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Nirasaki, Japan

Koike K.,650 Mitsuzawa | Hara A.,650 Mitsuzawa | Natori S.,650 Mitsuzawa | Yamauchi S.,650 Mitsuzawa | And 3 more authors.
Proceedings of SPIE - The International Society for Optical Engineering | Year: 2016

Gridded design rules[1] is major process in configuring logic circuit used 193-immersion lithography. In the scaling of grid patterning, we can make 10nm order line and space pattern by using multiple patterning techniques such as self-aligned multiple patterning (SAMP) and litho-etch- litho-etch (LELE)[2][3][5]. On the other hand, Line cut process has some error parameters such as pattern defect, placement error, roughness and X-Y CD bias with the decreasing scale. Especially roughness and X-Y CD bias are paid attention because it cause cut error and pattern defect. In this case, we applied some smoothing process to care hole roughness[4]. Each smoothing process showed different effect on X-Y CD bias. In this paper, we will report the pattern controllability comparison of trench and block + inverse. It include X-Y CD bias, roughness and process usability. Furthermore we will discuss optimum method focused on X-Y CD bias when we use additional process such as smoothing and shrink etching. © 2016 SPIE. Source


Yaegshi H.,Tokyo Electron | Oyama K.,650 Mitsuzawa | Yamauchi S.,650 Mitsuzawa | Hara A.,650 Mitsuzawa | And 2 more authors.
Journal of Photopolymer Science and Technology | Year: 2015

One of the most promising techniques for the extension of 193nm immersion lithography must be Self-Aligned Multiple Patterning (SAMP)[1,2,3] at present. We have studied this SAMP from several aspects, which are scaling capability, mitigation of process complexity, pattern fidelity, affordability and so on. On the other hand, Gridded Design Rule (GDR) concept with single directional layout (1D layout) [4] extended the down-scaling with 193-immersion furthermore and relieved the process variation and process complexity, represented in Optical Proximity Effect (OPE), by simplification of layout design. In 1D layout fabrication, key process steps might be edge placement control for grating lines and controllability of hole-shrink technique for line-cutting. This paper introduces current demonstration results on pattern transfer fidelity control and hole-shrink technique as combined with an unique pattern shape repair approach. © 2014SPST. Source

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