AIXTRON SE is a German-based technology company, which specialises in manufacturing metalorganic chemical vapour deposition equipment, for clients in the semiconductor industry. The company's shares are listed on the Frankfurt Stock Exchange with ADRs on the NASDAQ, and it is a constituent of the TecDAX index. Wikipedia.
Agency: Cordis | Branch: H2020 | Program: MSCA-ITN-ETN | Phase: MSCA-ITN-2015-ETN | Award Amount: 3.72M | Year: 2015
Artificial lighting is a global and growing industry. New forms of efficient solid state lighting (SSL) in particular are rapidly gaining a market share. New OLED technologies (Organic Light Emitting Diode) can revolutionise this industry as they have done in displays because of their potential flexible structure, infinite tailoring of their properties, efficiency and high colour quality. Industrial forecasts predict that the OLED lighting market will grow from $200 million in 2015 to $1.7 billion by 2020. In order to fully benefit from this huge market potential, Europe`s academia and industry are eager to develop new technologies and recruit highly qualified staff. The high demand for OLED SSL lighting however will place drastic demands on the use of very expensive and rare iridium. EXCILIGHT aims to explore exciplex emitters and thermally activated delayed fluorescence (TADF) in OLEDs that will enable us to replace Ir complexes whilst retaining ultrahigh efficiency and giving many new possibilities to simplify OLED design, helping to reduce costs and increase yields of production. Our network will train 15 Early Stage Researchers (ESRs) in the development and application of exciplex and TADF emitters, who can apply their expertise directly in future positions. EXCILIGHT is characterised by an innovative multidisciplinary approach, based on i) a combination of synthesis, physical characterisation and development of devices with the lighting industry, ii) an appropriate balance between research and transferable skills training, and iii) a strong contribution from the private sector, including leading industry and SMEs, through mentoring, courses and secondments. EXCILIGHT will positively impact the employability of its ESRs in the OLED industry through scientific and industrial training at the local and network level. With this approach we aim to train a new generation of scientists at the same time as integrating this exciting new technology into industry.
Aixtron Ag | Date: 2015-04-14
The invention relates to a device into which process gases different from one another can be fed during process steps different from one another and having an exhaust gas line (
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: NMP-20-2014 | Award Amount: 3.26M | Year: 2015
Heat management is a paramount challenge in many cutting edge technologies, including new GaN electronic technology, turbine thermal coatings, resistive memories, or thermoelectrics. Further progress requires the help of accurate modeling tools that can predict the performance of new complex materials integrated in these increasingly demanding novel devices. However, there is currently no general predictive approach to tackle the complex multiscale modeling of heat flow through such nano and micro-structured systems. The state of the art, our predictive approach ShengBTE.org, currently covers the electronic and atomistic scales, going directly from them to predict the macroscopic thermal conductivity of homogeneous bulk materials, but it does not tackle a mesoscopic structure. This project will extend this predictive approach into the mesoscale, enabling it to fully describe thermal transport from the electronic ab initio level, through the atomistic one, all the way into the mesoscopic structure level, within a single model. The project is a 6 partner effort with complementary fields of expertise, 3 academic and 3 from industry. The widened approach will be validated against an extensive range of test case scenarios, including carefully designed experimental measurements taken during the project. The project will deliver a professional multiscale software permitting, for the first time, the prediction of heat flux through complex structured materials of industrial interest. The performance of the modeling tool will be then demonstrated in an industrial setting, to design a new generation of substrates for power electronics based on innovating layered materials. This project is expected to have large impacts in a wide range of industrial applications, particularly in the rapidly evolving field of GaN based power electronics, and in all new technologies where thermal transport is a key issue.
Agency: Cordis | Branch: FP7 | Program: CP-IP | Phase: NMP.2012.1.4-1 | Award Amount: 11.55M | Year: 2013
The target of the Smartonics project is the development of Pilot lines that will combine smart technologies with smart nanomaterials for the precision synthesis of Organic Electronic (OE) devices. The Smartonics objectives are: 1.Development of smart Nanomaterials for OEs (polymer & small molecule films, plasmonic NPs and super-barriers) by process and computational modeling optimization. 2.Development of smart Technologies (r2r printing and OVPD machines combined with precision sensing & laser tools and processes). 3.Integration of Nanomaterials & Technologies in Pilot lines for precision synthesis of Nanomaterials & OE devices, optimization, demonstration and evaluation for Industrial applications. Smartonics will develop three Pilot lines: a) OVPD Pilot line equipped with in-line optical sensing tools, b) r2r printing Pilot line, which will combine optical sensing and laser processing tools, and c) s2s Pilot line for the precision fabrication of OE devices (e.g. OLEDs, sensors from state-of-the-art Nanomaterials) and for the evaluation of encapsulation of these devices. The above will be up-scaled in Industrial processes. More specifically: - The parameters for small molecule OPVs will be up-scaled to Industrial scale OVPD machine. - The process parameters for r2r OPVs will be up-scaled and demonstrated in r2r printing machines. - The advances and precision in the synthesis of nanomaterials by the optical sensing tool will be evaluated for flexible displays. - The advances for the r2r printing process will be evaluated for large-scale production of OPVs. - The flexible OPVs will be validated and implemented in automotives applications. All the above are consistent with the topic NMP.2012.1.4-1 since the the targets of project are including the development of Pilot lines that will be combined with production machines (gas (transport and printing), precision and fabrication tools and processes for the precision synthesis of Nanomaterials and OEs.
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: ICT-25-2015 | Award Amount: 4.00M | Year: 2016
Our modern society has gained enormously from novel miniaturized microelectronic products with enhanced functionality at ever decreasing cost. However, as size goes down, interconnects become major bottlenecks irrespective of the application domain. CONNECT proposes innovations in novel interconnect architectures to enable future CMOS scaling by integration of metal-doped or metal-filled Carbon Nanotube (CNT) composite. To achieve the above, CONNECT aspires to develop fabrication techniques and processes to sustain reliable CNTs for on-chip interconnects. Also challenges of transferring the process into the semiconductor industry and CMOS compatibility will be addressed. CONNECT will investigate ultra-fine CNT lines and metal-CNT composite material for addressing the most imminent high power consumption and electromigration issues of current state-of-the-art copper interconnects. Demonstrators will be developed to show significantly improved electrical resistivity (up to 10Ohmcm for individual doped CNT lines), ampacity (up to 108A/cm2 for CNT bundles), thermal and electromigration properties compared to state-of-the-art approaches with conventional copper interconnects. Additionally, CONNECT will develop novel CNT interconnect architectures to explore circuit- and architecture-level performance and energy efficiency. The technologies developed in this project are key for both performance and manufacturability of scaled microelectronics. It will allow increased power density and scaling density of CMOS or CMOS extension and will also be applicable to alternative computing schemes such as neuromorphic computing. The CONNECT consortium has strong links along the value chain from fundamental research to endusers and brings together some of the best research groups in that field in Europe. The realisation of CONNECT will foster the recovery of market shares of the European electronic sector and prepare the industry for future developments of the electronic landscape