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Fukuoka-shi, Japan

Patent
Pmt Corporation and Adwelds Corporation | Date: 2011-04-26

Provided is a technique which can prevent abnormal vibrations from occurring on a resonator and apply, to a putting edge, vibrations with the magnitude of amplitude thereof adjusted in the direction of width of the edge, thereby cutting an object of interest with high accuracy. The resonator (


Patent
Adwelds Corporation and Pmt Corporation | Date: 2014-04-07

A compact pressing body with a pressing surface smaller in area than a welding range welds together sheet-like members over the whole area of the welding range by pressing the sheet-like members being reliably moved in a direction substantially orthogonal to a pressing direction of the pressing body.


Iwanabe K.,Kyushu University | Shuto T.,Kyushu University | Noda K.,Adwelds Co. | Nakai S.,Adwelds Co. | Asano T.,Kyushu University
Proceedings of 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2012 | Year: 2012

Ultrasonic bonding was applied to cone-shaped microbump made of Au on a Si chip to perform bonding at room temperature. Array of cone-shaped microbump having 10 m in diameter and 20μm in pitch was formed on Si using photolithography and electroplating. The counter electrode was a planar electrode which was also made by using electroplating of Au. Bonding was carried out at room temperature under conventional air circumstances. It has been found that bump array whose number is over 10,000 can be electrically connected. Die share tests have revealed that bonding strength can be increased to the strength that bonding at 150°C provides. © 2012 IEEE. Source


Shuto T.,Kyushu University | Iwanabe K.,Kyushu University | Noda K.,Adwelds Co. | Nakai S.,Adwelds Co. | Asano T.,Kyushu University
Japanese Journal of Applied Physics | Year: 2013

This paper reports that room-temperature bonding of LSI chips to metalization on a plastic film made of poly(ethylene naphthalate) (PEN) can be realized by ultrasonic bonding of a cone-shaped microbump made of Au. A 20-m-pitch area array of cone-shaped Au microbumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on Al interconnection. Bonding of 8,800 bump connections with 83.4m/bump has been achieved at room temperature. © 2013 The Japan Society of Applied Physics. Source


Qiu L.,Kyushu University | Ikeda A.,Kyushu University | Noda K.,Adwelds Co. | Nakai S.,Adwelds Co. | Asano T.,Kyushu University
Japanese Journal of Applied Physics | Year: 2013

Room-temperature Cu-Cu bonding was realized by applying ultrasonic vibration together with compression force to the bonding of a cone-shaped bump. The size of the bump was about 10 μm. The connection pitch was 20 m. Mechanical characterization showed that the bonding strength increases with vibration amplitude and depends on the thickness of the counter electrode made of Cu. The thickness dependence of the bonding strength was found to be caused by an increase in the surface roughness of the counter electrode. It was shown that the bonding strength meets the requirement from application to products. Electrical characterization using a daisy-chain connection test demonstrated that more than 10,000 pins on a chip can be connected with a sufficiently low resistance. © 2013 The Japan Society of Applied Physics. Source

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