AIXTRON SE is a German-based technology company, which specialises in manufacturing metalorganic chemical vapour deposition equipment, for clients in the semiconductor industry. The company's shares are listed on the Frankfurt Stock Exchange with ADRs on the NASDAQ, and it is a constituent of the TecDAX index. Wikipedia.
Agency: Cordis | Branch: FP7 | Program: CPCSA | Phase: ICT-2013.9.9 | Award Amount: 74.61M | Year: 2013
This Flagship aims to take graphene and related layered materials from a state of raw potential to a point where they can revolutionize multiple industries from flexible, wearable and transparent electronics, to new energy applications and novel functional composites.\nOur main scientific and technological objectives in the different tiers of the value chain are to develop material technologies for ICT and beyond, identify new device concepts enabled by graphene and other layered materials, and integrate them to systems that provide new functionalities and open new application areas.\nThese objectives are supported by operative targets to bring together a large core consortium of European academic and industrial partners and to create a highly effective technology transfer highway, allowing industry to rapidly absorb and exploit new discoveries.\nThe Flagship will be aligned with European and national priorities to guarantee its successful long term operation and maximal impact on the national industrial and research communities.\nTogether, the scientific and technological objectives and operative targets will allow us to reach our societal goals: the Flagship will contribute to sustainable development by introducing new energy efficient and environmentally friendly products based on carbon and other abundant, safe and recyclable natural resources, and boost economic growth in Europe by creating new jobs and investment opportunities.
Agency: Cordis | Branch: H2020 | Program: SGA-RIA | Phase: FETFLAGSHIP | Award Amount: 89.00M | Year: 2016
This project is the second in the series of EC-financed parts of the Graphene Flagship. The Graphene Flagship is a 10 year research and innovation endeavour with a total project cost of 1,000,000,000 euros, funded jointly by the European Commission and member states and associated countries. The first part of the Flagship was a 30-month Collaborative Project, Coordination and Support Action (CP-CSA) under the 7th framework program (2013-2016), while this and the following parts are implemented as Core Projects under the Horizon 2020 framework. The mission of the Graphene Flagship is to take graphene and related layered materials from a state of raw potential to a point where they can revolutionise multiple industries. This will bring a new dimension to future technology a faster, thinner, stronger, flexible, and broadband revolution. Our program will put Europe firmly at the heart of the process, with a manifold return on the EU investment, both in terms of technological innovation and economic growth. To realise this vision, we have brought together a larger European consortium with about 150 partners in 23 countries. The partners represent academia, research institutes and industries, which work closely together in 15 technical work packages and five supporting work packages covering the entire value chain from materials to components and systems. As time progresses, the centre of gravity of the Flagship moves towards applications, which is reflected in the increasing importance of the higher - system - levels of the value chain. In this first core project the main focus is on components and initial system level tasks. The first core project is divided into 4 divisions, which in turn comprise 3 to 5 work packages on related topics. A fifth, external division acts as a link to the parts of the Flagship that are funded by the member states and associated countries, or by other funding sources. This creates a collaborative framework for the entire Flagship.
Agency: Cordis | Branch: H2020 | Program: MSCA-ITN-ETN | Phase: MSCA-ITN-2015-ETN | Award Amount: 3.72M | Year: 2015
Artificial lighting is a global and growing industry. New forms of efficient solid state lighting (SSL) in particular are rapidly gaining a market share. New OLED technologies (Organic Light Emitting Diode) can revolutionise this industry as they have done in displays because of their potential flexible structure, infinite tailoring of their properties, efficiency and high colour quality. Industrial forecasts predict that the OLED lighting market will grow from $200 million in 2015 to $1.7 billion by 2020. In order to fully benefit from this huge market potential, Europe`s academia and industry are eager to develop new technologies and recruit highly qualified staff. The high demand for OLED SSL lighting however will place drastic demands on the use of very expensive and rare iridium. EXCILIGHT aims to explore exciplex emitters and thermally activated delayed fluorescence (TADF) in OLEDs that will enable us to replace Ir complexes whilst retaining ultrahigh efficiency and giving many new possibilities to simplify OLED design, helping to reduce costs and increase yields of production. Our network will train 15 Early Stage Researchers (ESRs) in the development and application of exciplex and TADF emitters, who can apply their expertise directly in future positions. EXCILIGHT is characterised by an innovative multidisciplinary approach, based on i) a combination of synthesis, physical characterisation and development of devices with the lighting industry, ii) an appropriate balance between research and transferable skills training, and iii) a strong contribution from the private sector, including leading industry and SMEs, through mentoring, courses and secondments. EXCILIGHT will positively impact the employability of its ESRs in the OLED industry through scientific and industrial training at the local and network level. With this approach we aim to train a new generation of scientists at the same time as integrating this exciting new technology into industry.
