Fiori G.,University of Pisa |
Bonaccorso F.,Italian Institute of Technology |
Iannaccone G.,University of Pisa |
Palacios T.,Massachusetts Institute of Technology |
And 4 more authors.
Nature Nanotechnology | Year: 2014
The compelling demand for higher performance and lower power consumption in electronic systems is the main driving force of the electronics industry's quest for devices and/or architectures based on new materials. Here, we provide a review of electronic devices based on two-dimensional materials, outlining their potential as a technological option beyond scaled complementary metal-oxide-semiconductor switches. We focus on the performance limits and advantages of these materials and associated technologies, when exploited for both digital and analog applications, focusing on the main figures of merit needed to meet industry requirements. We also discuss the use of two-dimensional materials as an enabling factor for flexible electronics and provide our perspectives on future developments. © 2014 Macmillan Publishers Limited.
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: ICT-27-2015 | Award Amount: 4.44M | Year: 2016
Driven by the end-users requirements and needs, the main objective of the HIPERDIAS project is to demonstrate high throughput laser-based manufacturing using high-power, high-repetition rate sub-1ps laser. Although the laser system to be developed within HIPERDIAS can address other material processing applications, the focus here will be 3D structuring of silicon at high-speed, precision processing of diamond material and fine cutting of metal for the watch and the medical industry. Chirped Pulse Amplification (CPA) approach based on highly efficient compressors gratings will be implemented in order to minimize the overall losses of the laser system. The final targets of the project are to demonstrate: - a 10-times increase of ablation rate and productivity of large area 3D-structuring of silicon - a 10 times increase of speed in fine cutting metals - an increase of process speed (6-10 times) at a low processing tools cost of diamond machining Therefore, the laser parameters, as well as the beam shaping, beam guiding (based on Kagom fibers) and machine systems will be developed and optimized to fulfill the above manufacturing targets. The laser architecture will be based on fully passive amplifier stages combining hybrid (fiber-bulk) amplifier and thin-disk multipass amplifiers to achieve sub-500fs at an average output power of 500W and sub-1ps at an average output of 1kW, at a repetition rate of 1-2 MHz. Furthermore, second harmonic generation (SHG, 515 nm) and third harmonic generation (THG, 343 nm) will be implemented to allow processing investigation at these wavelengths. At 515 nm (respectively 343 nm) an average power of >=250W (respectively >=100W) shall be demonstrated.
PhoxTroT - Photonics for High-Performance, Low-Cost & Low-Energy Data Centers, High Performance Computing Systems:Terabit/s Optical Interconnect Technologies for On-Board, Board-to-Board, Rack-to-Rack data links
Agency: Cordis | Branch: FP7 | Program: CP | Phase: ICT-2011.3.5 | Award Amount: 12.11M | Year: 2012
PhoxTrot is a large-scale research effort focusing on high-performance, low-energy and cost and small-size optical interconnects across the different hierarchy levels in Data Center and High-Performance Computing Systems: on-board, board-to-board and rack-to-rack. PhoxTrot will tackle optical interconnects in a holistic way, synergizing the different fabrication platforms (CMOS electronics, Si-photonics, polymers, glass, III-Vs, plasmonics) in order to deploy the optimal mix&match technology and tailor this to each interconnect layer. PhoxTrot will follow a layered approach from near-term exploitable to more forward looking but of high expected gain activities. The main objectives of PhoxTrot include the deployment of:\n. generic building block technologies (transmitters, modulators, receivers, switches, optochips, multi- and single-mode optical PCBs, chip- and board-to-board connectors) that can be used for a broad range of applications, extending performance beyond Tb/s and reducing energy by more than 50%.\n. a unified integration/packaging methodology as a cost/energy-reduction factor for board-adaptable 3D SiP transceiver and router optochip fabrication.\n. the whole food-chain of low-cost and low-energy interconnect technologies concluding to 3 fully functional prototype systems: an >1Tb/s throughput optical PCB and >50% reduced energy requirements, a high-end >2Tb/s throughput optical backplane for board-to-board interconnection, and a 1.28Tb/s 16QAM Active Optical Cable that reduces power requirements by >70%.\nTo ensure high commercial impact after the end of PhoxTrot, all activities have been designed around current market roadmaps that will be updated during the course of the project and are led by industrial partners. PhoxTrot brings together the major European industrial and research players in the field. In so doing it will create a highly timely thrust and of unprecedented momentum in optical interconnects in Europe with worldwide impact.
Agency: Cordis | Branch: H2020 | Program: MSCA-ITN-ETN | Phase: MSCA-ITN-2014-ETN | Award Amount: 3.65M | Year: 2015
Photonics will play a major, enabling role in the future of ICT and healthcare. However, to fulfill its potential and deliver on its promises, photonics will heavily rely on novel and more performing materials, that can be manufactured cheaply for the specific requirements of photonic applications. To lead this photonics revolution and rip the societal benefits of being at the leading-edge of novel technological and scientific developments, the EC needs a highly-skilled scientific and technical workforce that can effectively implement the transition to a truly knowledge-based society. SYNCHRONICS mission is to synergistically address both needs by training a pool of future science-leaders in the synthesis, characterisation and application to photonics of supramolecularly-engineered functional materials within state-of the-art photonic nanostructures fabricated thanks to the top-quality facilities and unique expertise available within the network. This kind of research requires an inter-multidisciplinary, intersectorial approach by specialized and skilled scientists from different disciplines, each one bringing a particular expertise: organic and supramolecular synthesis (UNI-OX,UNI-W, SURFLAY), theory (UNI-GE, IBM, UNI-GE), surface studies (UdS, UCL), photophysics (IIT, IBM, UCL, UNI-GE,UNI-CY, UNI-MO), device fabrication and characterisation (IBM, AMO, SURFLAY, UCL, IIT, UNI-PI, UNI-GE). The SYNCHRONIX Network, through the trans-national and trans-disciplinary coordination and integration of these 12, highly specialised and internationally-leading teams, consolidates the European training efforts in the emerging area of both supramolecular nanoscience and nanophotonics. SYNCHRONICS will deliver 540 person-months of unparalleled multidisciplinary and intersectorial training that is carefully and intensively structured through local, network wide, and extra-network training in both scientific/technical topics, as well as complementary and managerial skills.
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: ICT-27-2015 | Award Amount: 4.15M | Year: 2016
PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated towards establishing a pool of meaningful elementary plasmonic waveguides on co-planar photonic (Si, SiO2 and SiN) platforms along with the associated photonic-plasmonic interfaces. The functional advantages of PLASMOfab technology will be practically demonstrated by developing two novel functional prototypes with outstanding performances: 1) a compact, plasmonic bio-sensor for label-free inflammation markers detection with multichannel capabilities and record-high sensitivity by combining plasmonic sensors with electrical contacts, Si3N4 photonics, high-speed biofunctionalization techniques and microfluidics 2) a 100 Gb/s NRZ transmitter for datacom applications by consolidating low energy and low footprint plasmonic modulator and ultra high-speed SiGe driving electronics in a single monolithic chip. The new integration technology will be verified through wafer-scale fabrication of the prototypes at commercial CMOS fabs, demonstrating volume manufacturing and cost reduction capabilities. PLASMOfab technology will be supported by an EDA software design kit library paving the way for a standardized, fabless plasmonic/photonic IC eco-system.