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Santa Clara, CA, United States

Alliance Semiconductor Corporation designs and manufactures memory and memory-intensive logic. Alliance's product lines include Static Random Access Memory , Pseudo SRAM , Dynamic Random Access Memory , Flash Memory, and embedded memory and logic solutions. For a little while they also sold some video chipsets for PCs. Founded in 1985, Alliance is headquartered in Santa Clara, California, with design centers in Santa Clara, as well as Hyderabad and Bangalore, India. Wikipedia.


Patent
Alliance Semiconductor | Date: 2015-06-24

A microprocessor performs a fused multiply-accumulate operation of a form A*BC using first and second execution units. An input operand analyzer circuit determines whether values of A, B and/or C meet a sufficient condition to perform a joint accumulation of C with partial products of A and B. The first instruction execution unit multiplies A and B and jointly accumulates C to partial products of A and B when the values of A, B and/or C meet a sufficient condition to perform a joint accumulation of C with the partial products of A and B. The second instruction execution unit separately accumulates C to the products of A and B when the values of A, B and/or C do not meet a sufficient condition to perform a joint accumulation of C with the partial products of A and B.


Patent
Alliance Semiconductor | Date: 2015-03-02

An apparatus includes a device programmer, coupled to a plurality of semiconductor fuses disposed on a die, configured to program the plurality of semiconductor fuses with compressed configuration data for a plurality of cores disposed separately on the die. The device programmer has a virtual fuse array and a compressor. The virtual fuse array is configured to store the configuration data for the plurality of cores. The configuration data includes a plurality of data types. The compressor is coupled to the virtual fuse array and is configured to read the virtual fuse array, and is configured to compress the configuration data by employing a plurality of compression algorithms to generate the compressed configuration data, where the plurality of compression algorithms correspond to the plurality of data types.


Patent
Alliance Semiconductor | Date: 2015-03-02

An apparatus includes a semiconductor fuse array, a cache memory, and a plurality of cores. The semiconductor fuse array is disposed on a die, into which is programmed the configuration data. The semiconductor fuse array has a first plurality of semiconductor fuses that is configured to store compressed cache correction data. The a cache memory is disposed on the die. The plurality of cores is disposed on the die, where each of the plurality of cores is coupled to the semiconductor fuse array and the cache memory, and is configured to access the semiconductor fuse array upon power-up/reset, to decompress the compressed cache correction data, and to distribute decompressed cached correction data to initialize the cache memory.


Patent
Alliance Semiconductor | Date: 2015-03-02

An apparatus including a plurality of cores and a fuse array. The plurality of cores is disposed on a die. The fuse array is disposed on the die and is coupled to each of the plurality of cores, where the fuse array includes a first plurality of semiconductor fuses and a second plurality of semiconductor fuses. The first plurality of semiconductor fuses is programmed with compressed configuration data for the each of the plurality of cores. The second plurality of semiconductor fuses is programmed with core designation data that associates some of the compressed configuration data with one of the plurality of cores, where the one of the plurality of cores accesses and decompresses the some of the compressed configuration data upon power-up/reset, for initialization of elements within the one of the plurality of cores.


An apparatus has a fuse array, a device programmer, and a plurality of cores. The fuse array is disposed on a die, where the fuse array comprises a plurality of semiconductor fuses. The device programmer is coupled to the fuse array and is configured to access the configuration data, to compress the configuration data to yield compressed configuration data, and to program the fuse array with the compressed configuration data. The plurality of cores is disposed separately on the die and is coupled to the fuse array, where each of the plurality of cores accesses and decompresses all of the compressed configuration data upon power-up/reset, for initialization of elements within the each of the plurality of cores.

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