Salem, NH, United States
Salem, NH, United States

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Patent
AmberWave, Inc. | Date: 2014-03-17

A device, system, and method for a multi junction solar cell are described herein. An exemplary multi-solar cell structure can have a substrate having a first surface having a (111) crystalline etched surface. A dielectric layer can be deposited on the first surface of the substrate. A graded buffer layer can be grown on a second surface of the substrate with the second surface having a (100) crystalline surface. A first solar subcell within or on top of the graded buffer layer and a second solar subcell grown on top of the first solar subcell.


Patent
AmberWave, Inc. | Date: 2015-07-17

A device, system, and method for solar cell construction and layer transfer are disclosed herein. An exemplary method of solar cell construction involves providing a silicon donor substrate. A porous layer is formed on the donor substrate. A first portion of a solar cell is constructed on the porous layer of the donor substrate. The solar cell and donor substrate are bonded to a flexible substrate. The flexible substrate and the first portion of a solar cell are then separated from the donor substrate at the porous layer. A second portion of a solar cell may then be constructed on the first portion of a solar cell providing a single completed solar cell.


Patent
AmberWave, Inc. | Date: 2011-09-21

A device, system, and method for solar cell construction and layer transfer are disclosed herein. An exemplary method of solar cell construction involves providing a silicon donor substrate. A porous layer is formed on the donor substrate. A first portion of a solar cell is constructed on the porous layer of the donor substrate. The solar cell and donor substrate are bonded to a flexible substrate. The flexible substrate and the first portion of a solar cell are then separated from the donor substrate at the porous layer. A second portion of a solar cell may then be constructed on the first portion of a solar cell providing a single completed solar cell.


Patent
AmberWave, Inc. | Date: 2012-04-30

A device, system, and method for solar cell construction and bonding/layer transfer are disclosed herein. An exemplary structure of solar cell construction involves providing a monocrystalline donor layer. A solder bonding layer bonds the donor layer to a carrier substrate. A porous layer may be used to separate the donor layer.


Patent
AmberWave, Inc. | Date: 2011-01-24

A method includes growing a first epitaxial layer of III-nitride material, forming a damaged region by implanting ions into an exposed surface of the first epitaxial layer, and growing a second epitaxial layer of III-nitride material on the exposed surface of the first epitaxial layer. A level of defects present in the second epitaxial layer is less than a level of defects present in the first epitaxial layer.


Patent
AmberWave, Inc. | Date: 2012-09-04

A device, system, and method for a multi-junction solar cell is described herein. An exemplary silicon germanium solar cell structure has a substrate with a graded buffer layer grown on the substrate. A base layer and emitter layer for a first solar cell are grown in or on the graded buffer layer. A first junction is provided between the emitter layer and the base layer. A second solar cell is grown on top of the first solar cell.


Grant
Agency: NSF | Branch: Standard Grant | Program: | Phase: | Award Amount: 150.00K | Year: 2012

This Small Business Innovation Research Phase I project will develop a silicon solar cell with unique junction design that provides synergistic benefits as the thickness of the solar cell is reduced. Thin silicon solar cells are currently the subject of intense interest because, in comparison to conventional bulk silicon solar cells: (a) they can be produced by kerfless techniques that result in a tiny fraction of silicon usage, as compared to conventional cells, and (b) their reduced recombination volume leads to higher open circuit voltage and therefore higher efficiency. To date, however, the open circuit voltages and efficiencies of thin silicon solar cells have generally not exceeded their bulk silicon counterparts. Our junction design will help fulfill the promise of high open circuit voltage in these systems, ultimately enabling greater than 20% efficiency with less than 5% of the silicon usage of conventional silicon solar cells. The Phase I effort will achieve open circuit voltage greater than 700 mV and efficiency greater than 19% for ultra-thin (10 micron) cells with an industrially feasible solar cell design. In Phase II and beyond, we will transition these findings to pilot-scale production tools and demonstrate greater than 20% efficient ultra-thin silicon solar cells.

