Alleaume P.-F.,United Monolithic Semiconductors |
Aspemyr L.,Ericsson AB |
Gevorgian S.,Ericsson AB |
Gevorgian S.,Chalmers University of Technology |
And 6 more authors.
IEEE MTT-S International Microwave Symposium Digest | Year: 2010
A highly integrated platform for micro- and mmwave frequency applications is introduced. The platform utilizes heterogeneous process modules with integrated passive and tunable devices together with silicon and GaAs MMIC technology to achieve outstanding flexibility. The different process modules are accounted for and their feasibility is proven through a number of application demonstrators from 23GHz telecom backhauling and 77GHz automotive radar indicating excellent performance. © 2010 IEEE.
Platt D.,Acreo Microelectronics Group |
Pettersson L.,Acreo Microelectronics Group |
Jakonis D.,Acreo Microelectronics Group |
Salter M.,Acreo Microelectronics Group |
Haglund J.,Acreo Microelectronics Group
International Journal of Microwave and Wireless Technologies | Year: 2010
A highly integrated silicon platform (Hi-Mission) for high frequency applications is introduced. This platform utilizes heterogeneous Multi-Chip Module-Deposited (MCM-D) technology with integrated passive devices together with silicon and GaAs Monolithic Microwave Integrated Circuit (MMIC) technology developed for the automotive Ultra Wide Band (UWB) radar (short-range radar) frequency band from 77 to 81GHz. Developments are described in the area of MCM-D process development, MMIC, integrated phased array antenna, module design, and assembly process development. The demonstrator is composed of two test vehicles designed for conducted and radiated measurements, respectively. Test results are presented at the component and module level. Copyright © Cambridge University Press and the European Microwave Association 2010.