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: ICT-29-2014 | Award Amount: 4.36M | Year: 2015
The flexolighting programme is focussed on research and innovations on materials, processes and device technology for OLED lighting with the intention of building a supply chain within Europe. The aim is to realise OLED devices over a large area/surface with high brightness, high uniformity and long life time. A demonstrator will be built and delivered at the end of the project. The main targets are (i). Cost of the lighting panels should be less than Euro 1 per 100 lumens. (II). high luminous efficiency, in excess of 100 lm/W with improved out-coupling efficiency. (ii). white light life-time of at least 1000 hours at 97% of the original luminance of 5000 cdm-2.(iii). The materials and the devices therefrom will allow for differential aging of the colours, thus maintaining the same colour co-ordinates and CRI over its use. (iv). Attention will be paid to recyclability and environmental impact of the materials and the OLED lighting systems. Flexolighting project will also ensure European industrial leadership in lighting. The introduction of OLED Lighting technology is held back by the current cost of the systems, life-time and poor uniformity of luminance on large area panels. The programme aims to combine existing state of the art OLED materials technology (Thermally activated fluorescent materials (TADF) and phosphorescent emitters and world class transport materials) with new developments in processing technologies (Organic Vapour Phase Deposition (OVPD) and printing technologies) to develop new next of generation low cost OLED lighting systems to move forward to scale up and full scale production on novel planarized flexible steel substrates with cost effective conformal encapsulation method. The transparent top contacts made of thin metallic films, conducting polymers or graphene monolayer with metal tracks to reduce the series resistance will be employed in inverted top emitting OLED structures to deliver 100 lumens per Euro.
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: NMP-20-2014 | Award Amount: 3.26M | Year: 2015
Heat management is a paramount challenge in many cutting edge technologies, including new GaN electronic technology, turbine thermal coatings, resistive memories, or thermoelectrics. Further progress requires the help of accurate modeling tools that can predict the performance of new complex materials integrated in these increasingly demanding novel devices. However, there is currently no general predictive approach to tackle the complex multiscale modeling of heat flow through such nano and micro-structured systems. The state of the art, our predictive approach ShengBTE.org, currently covers the electronic and atomistic scales, going directly from them to predict the macroscopic thermal conductivity of homogeneous bulk materials, but it does not tackle a mesoscopic structure. This project will extend this predictive approach into the mesoscale, enabling it to fully describe thermal transport from the electronic ab initio level, through the atomistic one, all the way into the mesoscopic structure level, within a single model. The project is a 6 partner effort with complementary fields of expertise, 3 academic and 3 from industry. The widened approach will be validated against an extensive range of test case scenarios, including carefully designed experimental measurements taken during the project. The project will deliver a professional multiscale software permitting, for the first time, the prediction of heat flux through complex structured materials of industrial interest. The performance of the modeling tool will be then demonstrated in an industrial setting, to design a new generation of substrates for power electronics based on innovating layered materials. This project is expected to have large impacts in a wide range of industrial applications, particularly in the rapidly evolving field of GaN based power electronics, and in all new technologies where thermal transport is a key issue.
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: LCE-02-2014 | Award Amount: 4.95M | Year: 2015
It has been proven that the only realistic path to close the gap between theoretical and practical ultra-high efficiency solar cells is the monolithic multi-junction (MJ) approach, i.e. to stack different materials on top of each other. Each material/sub solar cell converts a specific part of the suns spectrum and thus manages the photons properly. However, large area multi-junction cells are too expensive if applied in standard PV modules. A viable solution to solve the cost issue is to use tiny solar cells in combination with optical concentrating technology, in particular, high concentrating photovoltaics (HCPV), in which the light is concentrated over the solar cells more than 500 times. The combination of ultra-high efficient cells and optical concentration lead to low cost on system level and eventually to low levelised electricity costs, today well below 8 cent/kWh and at the end of this project below 5 cent/kWh. Therefore, to achieve an optimised PV system (high efficiency, low cost and low environmental impact), world-wide well-known partners in the field of CPV technology propose this project to run and progress together the development of highly-efficient MJ solar cells and the improvement of the concentrator (CPV module) technique. The central objective of the project is to realise HCPV solar cells and modules working at a concentration level 800x with world record efficiency of 48 % and 40 %, respectively, hence bringing practical performances closer to theoretical limits. This should be achieved through novel MJ solar cell architectures using advanced materials and processes for better spectral matching as well as through innovative HCPV module concepts with improved optical and interconnection designs, thus including novel light management approaches. The ambition for this project is not less than to achieve the highest efficiencies on solar cell and module level world-wide, thus Europe will be the top player for the CPV-technology.
Agency: Cordis | Branch: H2020 | Program: RIA | Phase: ICT-25-2015 | Award Amount: 4.00M | Year: 2016
Our modern society has gained enormously from novel miniaturized microelectronic products with enhanced functionality at ever decreasing cost. However, as size goes down, interconnects become major bottlenecks irrespective of the application domain. CONNECT proposes innovations in novel interconnect architectures to enable future CMOS scaling by integration of metal-doped or metal-filled Carbon Nanotube (CNT) composite. To achieve the above, CONNECT aspires to develop fabrication techniques and processes to sustain reliable CNTs for on-chip interconnects. Also challenges of transferring the process into the semiconductor industry and CMOS compatibility will be addressed. CONNECT will investigate ultra-fine CNT lines and metal-CNT composite material for addressing the most imminent high power consumption and electromigration issues of current state-of-the-art copper interconnects. Demonstrators will be developed to show significantly improved electrical resistivity (up to 10Ohmcm for individual doped CNT lines), ampacity (up to 108A/cm2 for CNT bundles), thermal and electromigration properties compared to state-of-the-art approaches with conventional copper interconnects. Additionally, CONNECT will develop novel CNT interconnect architectures to explore circuit- and architecture-level performance and energy efficiency. The technologies developed in this project are key for both performance and manufacturability of scaled microelectronics. It will allow increased power density and scaling density of CMOS or CMOS extension and will also be applicable to alternative computing schemes such as neuromorphic computing. The CONNECT consortium has strong links along the value chain from fundamental research to endusers and brings together some of the best research groups in that field in Europe. The realisation of CONNECT will foster the recovery of market shares of the European electronic sector and prepare the industry for future developments of the electronic landscape