The broader impact/commercial potential of this project is as follows. If successful, this project will help enable lower-cost generation of electricity by photovoltaics, by radically reducing the amount of silicon used in the solar cell and by boosting cell efficiency. In addition, our process leads to a uniquely physically robust thin Si wafer, which will lead to increased downstream manufacturing yield, further lowering cost. This project will also advance the basic science of solar cells by exploring a novel junction design. In Phase I, our team will present results at prominent conferences devoted to photovoltaics, and publish articles on this technology in peer-reviewed technical journals. Commercially, we plan to partner with manufacturing tool suppliers to demonstrate the new integrated wafer at pilot scale. The solar cells and modules can be readily finished using stranded solar manufacturing assets in the United States. We will further partner with large-scale manufacturers to bring this technology to market. It is uniquely suited to rooftop products, which will create an opportunity to partner with manufacturers who are not presently in the solar products business.


Grant
Agency: National Science Foundation | Branch: | Program: SBIR | Phase: Phase I | Award Amount: 150.00K | Year: 2012

This Small Business Innovation Research Phase I project will develop a silicon solar cell with unique junction design that provides synergistic benefits as the thickness of the solar cell is reduced. Thin silicon solar cells are currently the subject of intense interest because, in comparison to conventional bulk silicon solar cells: (a) they can be produced by "kerfless" techniques that result in a tiny fraction of silicon usage, as compared to conventional cells, and (b) their reduced recombination volume leads to higher open circuit voltage and therefore higher efficiency. To date, however, the open circuit voltages and efficiencies of thin silicon solar cells have generally not exceeded their bulk silicon counterparts. Our junction design will help fulfill the promise of high open circuit voltage in these systems, ultimately enabling greater than 20% efficiency with less than 5% of the silicon usage of conventional silicon solar cells. The Phase I effort will achieve open circuit voltage greater than 700 mV and efficiency greater than 19% for ultra-thin (10 micron) cells with an industrially feasible solar cell design. In Phase II and beyond, we will transition these findings to pilot-scale production tools and demonstrate greater than 20% efficient ultra-thin silicon solar cells. The broader impact/commercial potential of this project is as follows. If successful, this project will help enable lower-cost generation of electricity by photovoltaics, by radically reducing the amount of silicon used in the solar cell and by boosting cell efficiency. In addition, our process leads to a uniquely physically robust thin Si wafer, which will lead to increased downstream manufacturing yield, further lowering cost. This project will also advance the basic science of solar cells by exploring a novel junction design. In Phase I, our team will present results at prominent conferences devoted to photovoltaics, and publish articles on this technology in peer-reviewed technical journals. Commercially, we plan to partner with manufacturing tool suppliers to demonstrate the new integrated wafer at pilot scale. The solar cells and modules can be readily finished using stranded solar manufacturing assets in the United States. We will further partner with large-scale manufacturers to bring this technology to market. It is uniquely suited to rooftop products, which will create an opportunity to partner with manufacturers who are not presently in the solar products business.


Grant
Agency: Department of Defense | Branch: Army | Program: SBIR | Phase: Phase I | Award Amount: 100.00K | Year: 2015

AmberWave, Inc. has developed a method to laminate an ultra-thin (10-20um) monocrystalline Si layer to a conductive and fracture-resistant supporting layer such as a thin steel alloy foil. With this technology we have integrated front and rear cell processes based on the world-record PERL (Passivated Emitter Rear Locally diffused) silicon solar cell design, and have demonstrated efficiency of over 17% with a pathway to over 24%. Under the proposed SBIR Phase I project we will develop a design for a flexible solar array utilizing this technology, with array efficiency of at least 22% and with at least 0.06 watt/gram conversion efficiency, with potential for over 0.09 watt/gram. Performance at high incidence angles will be enhanced. Targeted solar cell array cost will be below $2/W in sufficient volume.


Patent
AmberWave, Inc. | Date: 2011-01-19

A device, system, and method for solar cell construction and bonding/layer transfer are disclosed herein. An exemplary structure of solar cell construction involves providing a monocrystalline donor absorber layer. A conductive bonding layer bonds the absorber layer to a carrier substrate. A porous layer or ion implant may be used to form the donor absorber layer.

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