Plainview, NY, United States
Plainview, NY, United States

Aeroflex Inc. is an American company which produces test equipment, RF and microwave integrated circuits, components and systems used for wireless communications. Its headquarters are located in Plainview, New York. Wikipedia.


Time filter

Source Type

Grant
Agency: European Commission | Branch: FP7 | Program: CP | Phase: ICT-2013.3.4 | Award Amount: 6.79M | Year: 2013

In the next decade, EU industries developing Critical Real-Time Embedded Systems (CRTES) (safety, mission or business critical) will face a once-in-a-life-time disruptive challenge caused by the transition to multicore processors and the advent of manycores, tantamount to complex networked systems. This challenge brings the opportunity to integrate multiple applications onto the same hardware platform bringing significant advantages in performance, production costs, and reliability. It also brings a severe threat relating to a key problem of CRTES; the need to prove that all temporal constraints will be satisfied during operation. Current CRTES, based on relatively simple singlecore processors, are already extremely difficult to analyse for temporal behaviour, resulting in errors in operation costing EU industry billions each year. The advent of multicore and manycore platforms exacerbates this problem, rendering traditional temporal analysis techniques ineffectual. A new approach is needed.\nThe PROXIMA thesis is that the temporal behaviour of mixed-criticality CRTES executing on multicore and manycore platforms can be analysed effectively via innovative probabilistic techniques. PROXIMA defines new hardware and software architectural paradigms based on the concept of randomisation. It extends this approach across the hardware and software stack ensuring that the risks of temporal pathological cases are reduced to quantifiably small levels. On top of this, PROXIMA builds a comprehensive suite of probabilistic analysis methods integrated into commercial design, development, and verification tools, complemented by appropriate arguments for certification. PROXIMA provides a complete infrastructure; harnessing the full potential of new processor resources, demonstrating and supporting effective temporal analysis, bringing the probabilistic approach to a state of technological readiness, and priming multiple EU industry sectors in its use via a number of case studies.


An integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of thermal expansion of especial utility in conjunction with magnetoresistive random access memory (MRAM) and other devices requiring magnetic shielding.


A connector assembly for joining adjacent ends of insulation tubing, comprising a layer of pressure sensitive transfer adhesive material, said layer of pressure sensitive transfer adhesive material capable of bonding to insulation tubing, whereby when said layer of pressure sensitive transfer adhesive material is positioned between a first section of insulation tubing and a second section of insulation tubing, said layer of pressure sensitive transfer adhesive material bonds to both the first section of insulation tubing and the second section of insulation tubing; and a disposable release liner member adapted to hold said layer of pressure sensitive transfer adhesive material prior to positioning said layer of pressure sensitive transfer adhesive material between the first section of insulation tubing and the second section of insulation tubing.


A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits.


A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits.


A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits.


A connector or adhesive assembly for joining adjacent ends of insulation tubing, comprising a layer of pressure-sensitive transfer adhesive material, said layer of pressure-sensitive transfer adhesive material capable of bonding to insulation tubing, whereby when said layer of pressure-sensitive transfer adhesive material is positioned between a first section of insulation tubing and a second section of insulation tubing, said layer of pressure-sensitive transfer adhesive material bonds to both the first section of insulation tubing and the second section of insulation tubing; and a disposable release liner member adapted to hold said layer of pressure-sensitive transfer adhesive material prior to positioning said layer of pressure-sensitive transfer adhesive material between the first section of insulation tubing and the second section of insulation tubing. Generally, the seam created when the first section of insulation tubing and the second section of insulation tubing are joined is covered with tape.


A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits.


A sample and hold amplifier includes an input node for receiving an input current signal, a non-linear sampling capacitor circuit having an input coupled to the input node, an operational amplifier having a negative input coupled to an output of the non-linear sampling capacitor circuit, a positive input coupled to ground, and an output for providing a sample and hold voltage signal, and a linear capacitor coupled between the negative input and the output of the operational amplifier. The non-linear sampling capacitor includes a non-linear capacitor coupled between an intermediate node and ground, a first switch coupled between the input and the intermediate node configured to switch according to a first phase signal, and a second switch coupled between the output and the intermediate node configured to switch according to a second phase signal.


A regulator circuit includes a voltage regulator having a stability control input and an output for providing a regulated output voltage, an amplifier circuit having an input for receiving an error voltage of the voltage regulator, and an output, and a control circuit having an input coupled to the output of the amplifier and an output coupled to the stability control input of the voltage regulator, such that the regulator stability is maximized while the error voltage is minimized. The voltage regulator includes an LDO voltage regulator, the amplifier circuit includes an operational amplifier circuit, and the control circuit includes a load-sensing or load-replicating circuit.

Loading Aeroflex collaborators
Loading Aeroflex collaborators