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ABB
Zurich, Switzerland

ABB is a multinational corporation headquartered in Zurich, Switzerland, operating mainly in robotics and the power and automation technology areas. It ranked 158th in the Forbes Ranking .ABB is one of the largest engineering companies as well as one of the largest conglomerates in the world. ABB has operations in around 100 countries, with approximately 150,000 employees in November 2013, and reported global revenue of $40 billion for 2011.ABB is traded on the SIX Swiss Exchange in Zürich and the Stockholm Stock Exchange in Sweden since 1999, the New York Stock Exchange in the United States since 2001, September 2005 on London Stock Exchange and in November 2005 on the Frankfurt Stock Exchange. Wikipedia.


Patent
Abb | Date: 2015-01-15

An exemplary power semiconductor clamping stack includes a plurality of power semiconductor components that are arranged in a row along the stacking direction, and a first and second end plate. The row of power semiconductor components is arranged between the first and second end plate and a clamping force is applied to the first and second end plate in order to tension the row of power semiconductor components between the first and second end plate. A clamping force measuring device is arranged between the first end plate and the row of power semiconductor components in order to adjust the clamping force.


A master-IED (Intelligent Electronic Device) is disclosed for high level applications (e.g., in power management or load shedding applications in power generation facilities or in electric power transformation), which can include at least one communication interface supporting MMS client and GOOSE functionality (CI-1, CI-2 . . . CI-n), wherein each is configured as an IED with its own configurable CID-file according to an IEC 61850 requirement. The master-IED specific IEC 61850 configuration tool can handle SCD (Substation Configuration Description)files per a communication interface CI-1.


A module arrangement for power semiconductor devices, including one or more power semiconductor modules, wherein the one or more power semiconductor modules include a substrate with a first surface and a second surface being arranged opposite to the first surface, wherein the substrate is at least partially electrically insulating, wherein a conductive structure is arranged at the first surface of the substrate, wherein at least one power semiconductor device is arranged on the conductive structure and electrically connected thereto, wherein the one or more modules includes an inner volume for receiving the at least one power semiconductor device which volume is hermetically sealed from its surrounding by a module enclosure, wherein the module arrangement includes an arrangement enclosure at least partly defining a volume for receiving the one or more modules, and wherein the arrangement enclosure seals covers the volume.


The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.


Patent
Abb | Date: 2015-01-29

A rotary atomizing head (

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