Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2015-02-19
In an aspect, the present disclosure relates to a polyamide solution including aromatic polyamide and a solvent. A dimension change gap between a cast film of the polyamide solution and the cast film after being subjected to a heat treatment is not more than a predetermined value. In another aspect, the present disclosure relates to a method for manufacturing a display element, an optical element, an illumination element or a sensor element, including a step of forming a polyamide film by using the polyamide solution.
Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2014-10-03
Provided are a resin composition and a substrate that are capable of being used for manufacturing an electronic device having excellent light extraction efficiency. The resin composition contains a crystalline polymer and a solvent dissolving the crystalline polymer. The resin composition is used to form a layer, and a haze value of the layer is 5% or more. Further, a method of manufacturing the electronic device by using such a substrate, and the electronic device are also provided.
Sumitomo Bakelite and Akron Polymer Systems, Inc. | Date: 2015-08-05
In one or a plurality of embodiments, a process for manufacturing polyamide, with a reduced use of an amide-based solvent in synthesis, is provided. In one or a plurality of embodiments, provided is a process for manufacturing polyamide, including steps (1) to (3): (1) dissolving diamine in a non-amide-based organic solvent or a non-amide-based organic solvent containing 10 mass% or less of an amide-based organic solvent; (2) adding diacid dichloride to a solution obtained in the step (1) and reacting the diamine with the diacid dichloride so as to generate polyamide; and (3) adding a trapping reagent capable of trapping hydrochloric acid.
Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2015-10-02
A cover member includes a base material having a film shape and containing an amorphous aromatic polyamide. Further, it is preferred that the aromatic polyamide contains a carboxyl group. Furthermore, it is preferred that the aromatic polyamide contains a rigid structure in an amount of 85 mol % or more. Moreover, it is preferred that a tensile elastic modulus of the base material is 4 GPa or more. This makes it possible to provide a cover member having a good flatness keeping property and excellent long-term durability, and an electronic device provided with such a cover member and having excellent reliability.
Akron Polymer Systems, Inc. and Sumitomo Bakelite | Date: 2015-09-09
The present disclosure, in one aspect, relates to a polyamide solution which can suppress the yellowness. The present disclosure, in one or a plurality of embodiments, relates to a polyamide solution comprising an aromatic polyamide and a solvent, the aromatic polyamide comprising a constitutional unit having one or more free carboxyl groups and having an aromatic ring structure and an alicyclic structure in the main chain. Further, the present disclosure, in one aspect, relates to a laminated composite material, comprising a glass plate and a polyamide resin layer; the polyamide resin layer laminated onto one surface of the glass plate, the polyamide resin layer having yellowness (JIS K7373) of 2.4 or less; and the polyamide resin layer obtained by applying the solution onto the glass plate.