Akron, OH, United States
Akron, OH, United States

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Patent
Sumitomo Bakelite and Akron Polymer Systems, Inc. | Date: 2015-08-05

In one or a plurality of embodiments, a process for manufacturing polyamide, with a reduced use of an amide-based solvent in synthesis, is provided. In one or a plurality of embodiments, provided is a process for manufacturing polyamide, including steps (1) to (3): (1) dissolving diamine in a non-amide-based organic solvent or a non-amide-based organic solvent containing 10 mass% or less of an amide-based organic solvent; (2) adding diacid dichloride to a solution obtained in the step (1) and reacting the diamine with the diacid dichloride so as to generate polyamide; and (3) adding a trapping reagent capable of trapping hydrochloric acid.


Patent
Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2015-10-02

A cover member includes a base material having a film shape and containing an amorphous aromatic polyamide. Further, it is preferred that the aromatic polyamide contains a carboxyl group. Furthermore, it is preferred that the aromatic polyamide contains a rigid structure in an amount of 85 mol % or more. Moreover, it is preferred that a tensile elastic modulus of the base material is 4 GPa or more. This makes it possible to provide a cover member having a good flatness keeping property and excellent long-term durability, and an electronic device provided with such a cover member and having excellent reliability.


Patent
Akron Polymer Systems, Inc. | Date: 2015-08-31

A solvent resistant, transparent aromatic polyamide film with a high refractive index may be made by reacting at least one aromatic diacid chloride, a first aromatic diamine, and at least one crosslinking agent or a second aromatic diamine in an organic solvent to form an aromatic polyamide polymer in solution. In one embodiment, the at least one aromatic diacid chloride is selected from the group consisting of isophthaloyl dichloride, terephthaloyl dichloride, 2,6-naphthalene-dicarboxylic chloride, or combinations thereof and the first aromatic diamine is selected from the group consisting of 9,9-Bis(4-hydroxyphenyl)fluorine, 2,2,5,5-Tetrachlorobenzidine, or combinations thereof. The organic solvent is then evaporated from the aromatic polyamide polymer in solution to form a transparent aromatic polyamide precursor film. The precursor film is then heated at a temperature close to the glass transition temperature of the transparent aromatic polyamide precursor film to form the solvent resistant, transparent aromatic polyamide film.


Patent
Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2015-02-19

In an aspect, the present disclosure relates to a polyamide solution including aromatic polyamide and a solvent. A dimension change gap between a cast film of the polyamide solution and the cast film after being subjected to a heat treatment is not more than a predetermined value. In another aspect, the present disclosure relates to a method for manufacturing a display element, an optical element, an illumination element or a sensor element, including a step of forming a polyamide film by using the polyamide solution.


Patent
Akron Polymer Systems, Inc. | Date: 2016-01-22

A polymer blend includes a combination of an acrylic polymer and a styrenic fluoropolymer. The polymer blend may be used to make polymer films having a single glass transition temperature, a polarizing plate, or a display device with enhanced optical properties.


The present disclosure, in one aspect, relates to a polyamide solution including an aromatic polyamide and a solvent, wherein the aromatic polyamide includes at least two types of constitutional units, and a change rate of coefficient of thermal expansion (CTE) of a cast film produced by casting the polyamide solution on a glass plate and CTE of the same cast film after being subjected to a heat treatment at temperature of 200 C. to 450 C. (=CTE after heat treatment/CTE before heat treatment) is 1.3 or less.


Patent
Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2015-09-09

In one or a plurality of embodiments, a process for manufacturing polyamide without using PrO (propylene oxide) in synthesis is provided. In one or a plurality of embodiments, provided is a process for manufacturing polyamide, including steps (a) to (c): (a) reacting diacid dichloride monomer with at least two kinds of diamine monomers in a solvent so as to generate polyamide; and (b) removing hydrochloric acid physically out of a reaction system, the hydrochloric acid being generated during the reaction in the step (a); or (c) adding a trapping reagent capable of trapping hydrochloric acid, at any time at least before the step (a), at the same time of starting the step (a), or during the step (a), wherein at least one of the diamine monomers is a diamine monomer containing a carboxyl group, and the trapping reagent does not include propylene oxide.


Patent
Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2015-09-09

The present disclosure, in one aspect, relates to a polyamide solution which can suppress the yellowness. The present disclosure, in one or a plurality of embodiments, relates to a polyamide solution comprising an aromatic polyamide and a solvent, the aromatic polyamide comprising a constitutional unit having one or more free carboxyl groups and having an aromatic ring structure and an alicyclic structure in the main chain. Further, the present disclosure, in one aspect, relates to a laminated composite material, comprising a glass plate and a polyamide resin layer; the polyamide resin layer laminated onto one surface of the glass plate, the polyamide resin layer having yellowness (JIS K7373) of 2.4 or less; and the polyamide resin layer obtained by applying the solution onto the glass plate.


Patent
Sumitomo Bakelite and Akron Polymer Systems, Inc. | Date: 2015-05-28

This disclosure, viewed from one aspect, relates to a method for producing a sensor element, including the following steps (A) and (B):


Patent
Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2016-01-15

In an aspect, the present disclosure relates to a polyamide solution comprising an aromatic polyamide and a solvent, wherein a Youngs modulus of at least one direction of a cast film produced by casting the polyamide solution on a glass plate is 3.0 GPa or more, and a tensile strength of the cast film is 100 MPa or more and 250 MPa or less. In another aspect, the present disclosure relates to a polyamide solution comprising an aromatic polyamide and a solvent, wherein a Youngs modulus of at least one direction of a cast film produced by casting the polyamide solution on a glass plate is 3.0 GPa or more, and an aromatic polyamide of the polyamide solution has a constitutional unit represented by following general formulae (I) and (II).

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