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Sunnyvale, CA, United States

Advanced Micro Devices, Inc. (AMD) is an American worldwide semiconductor company based in Sunnyvale, California, United States, that develops computer processors and related technologies for business and consumer markets. Wikipedia.


Patent
AMD Inc and ATI Technologies | Date: 2015-08-24

A method and system for allocating memory to a memory operation executed by a processor in a computer arrangement having a first processor configured for unified operation with a second processor. The method includes receiving a memory operation from a processor and mapping the memory operation to one of a plurality of memory heaps. The mapping produces a mapping result. The method also includes providing the mapping result to the processor.


The present invention relates to die-die stacking structure and the method for making the same. The die-die stacking structure comprises a top die having a bottom surface, a first insulation layer covering the bottom surface of the top die, a bottom die having a top surface, a second insulation layer covering the top surface of the bottom die, a plurality of connection members between the top die and the bottom die and a protection material between the first insulation layer and the second insulation layer. The plurality of connection members communicates the top die with the bottom die. The protection material bridges the plurality of connection members to form a mesh layout between the first insulation layer and the second insulation layer. The structure and method of present invention at least provide more strength and stress buffer to resist die warpage and absorb thermal cycling stress, and then prevents the bump and dielectric materials in the die-die stacking structure from cracking caused by thermal stress or external mechanical stress.


A processing device is provided that includes a first, second and third precision operation circuit. The processing device further includes a shared, bit-shifting circuit that is communicatively coupled to the first, second and third precision operation circuits. A method is also provided for multiplying a first and second binary number including adding a first exponent value associated with the first binary number to a second exponent value associated with the second binary number and multiplying a first mantissa value associated with the first binary number to a second mantissa value associated with the second binary number. The method includes performing the exponent adding and mantissa multiplying substantially in parallel. The method further includes performing at least one of adding or subtracting a third binary number to the product. Also provided is a computer readable storage device encoded with data for adapting a manufacturing facility to create an apparatus.


Patent
AMD Inc | Date: 2015-10-09

A method and apparatus is provided for block based compression of a texture using hardware supported compression formats. The method comprises dividing a texture into a plurality of blocks, for each block, determining a transform for use with the block to minimize an error metric, encoding at least one characteristic of the transform into a plurality of bits otherwise available to represent reference component values, and compressing the block.


Patent
AMD Inc | Date: 2015-06-12

Various methods and apparatus for joining stacked substrates to a circuit board are disclosed. In one aspect, a method of manufacturing is provided that includes coupling plural substrates to form a stack. At least one of the plural substrates is a semiconductor chip. Plural conductive vias are formed in a first of the plural substrates. Each of the plural conductive vias includes a first end positioned in the first substrate and a second end projecting out of the first substrate.

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