe and recyclable natural resources, and boost economic growth in Europe by creating new jobs and investment opportunities.
Agency: European Commission | Branch: H2020 | Program: SGA-RIA | Phase: FETFLAGSHIP | Award Amount: 89.00M | Year: 2016
This project is the second in the series of EC-financed parts of the Graphene Flagship. The Graphene Flagship is a 10 year research and innovation endeavour with a total project cost of 1,000,000,000 euros, funded jointly by the European Commission and member states and associated countries. The first part of the Flagship was a 30-month Collaborative Project, Coordination and Support Action (CP-CSA) under the 7th framework program (2013-2016), while this and the following parts are implemented as Core Projects under the Horizon 2020 framework. The mission of the Graphene Flagship is to take graphene and related layered materials from a state of raw potential to a point where they can revolutionise multiple industries. This will bring a new dimension to future technology a faster, thinner, stronger, flexible, and broadband revolution. Our program will put Europe firmly at the heart of the process, with a manifold return on the EU investment, both in terms of technological innovation and economic growth. To realise this vision, we have brought together a larger European consortium with about 150 partners in 23 countries. The partners represent academia, research institutes and industries, which work closely together in 15 technical work packages and five supporting work packages covering the entire value chain from materials to components and systems. As time progresses, the centre of gravity of the Flagship moves towards applications, which is reflected in the increasing importance of the higher - system - levels of the value chain. In this first core project the main focus is on components and initial system level tasks. The first core project is divided into 4 divisions, which in turn comprise 3 to 5 work packages on related topics. A fifth, external division acts as a link to the parts of the Flagship that are funded by the member states and associated countries, or by other funding sources. This creates a collaborative framework for the entire Flagship.
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: ICT-27-2015 | Award Amount: 4.15M | Year: 2016
PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated towards establishing a pool of meaningful elementary plasmonic waveguides on co-planar photonic (Si, SiO2 and SiN) platforms along with the associated photonic-plasmonic interfaces. The functional advantages of PLASMOfab technology will be practically demonstrated by developing two novel functional prototypes with outstanding performances: 1) a compact, plasmonic bio-sensor for label-free inflammation markers detection with multichannel capabilities and record-high sensitivity by combining plasmonic sensors with electrical contacts, Si3N4 photonics, high-speed biofunctionalization techniques and microfluidics 2) a 100 Gb/s NRZ transmitter for datacom applications by consolidating low energy and low footprint plasmonic modulator and ultra high-speed SiGe driving electronics in a single monolithic chip. The new integration technology will be verified through wafer-scale fabrication of the prototypes at commercial CMOS fabs, demonstrating volume manufacturing and cost reduction capabilities. PLASMOfab technology will be supported by an EDA software design kit library paving the way for a standardized, fabless plasmonic/photonic IC eco-system.
Agency: European Commission | Branch: H2020 | Program: MSCA-ITN-ETN | Phase: MSCA-ITN-2014-ETN | Award Amount: 3.65M | Year: 2015
Photonics will play a major, enabling role in the future of ICT and healthcare. However, to fulfill its potential and deliver on its promises, photonics will heavily rely on novel and more performing materials, that can be manufactured cheaply for the specific requirements of photonic applications. To lead this photonics revolution and rip the societal benefits of being at the leading-edge of novel technological and scientific developments, the EC needs a highly-skilled scientific and technical workforce that can effectively implement the transition to a truly knowledge-based society. SYNCHRONICS mission is to synergistically address both needs by training a pool of future science-leaders in the synthesis, characterisation and application to photonics of supramolecularly-engineered functional materials within state-of the-art photonic nanostructures fabricated thanks to the top-quality facilities and unique expertise available within the network. This kind of research requires an inter-multidisciplinary, intersectorial approach by specialized and skilled scientists from different disciplines, each one bringing a particular expertise: organic and supramolecular synthesis (UNI-OX,UNI-W, SURFLAY), theory (UNI-GE, IBM, UNI-GE), surface studies (UdS, UCL), photophysics (IIT, IBM, UCL, UNI-GE,UNI-CY, UNI-MO), device fabrication and characterisation (IBM, AMO, SURFLAY, UCL, IIT, UNI-PI, UNI-GE). The SYNCHRONIX Network, through the trans-national and trans-disciplinary coordination and integration of these 12, highly specialised and internationally-leading teams, consolidates the European training efforts in the emerging area of both supramolecular nanoscience and nanophotonics. SYNCHRONICS will deliver 540 person-months of unparalleled multidisciplinary and intersectorial training that is carefully and intensively structured through local, network wide, and extra-network training in both scientific/technical topics, as well as complementary and managerial skills.
Agency: European Commission | Branch: H2020 | Program: RIA | Phase: FETOPEN-01-2016-2017 | Award Amount: 3.88M | Year: 2017
The proposal PHASE-CHANGE SWITCH addresses the need for combined energy efficiency and extended functionality with the engineering of new classes of solid-state Beyond CMOS switches exploiting the abrupt phase-change (Metal-Insulator-Transition - MIT) in materials and at temperatures that make them interesting for electronic circuits and systems by their performance, energy efficiency and scalability. The proposal includes disruptive research contributions on the whole value chain, from novel phase-change materials to new device and circuit architectures together with their scaling and integration on silicon and GaN platforms. On materials alloying and straining techniques in phase-change systems are used for the engineering of the transition temperature and the ON and OFF bandgaps (conductivity) of VO2. A significant advance is the three-terminal energy efficient phase-change electronic switch with deep-sub-thermionic average slope (<10mV/decade at room temperature), operating at sub-0.5V voltage supply, with ON current better than silicon MOSFET and OFF current comparable with tunnel FETs, surpassing the state-of-the-art. The proposal focuses on smart design and exploitation of the unique properties of the phase-change VO2 beyond CMOS switches, by targeting with the same technology platform: (i) von-Neumann steep-slope logic devices and circuits, to extend CMOS with novel functionality and energy efficiency, (ii) uniquely reconfigurable energy efficient radio-frequency (RF) circuit functions from 1 to 100GHz, (iii) unconventional scalable neuristors exploiting the hysteretic RC switching behaviour for neuromorphic computation, and, (iv) disruptive classes of solid-state ionitronic devices for neuromorphic computation, exploiting non-volatile memory effects. The proposed research is expected to create new applications and markets and reinforce the leadership of European industrial players in the field of energy efficient IoT and high frequency communications.