Amkor Technology, Inc. is a semiconductor product packaging and test services provider. Its headquarters is in Chandler, Arizona, since 2005, when it was moved from West Chester, Pennsylvania, United States. The company was founded in 1969 and has 21,600 employees worldwide and reported $2.8 billion in sales in 2011.With factories in China, Japan, Korea, Malaysia, Philippines and Taiwan, Amkor is a leading player in the semiconductor industry. It packages and tests integrated circuits for chip manufacturers. Wikipedia.
Amkor Technology Inc. | Date: 2015-01-08
Laser assisted bonding for semiconductor die interconnections is disclosed and may, for example, include forming flux on a circuit pattern on a circuit board, placing a semiconductor die on the circuit board where a bump on the semiconductor die contacts the flux, and reflowing the bump by directing a laser beam toward the semiconductor die. The laser beam may volatize the flux and make an electrical connection between the bump and the circuit pattern. A jig plate may be placed on the semiconductor die when the laser beam is directed toward the semiconductor die. Warpage may be reduced during heating or cooling of the semiconductor die by applying pressure to the jig plate. Jig bars may extend outward from the jig plate and may be in contact with the circuit board during the application of pressure to the jig plate. The jig plate may comprise one or more of: silicon, silicon carbide, and glass.
Amkor Technology Inc. | Date: 2015-06-15
Methods and systems for a semiconductor package may comprise a package device comprising at least one semiconductor chip and an active element attached to a substrate and a window with sidewalls forming cavity regions for the package device and coupled to the substrate with an adhesive. An outer edge of the substrate may be flush with an outer surface of the window sidewalls. The window may be plastic and may include an EMI shielding layer, which may be a copper/nickel plating layer. The semiconductor chip may be a MEMS microphone device. The sidewalls and a top plate of the window may be at a right angle to each other. The package may be formed by severing it from an NM array of package structures resulting in the outer edges being flush.
Amkor Technology Inc. | Date: 2015-05-26
In one embodiment, a lead frame package structure includes a lead frame having sides that surround a die paddle and on which a plurality of leads are formed. An electronic chip is attached to the die paddle and a case is attached to the lead frame to seal the leads and the electronic chip. One or more discharge holes are formed on and extending through one or more specific leads and/or on and extending through a predetermined position of the die paddle. The discharge holes are configured to discharge air pressure that forms during the assembly process thereby improving the reliability of the packaged electronic chip.
Amkor Technology Inc. | Date: 2015-12-21
Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die are stacked on each other, and then a first encapsulant is formed, so that the carrier may be easily removed when compared to approaches in which a carrier is removed from a wafer having a thin thickness.
Amkor Technology Inc. | Date: 2015-05-22
A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer.